JPS6277436A - Chromium-aluminum alloy and thin film element using same - Google Patents
Chromium-aluminum alloy and thin film element using sameInfo
- Publication number
- JPS6277436A JPS6277436A JP60218439A JP21843985A JPS6277436A JP S6277436 A JPS6277436 A JP S6277436A JP 60218439 A JP60218439 A JP 60218439A JP 21843985 A JP21843985 A JP 21843985A JP S6277436 A JPS6277436 A JP S6277436A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- chromium
- aluminum alloy
- alloy
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/06—Alloys based on chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Non-Adjustable Resistors (AREA)
- Conductive Materials (AREA)
- Electronic Switches (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、クロム−アルミニウム合金およびそれを用
いた薄膜素子に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chromium-aluminum alloy and a thin film element using the same.
薄膜抵抗器の抵抗薄膜として代表的なニッケルークロム
膜の比抵抗は、セラミック基板上で約２００μΩ・ｃｍ
程度が限度である。従って、この材料を用いて高抵抗値
の素子を形成するには、微細パターン化により抵抗バス
を大きくする必要があるけれども、素子の大きさには規
格等によって制限があり、現実的にはセラミック基板上
にて面積抵抗値はＩＫΩ／口程度が限界となっている。The specific resistance of a nickel-chromium film, which is a typical resistance thin film for thin-film resistors, is approximately 200 μΩ・cm on a ceramic substrate.
The extent is the limit. Therefore, in order to form a high-resistance element using this material, it is necessary to increase the resistance bus through fine patterning, but there are restrictions on the size of the element due to standards, etc., and in reality, ceramic The limit of the sheet resistance value on the substrate is about IKΩ/hole.
しかしながら、今後の素子の小型化、高集積化等を考慮
すると、耐熱性の大きな、かつより高抵抗の材料が要求
されており、この発明はこれに応えんとするものである
。However, in consideration of future miniaturization and higher integration of elements, materials with greater heat resistance and higher resistance are required, and the present invention is intended to meet these demands.
この発明のクロム−アルミニウム合金は、クロム中にア
ルミニウムを１０〜５０重量％含有せしめて成ることを
特徴とする。The chromium-aluminum alloy of the present invention is characterized by containing 10 to 50% by weight of aluminum in chromium.
またこの発明の薄膜素子は、クロム中にアルミニウムを
１０〜５０重量％含有せしめて成るクロム−アルミニウ
ム合金薄膜を基板上に形成して成ることを特徴とする。Further, the thin film element of the present invention is characterized in that a chromium-aluminum alloy thin film containing 10 to 50% by weight of aluminum in chromium is formed on a substrate.
この発明のクロム−アルミニウム合金においては、上記
のような組成域において、従来のニッケルークロム合金
の数倍以上の比抵抗が得られる。In the chromium-aluminum alloy of the present invention, a resistivity several times higher than that of conventional nickel-chromium alloys can be obtained in the above composition range.
また耐熱性も、従来のニッケルークロム合金と同等以上
となる。The heat resistance is also equal to or higher than that of conventional nickel-chromium alloys.
それゆえ、上記のようなりロム−アルミニウム合金を用
いた薄膜素子においては、耐熱性が大きく、しかも小型
化、高集積化に対応することが可能となる。Therefore, a thin film element using a ROM-aluminum alloy as described above has high heat resistance and can be adapted to miniaturization and high integration.
図面は、この発明の一実施例に係るクロム−アルミニウ
ム合金薄膜のアルミニウム含有量に対する比抵抗の変化
を示す特性図であり、比較のために従来のニッケルーク
ロム薄膜のクロム含有量に対する比抵抗の変化を１点鎖
線で示す。この実施例は、真空蒸着により９６％アルミ
ナ基板上にクロム−アルミニウム合金を薄膜として形成
したものであり、その特徴は次のとおりである。The drawing is a characteristic diagram showing the change in resistivity with respect to aluminum content of a chromium-aluminum alloy thin film according to an embodiment of the present invention, and for comparison, it shows the change in resistivity with respect to chromium content of a conventional nickel-chromium thin film. Changes are indicated by dash-dotted lines. In this example, a chromium-aluminum alloy was formed as a thin film on a 96% alumina substrate by vacuum evaporation, and its characteristics are as follows.
■ 図に実線で示すように、クロム中のアルミニウム含
有量が１０〜５０重量％の組成域においては、非常に大
きな比抵抗、例えば図に１点鎖線で示す従来のニッケル
ークロム薄膜の数倍以上の比抵抗を示しており、特にア
ルミニウムの含有量が２０重量％付近では、従来のもの
の約１０倍にも達している。従ってこの合金薄膜によれ
ば、１０にΩ／口程度の面積抵抗値を得ることも可能で
ある。■ As shown by the solid line in the figure, in the composition range where the aluminum content in chromium is 10 to 50% by weight, the resistivity is extremely high, for example several times that of the conventional nickel-chromium thin film shown by the dashed line in the figure. The specific resistance is about 10 times that of the conventional one, especially when the aluminum content is around 20% by weight. Therefore, with this alloy thin film, it is possible to obtain a sheet resistance value of about 10 Ω/hole.
■ 図に破線で示すように、熱処理（５００℃。■ Heat treatment (500℃) as shown by the broken line in the figure.
８時間）後の比抵抗の変化は少なく、即ち大きな耐熱性
を示しており、これは従来のニッケルークロム薄膜と同
等、あるいはそれ以上である。There was little change in resistivity after 8 hours, indicating great heat resistance, which is equivalent to or better than conventional nickel-chromium thin films.
■ 図示しないけれども、膜厚に対する比抵抗の変化は
極めて小さく、例えば、２５０人〜２０００Ａの膜厚領
域での比抵抗はほぼ一定である。(2) Although not shown, the change in specific resistance with respect to film thickness is extremely small, and for example, the specific resistance is almost constant in the film thickness range of 250 to 2000 A.
■ 蒸着材料であるクロム及びアルミニウムは、薄膜用
材料としてごく一般的に用いられており、安価に入手す
ることができる。(2) Chromium and aluminum, which are vapor deposition materials, are very commonly used as thin film materials and can be obtained at low cost.
尚、上記特徴、取り分は上記■、■の特徴は、この発明
に係る合金そのものが示す特徴であり、従って当該合金
は、必ずしも薄膜にすることを要しない。また薄膜にす
る場合でも、薄膜形成手段は上記真空蒸着以外にスパッ
タリング等でもよく、基板も上記アルミナ以外の他のセ
ラミック基板、ガラス基板あるいは半導体基板等でも良
い。Incidentally, the above-mentioned characteristics (1) and (2) are characteristics exhibited by the alloy itself according to the present invention, and therefore, the alloy does not necessarily need to be formed into a thin film. Furthermore, even when forming a thin film, the thin film forming means may be sputtering or the like in addition to the above-mentioned vacuum evaporation, and the substrate may also be a ceramic substrate, a glass substrate, a semiconductor substrate, etc. other than the above-mentioned alumina.
上記のようなりロム−アルミニウム合金の用途は種々考
えられる。例えば、当該合金を薄膜として上述のような
基板上に形成することによって、薄膜抵抗素子、薄膜発
熱素子等の薄膜素子として用いることができる。As mentioned above, ROM-aluminum alloys can be used in various ways. For example, by forming the alloy as a thin film on a substrate as described above, it can be used as a thin film element such as a thin film resistance element or a thin film heating element.
より具体例を示せば、当該合金薄膜を例えば抵抗膜とし
て用いることができ、そのようにすれば耐熱性の大きな
高抵抗素子を安価に作ることができ、今後の素子の小型
化、高集積化への対応が可能となる。また、当該合金薄
膜を、例えばサーマルプリンタヘッドの発熱体として用
いることもでき、そのようにすれば抵抗値が高い分だけ
発熱素子を小型化することが可能となり、これによって
例えば高ドツト密度化への対応も容易となる。To give a more specific example, the alloy thin film can be used, for example, as a resistive film, and in this way, a high resistance element with great heat resistance can be made at low cost, which will lead to the miniaturization and high integration of future elements. It becomes possible to respond to In addition, the alloy thin film can be used as a heating element in a thermal printer head, for example, and in this way, the heating element can be made smaller in proportion to its higher resistance value, which can lead to higher dot densities, for example. It will also be easier to deal with.
以上のようにこの発明に係るクロム−アルミニウム合金
によれば、耐熱性の大きな、かつより高抵抗の材料が安
価に得られる。As described above, according to the chromium-aluminum alloy according to the present invention, a material with high heat resistance and higher resistance can be obtained at low cost.
またこの発明に係る薄膜素子によれば、耐熱性が大きく
、かつ小型化、高集積化等に対応することが可能であり
、しかも安価である。Further, the thin film element according to the present invention has high heat resistance, can be adapted to miniaturization, high integration, etc., and is inexpensive.
図面は、この発明の一実施例に係るクロム−アルミニウ
ム合金薄膜のアルミニウム含有量に対する比抵抗の変化
および従来のニッケルークロム薄膜のクロム含有量に対
する比抵抗の変化を示す特性図である。The drawings are characteristic diagrams showing changes in resistivity with respect to aluminum content of a chromium-aluminum alloy thin film according to an embodiment of the present invention and changes in resistivity with respect to chromium content of a conventional nickel-chromium thin film.
Claims (2)
せしめて成ることを特徴とするクロム−アルミニウム合
金。(1) A chromium-aluminum alloy characterized by containing 10 to 50% by weight of aluminum in chromium.
せしめて成るクロム−アルミニウム合金薄膜を基板上に
形成して成ることを特徴とする薄膜素子。(2) A thin film element comprising a chromium-aluminum alloy thin film containing 10 to 50% by weight of aluminum in chromium on a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60218439A JPS6277436A (en) | 1985-09-30 | 1985-09-30 | Chromium-aluminum alloy and thin film element using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60218439A JPS6277436A (en) | 1985-09-30 | 1985-09-30 | Chromium-aluminum alloy and thin film element using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6277436A true JPS6277436A (en) | 1987-04-09 |
| JPH0457740B2 JPH0457740B2 (en) | 1992-09-14 |
Family
ID=16719929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60218439A Granted JPS6277436A (en) | 1985-09-30 | 1985-09-30 | Chromium-aluminum alloy and thin film element using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6277436A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822379A (en) * | 1981-07-30 | 1983-02-09 | Tama Denki Kogyo Kk | Target for sputtering |
| JPS6024343A (en) * | 1983-07-20 | 1985-02-07 | Taisei Koki Kk | Metallic thin film resistor |
-
1985
- 1985-09-30 JP JP60218439A patent/JPS6277436A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822379A (en) * | 1981-07-30 | 1983-02-09 | Tama Denki Kogyo Kk | Target for sputtering |
| JPS6024343A (en) * | 1983-07-20 | 1985-02-07 | Taisei Koki Kk | Metallic thin film resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457740B2 (en) | 1992-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |