JPH0270450U - - Google Patents
Info
- Publication number
- JPH0270450U JPH0270450U JP1988148420U JP14842088U JPH0270450U JP H0270450 U JPH0270450 U JP H0270450U JP 1988148420 U JP1988148420 U JP 1988148420U JP 14842088 U JP14842088 U JP 14842088U JP H0270450 U JPH0270450 U JP H0270450U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- ceramic substrate
- lead frame
- semiconductor element
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
-
- H10W90/756—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148420U JPH0270450U (OSRAM) | 1988-11-16 | 1988-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988148420U JPH0270450U (OSRAM) | 1988-11-16 | 1988-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270450U true JPH0270450U (OSRAM) | 1990-05-29 |
Family
ID=31419731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988148420U Pending JPH0270450U (OSRAM) | 1988-11-16 | 1988-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270450U (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014011435A (ja) * | 2012-07-03 | 2014-01-20 | Nippon Steel & Sumikin Electronics Devices Inc | セラミック複合基板 |
| JP2016174094A (ja) * | 2015-03-17 | 2016-09-29 | 住友電工デバイス・イノベーション株式会社 | 半導体組立体 |
-
1988
- 1988-11-16 JP JP1988148420U patent/JPH0270450U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014011435A (ja) * | 2012-07-03 | 2014-01-20 | Nippon Steel & Sumikin Electronics Devices Inc | セラミック複合基板 |
| JP2016174094A (ja) * | 2015-03-17 | 2016-09-29 | 住友電工デバイス・イノベーション株式会社 | 半導体組立体 |