JPS6276542A - Plug-in package and its manufacture - Google Patents
Plug-in package and its manufactureInfo
- Publication number
- JPS6276542A JPS6276542A JP21566885A JP21566885A JPS6276542A JP S6276542 A JPS6276542 A JP S6276542A JP 21566885 A JP21566885 A JP 21566885A JP 21566885 A JP21566885 A JP 21566885A JP S6276542 A JPS6276542 A JP S6276542A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- input
- output pin
- adhesive
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Abstract
Description
【発明の詳細な説明】
（発明の分野）
本発明はプラスチック製基板から成る半導体搭載用プラ
グインパンケージの改良に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of the Invention) The present invention relates to improvements in plug-in pancakes for mounting semiconductors made of plastic substrates.
（従来技術）
従来から知られるプラグインパッケージの例を第１図に
示す。(Prior Art) An example of a conventionally known plug-in package is shown in FIG.
プラグインパッケージ１には複数のアレイ状に配列する
スルーホール２が形成された基板３上に導体パターン４
が形成される。導体パターン４の各々の端部の片方はス
ルーホール２と接続され、他方は基板上に搭載された半
導体素子５と、ワイヤーポンド６によって接続される。The plug-in package 1 has a conductor pattern 4 on a substrate 3 in which a plurality of through holes 2 are formed in an array.
is formed. One end of each of the conductive patterns 4 is connected to the through hole 2, and the other end is connected to the semiconductor element 5 mounted on the substrate by a wire pad 6.
スルーホール２自体は導電処理され、入出力ピン７がス
ルーホール２に嵌装され、ランド部８にて固定される。The through hole 2 itself is subjected to conductive treatment, and the input/output pin 7 is fitted into the through hole 2 and fixed at the land portion 8.
通常、このようなプラグインパッケージに用いられる基
板としてはセラミック製のものがその高信頼性の点から
活用されつつあるが、セラミック自体が跪い、また加工
が困難である、製造上の寸法安定性に劣る、比重が大き
い、高価である等の欠点から、プラスチック製基板が有
望視されている。Generally, ceramic substrates are being used as substrates for such plug-in packages due to their high reliability, but ceramic itself is unstable and difficult to process, resulting in dimensional stability during manufacturing. Plastic substrates are viewed as promising due to drawbacks such as poor performance, high specific gravity, and high cost.
従来、このようなプラグインパッケージにおける入出力
ビンの固定はスルーホールに対し、入出力ピンをかしめ
等の機械的手段によって固定する他、入出力ピンを武人
後ハンダ付、銀ロウ付する等の方法がとられている。基
板がセラミック製の場合、上記の方法のうち、かしめに
よっては基板が破損したりする等の問題が生じていたが
、プラスチック製基板においてはそれ自体柔軟で弾力性
があることを生かし、入出力ピンの嵌入部の一部をスル
ーホール穴径より太くし、圧入することによって固定す
る方法が提案された。Conventionally, the input/output pins in such plug-in packages have been fixed to the through holes by mechanical means such as caulking, or by soldering or silver brazing the input/output pins. A method is being taken. When the board is made of ceramic, there are problems such as damage to the board due to caulking among the above methods, but with a plastic board, it takes advantage of its flexibility and elasticity to handle input/output. A method has been proposed in which a part of the pin fitting part is made thicker than the diameter of the through-hole, and the pin is press-fitted to fix the pin.
しかしながら、このような圧入のみによる固定では強度
が弱いため、ハンダ付、銀ロウ付等によって強度を上げ
ることが考えられるが従来のハンダ付、恨ロウ付による
固定では後工程としてフラックスの洗浄が必要となり製
造工程が煩雑となり、しかもパッケージをマザーボード
にハンダフローで電気的に接合する際に、加熱によりハ
ンダが再溶融して、ビンの揺れ、抜は等が発生し易く、
作業に支障をきたしていた。そのため高融点のハンダを
用いられているがプラスチック製基板においては基板等
に熱劣化を及ぼす恐れがあった。また恨ロウ付による固
定では使用温度が更に高温であるためプラスチック製基
板のパッケージには適用できない。However, the strength of fixing by press-fitting alone is weak, so it is possible to increase the strength by soldering, silver brazing, etc. However, when fixing by conventional soldering or brazing, flux cleaning is required as a post-process. This makes the manufacturing process complicated, and when the package is electrically bonded to the motherboard using solder flow, the solder re-melts due to heating, which can easily cause the bottle to shake or come off.
It was interfering with my work. For this reason, solder with a high melting point is used, but in the case of plastic substrates, there is a risk of thermal deterioration of the substrate. Furthermore, fixing by brazing cannot be applied to packages made of plastic substrates because the operating temperature is even higher.
（発明の概要）
本発明者等は、プラスチック製基板に設けられたスルー
ホールに対し、その嵌入部の一部がスルーホール穴径よ
り太く構成して、ホールに嵌入すると、スルーホールと
入出力ピンとの電気的接続が完璧であることに着目し、
入出力ピンをさらに導電性、絶縁性にかかわらず熱硬化
性接着剤を用いて固定することによって、優れた固定強
度が得られ、しかも製造工程も闇路化される高倍乾性の
安価なプラグインパッケージが得られることを知見した
。(Summary of the Invention) The present inventors have constructed a through hole provided in a plastic substrate so that a part of the fitting part thereof is thicker than the diameter of the through hole, and when the fitting part is inserted into the hole, the through hole is connected to input/output. Focusing on the perfect electrical connection with the pin,
By further fixing the input/output pins using a thermosetting adhesive, whether conductive or insulating, this is a high-drying, inexpensive plug-in that provides excellent fixing strength and also eliminates the manufacturing process. It was discovered that the package can be obtained.
本発明によれば複数個の導電性スルーホールを備えたプ
ラスチック基板と、該基板上に設けられ、該スルーホー
ルと電気的に接続された導体パターンと、スルーホール
穴径よりも太い嵌入部を有し、核嵌入部を該スルーホー
ルに嵌装した入出力ピンを具備したプラグインパッケー
ジにおいて、前記入出力ピンと前記スルーホールおよび
／またはそのランド部を２００℃以下で硬化可能な熱硬
化性接着剤によって接着固定したことを特徴とするプラ
グインパッケージが提供される。According to the present invention, there is provided a plastic substrate having a plurality of conductive through holes, a conductor pattern provided on the substrate and electrically connected to the through holes, and a fitting portion that is thicker than the diameter of the through hole. In a plug-in package equipped with an input/output pin having a core insertion part fitted into the through hole, the input/output pin and the through hole and/or the land thereof are bonded together using a thermosetting adhesive that can be cured at 200°C or less. A plug-in package is provided, which is characterized in that the plug-in package is adhesively fixed with an adhesive.
さらに本発明によれば、複数個の導電性スルーホールと
該スルーホールと電気的に接続された導体パターンを有
するプラスチック製基板に対し、スルーホール穴径より
も太い嵌入部を有する人出ノコビンを２００℃以下で硬
化可能な熱硬化性接着剤によって該スルーホールに嵌入
装竹する工程と、該基板を２００℃以下で加熱して前記
接着剤を硬化させ、前記入出力ピンを前記スルーホール
および／またはそのランド部に固定する工程と、を具備
したプラグインパッケージの製造方法が提供される。Further, according to the present invention, a plastic board having a plurality of conductive through holes and a conductive pattern electrically connected to the through holes is provided with a sawtooth that has a fitting portion that is thicker than the diameter of the through hole. A step of fitting the through hole with a thermosetting adhesive that can be cured at 200° C. or lower, heating the substrate at 200° C. or lower to cure the adhesive, and attaching the input/output pin to the through hole and and/or a step of fixing the plug-in package to the land portion thereof.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
第２図はプラグインパッケージにおける出入力ビンの取
付構造の一例を示す図である。基体３に設けられたスル
ーホール２はその内面には導電処理がなされ、導電膜９
が形成されている。−友人出力ピン７はそのスルーホー
ル２への嵌入部１０の一部がスルーホール穴径よりも太
い構造となし、スルーホール２に嵌装される。この時プ
ラスチック基体の柔軟性によりスルーホール２は変形す
るがこの変形によって入出力ピン７を支持するとともに
スルーホール２と入出力ピン７との電気的接続を確実に
することができる。なお、この例での入出力ピン７は第
２図（ｂ）に示すように嵌入部１０は扁平状を成してい
る。FIG. 2 is a diagram showing an example of the mounting structure of the input/output bin in the plug-in package. The through hole 2 provided in the base 3 has a conductive treatment on its inner surface and a conductive film 9.
is formed. - The friend output pin 7 has a structure in which a part of the part 10 that fits into the through hole 2 is thicker than the diameter of the through hole, and is fitted into the through hole 2. At this time, the through hole 2 is deformed due to the flexibility of the plastic base, but this deformation supports the input/output pin 7 and ensures the electrical connection between the through hole 2 and the input/output pin 7. Note that the input/output pin 7 in this example has a fitting portion 10 in a flat shape as shown in FIG. 2(b).
本発明によれば、人出力ピン７とスルーホール２および
またはそのランド部８とを接着剤によって固定する。According to the present invention, the human output pin 7 and the through hole 2 and/or its land portion 8 are fixed with an adhesive.
本発明によれば、接着剤として、特に熱硬化性接着剤を
用い、しかも、硬化温度が基板の耐熱温度よりも低く、
特に２００ ℃以下、好ましくは１８０℃以下で硬化可
能な熱硬化型接着剤を用いることが掻めて重要である。According to the present invention, a thermosetting adhesive is used as the adhesive, and the curing temperature is lower than the heat resistant temperature of the substrate.
In particular, it is extremely important to use a thermosetting adhesive that can be cured at temperatures below 200°C, preferably below 180°C.
このような接着剤による入出力ピンの固定によれば、ハ
ンダ固定のようにフラックスを洗浄する必要がな（、し
かも一旦硬化した接着剤は、その後硬化時の温度以上に
加熱されても再溶融することがないため、マザーボード
への接合に際してもピンの揺れ、抜は等は発生すること
はない。By fixing the input/output pins with this kind of adhesive, there is no need to clean the flux like with soldering (in addition, once the adhesive has hardened, it will not remelt even if it is heated above the temperature at which it hardens). Therefore, there will be no pin shaking or disconnection when bonding to the motherboard.
熱硬化型接着剤の硬化可能な温度即ち、硬化最低温度が
２００℃を超えると、入出力ビンの固定時、基体を２０
０℃を超える温度にさらすため、加熱によってプラスチ
ック製基板が変形等を生じ易く、基板上の導体パターン
の基板への接着強度劣化、または導体パターン自体の酸
化劣化あるいは、導体パターン上に形成されたレジスト
等が劣化、変色し易いため、高信頼性が要求されるパッ
ケージとしては好ましくない。なお、この接着剤は取扱
い、作業性の点から、硬化最低温度が５０℃以上である
ことが望ましい。If the temperature at which the thermosetting adhesive can be cured, that is, the minimum curing temperature, exceeds 200°C, the substrate may be
Because it is exposed to temperatures exceeding 0°C, the plastic substrate is likely to be deformed by heating, resulting in deterioration of the adhesion strength of the conductor pattern on the substrate to the substrate, oxidation deterioration of the conductor pattern itself, or deterioration of the conductor pattern formed on the conductor pattern. Since the resist etc. are easily deteriorated and discolored, it is not preferable for a package that requires high reliability. Note that, from the viewpoint of handling and workability, it is desirable that the minimum curing temperature of this adhesive is 50° C. or higher.
本発明において用いられる熱硬化性接着剤としてはエポ
キシ樹脂、フェノール樹脂、アクリル樹脂、ポリエステ
ル樹脂、アルキッド樹脂、ウレタン樹脂、シリコン樹脂
、その他多くの熱硬化性樹脂を主成分をするものであっ
て、硬化前は低分子量の中間体また低重合度のプレポリ
マーとして存在し、硬化剤もしくは重合開始剤の存在で
熱を加えることにより重合反応が起こり硬化する。The thermosetting adhesives used in the present invention include epoxy resins, phenolic resins, acrylic resins, polyester resins, alkyd resins, urethane resins, silicone resins, and many other thermosetting resins as main components. Before curing, it exists as a low molecular weight intermediate or a low degree of polymerization prepolymer, and when heat is applied in the presence of a curing agent or polymerization initiator, a polymerization reaction occurs and it is cured.
タイプとしては一液型もしくは二液型があるがいずれで
も使用することができる。There are one-component type and two-component type, but either type can be used.
また、接着剤はそれ自体絶縁性のものがほとんどである
が接着剤中に銀粉等の導電剤を配合した導電性接着剤が
ある。Furthermore, although most adhesives themselves are insulating, there are conductive adhesives that contain a conductive agent such as silver powder.
本発明においては、入出力ビンとスルーホールとの電気
的接続が入出力ビンを圧入するのみで十分であるため、
いずれの接着剤でも使用可能であるが、導電性接着剤の
うち銀、ニッケル等を含む場合、マイグレーションによ
って隣接する入出力ピン同士がリークする等の弊害が起
こる他、導電性接着剤自体絶縁性のものと比較して極め
て高価であることから、絶縁性もしくは半導電性の熱硬
化性接着剤をもちいるのが望ましい。In the present invention, since it is sufficient to electrically connect the input/output bin and the through hole by simply press-fitting the input/output bin,
Any adhesive can be used, but if the conductive adhesive contains silver, nickel, etc., problems such as leakage between adjacent input/output pins may occur due to migration, and the conductive adhesive itself is insulating. It is desirable to use an insulating or semiconductive thermosetting adhesive because it is extremely expensive compared to other adhesives.
本発明において好適に使用される熱硬化型接着剤として
は下記に示すものが挙げられる。Thermosetting adhesives preferably used in the present invention include those shown below.
商品名 タイプ 粘度（Ｐ）ＣＲＭ−１
１０５（、住友ベークライト）−成型 ３００ＥＣＲ−
９００５Ｋ （） 〃２２０ＸＮ−１２７８
（長瀬チハ ）＝ １３００ＸＮ−１２４
４（） 〃１５００
ＡＨ−３０２１ＷＨ（） ／／、 ２３００プラ
スチツク製基板は、エポキシ樹脂、フェノール樹脂、ポ
リイミド樹脂、変性トリアジン樹脂等の樹脂基板中にガ
ラス繊維、祇等を配合し強化した複合基板が主流であり
、最も代表的なものにガラス−エポキシ樹脂、通称ガラ
エボ基板がある。Product name Type Viscosity (P) CRM-1
105 (Sumitomo Bakelite) - Molding 300ECR -
9005K () 〃220XN-1278
(Nagase Chiha) = 1300XN-124
4() 〃1500 AH-3021WH() //, 2300 Plastic substrate is a composite substrate made of a resin substrate such as epoxy resin, phenol resin, polyimide resin, modified triazine resin, etc., which is reinforced by blending glass fiber, etc. The mainstream and most representative one is glass-epoxy resin, commonly known as glass-epoxy resin.
これらの基板は通常、両面に与体パターンの基礎となる
銅張りが施しである。These substrates typically have a copper cladding on both sides that provides the basis for the donor pattern.
本発明においてプラグインパッケージの製造方法として
は入出力ビンの接着以外は公知の手段によって行うこと
ができる。例えば、所望のプラス千ツク基板に対し、ス
ルーホールおよびザグリ加工を施した後、メッキ後、エ
ツチングして導体パターンを形成し、熱硬化性あるいは
感光性ＵＶフィルムにてレジストを形成する。その後、
入出力ビンをスルーホールに接着固定する。In the present invention, the plug-in package can be manufactured by any known means except for adhering the input/output bins. For example, a desired plastic substrate is processed with through holes and counterbores, then plated and etched to form a conductor pattern, and a resist is formed using thermosetting or photosensitive UV film. after that,
Glue and fix the input/output bin to the through hole.
本発明によれば人出力ピンの装着固定はまず前述したよ
うな熱硬化性接着剤によってスルーポールおよび／また
はランド部に装着する。この時接着剤は、スクリーン印
刷によってスルーホールまたはランド部にスクリーン印
刷等の手段によって塗布するか、およびまたは入出力ビ
ンの先端部に塗布して、スルーホールに入出力ビンを嵌
入させて装着すればよい。According to the present invention, the human output pin is first attached to the through pole and/or the land portion using a thermosetting adhesive as described above. At this time, the adhesive can be applied to the through hole or land area by screen printing or other means, or it can be applied to the tip of the input/output bin, and the input/output bin can be fitted into the through hole. Bye.
入出力ビンが装着された基板は次にオーブン等の加熱手
段によって加熱され、入出力ビンはスルーホールに固定
される。この時、接着剤の硬化最低温度よりも高い温度
に設定すれば接着剤の硬化に伴う入出力ビンの固定は可
能ではあるが前述したような理由によって硬化時の加熱
温度は２００℃以下、特に１８０℃以下であることが望
ましい。The board on which the input/output bins are attached is then heated by heating means such as an oven, and the input/output bins are fixed in the through holes. At this time, it is possible to fix the input/output bin as the adhesive hardens by setting the temperature higher than the minimum curing temperature of the adhesive, but for the reasons mentioned above, the heating temperature during curing should not exceed 200°C, especially The temperature is preferably 180°C or lower.
本発明によれば入出力ビンの固定工程終了後、基板を最
終的にフレオン等で洗浄し、脱脂することが望ましい。According to the present invention, after the process of fixing the input/output bin is completed, it is desirable that the substrate be finally cleaned with Freon or the like and degreased.
本発明のプラグインパッケージは上述した形態のものに
限られるものでなく、人出力ビンの嵌入部の形状はその
最長径がスルーホール穴径より大きければいずれでも使
用できる。The plug-in package of the present invention is not limited to the form described above, and any shape of the fitting portion of the human output bin can be used as long as its longest diameter is larger than the diameter of the through-hole.
また、製造方法においても上述の方法にかぎられるもの
でなく、例えば入出力ビンの接続の際の接着剤の塗布に
おいても、場合によっては全面塗布、あるいはホール中
に接着剤を注入する等あらゆる方法を採用し得るもので
ある。In addition, the manufacturing method is not limited to the above-mentioned method; for example, when applying adhesive when connecting input/output bins, there may be various methods such as applying the adhesive to the entire surface or injecting the adhesive into the hole. can be adopted.
以下、本発明を次の例で説明する。The invention will now be explained with the following examples.
実施例
ガラス繊維−エポキシのプラスチック製基板（３３，４
ｍｍ角）に、導体パターンを形成し、さらに導体パター
ン上にレジストを設けた基板のスルーホール周辺に設け
られたランド部にスクリーン印刷によって第１表の接着
剤を塗布し、嵌入部をスルーホール穴径（φ０．５ｍｍ
）より若干太めに扁平した（φ０．５５ｍｍ）コバール
製入出力ビンを第１表に示すそれぞれの硬化条件によっ
て接着剤を硬化させ、接続固定した。Example Glass fiber-epoxy plastic substrate (33,4
A conductor pattern is formed on the board (mm square), and a resist is provided on the conductor pattern.The adhesive shown in Table 1 is applied by screen printing to the land area provided around the through hole of the board, and the inset part is attached to the through hole. Hole diameter (φ0.5mm
) Kovar input/output bins that were slightly thicker and flatter (φ0.55 mm) were connected and fixed by curing the adhesive under the respective curing conditions shown in Table 1.
得られた基板に対し、リード抵抗、およびビン引抜き強
度を調べた。なおリード抵抗は、固定ピン先端から導体
パターンの半導体素子と接続される部位即ち、ポンディ
ングフィンガーまでの抵抗であり、１１００（Ω）以下
を○、１００〜１１０００（Ω）を△、１１０００（Ω
）以上をＸ印として示した。The resulting substrate was examined for lead resistance and bottle pull-out strength. The lead resistance is the resistance from the tip of the fixed pin to the part of the conductive pattern connected to the semiconductor element, that is, the bonding finger. 1100 (Ω) or less is ○, 100 to 11000 (Ω) is △, 11000 (Ω)
) The above is shown as an X mark.
測定結果は、第１表に示した。The measurement results are shown in Table 1.
なお、階６としてスルーホール穴径より小さいスルーホ
ールを用いて第１表の硬化条件で接続固定した。In addition, connection and fixation were carried out under the curing conditions shown in Table 1 using a through hole smaller than the diameter of the through hole as the floor 6.
第１表から明らかなように、本発明の試料（漸１−Ｔｈ
４）はいずれもリード抵抗が低く、ビン川辺強度も高い
ものであったが硬化／晶度２００℃を超えるあたりから
レジストの変色が表れ比較例として示す隘５のように硬
化温度が２５０℃ではレジストがかなり変色し、しかも
引抜強度も低下した。As is clear from Table 1, the sample of the present invention (gradually 1-Th
4) all had low lead resistance and high bottle-side strength, but when the curing/crystallinity exceeded 200°C, the resist began to discolor, and as shown in No. 5 shown as a comparative example, when the curing temperature was 250°C. The resist was considerably discolored and its pull-out strength was also reduced.
また入出力ピンの太さがスルーホール径より小さいもの
は、リード抵抗高にバラツキがあり、ピン引抜強度も本
発明に比較して低いものであった。In addition, when the thickness of the input/output pin was smaller than the diameter of the through hole, the lead resistance height varied and the pin pullout strength was lower than that of the present invention.
（発明の効果）
本発明によればプラグインパッケージの入出力ピンの固
定を熱硬化性接着剤を用いて行うことにより、優れた固
定強度が得られるとともに製造工程上ハンダ固定のよう
なフランクス洗浄工程を省略できる他、接着剤の再溶融
が起きないことにより、バ・ンケージをマザーボードへ
装着する際にも入出力ピンの揺れ、抜は等が発生しない
ため、作業性に優れ、しかも高信頼性で安価なプラグイ
ンパッケージが得られる。(Effects of the Invention) According to the present invention, by fixing the input/output pins of the plug-in package using a thermosetting adhesive, excellent fixing strength can be obtained, and Franks cleaning, such as soldering, can be achieved during the manufacturing process. In addition to omitting the process, since the adhesive does not re-melt, the input/output pins do not shake or come out when attaching the bankage to the motherboard, resulting in excellent workability and high reliability. You can get a cheap plug-in package.
第１図はプラグインパッケージの一例を示す図であり、
第２図（ａ）は、本発明における人出力ピンの取付は構
造を示す図であり、第２図（ｂ）はその入出力ピンの平
面図である。
１・・・プラグインパッケージ
２・・・スルーホール
３・・・プラスチック基ヰ反Figure 1 is a diagram showing an example of a plug-in package.
FIG. 2(a) is a diagram showing the mounting structure of the human output pin in the present invention, and FIG. 2(b) is a plan view of the input/output pin. 1...Plug-in package 2...Through hole 3...Plastic base material
Claims (2)
ク基板と、該基板上に設けられ、該スルーホールと電気
的に接続された導体パターンと、スルーホール穴径より
も太い嵌入部を有し、該嵌入部を該スルーホールに嵌装
した入出力ピンを具備したプラグインパッケージにおい
て、 前記入出力ピンと前記スルーホールおよび／またはその
ランド部を２００℃以下で硬化可能な熱硬化性接着剤に
よって接着固定したことを特徴とするプラグインパッケ
ージ。(1) A plastic substrate with a plurality of conductive through holes, a conductor pattern provided on the substrate and electrically connected to the through holes, and a fitting part that is thicker than the diameter of the through hole. , in a plug-in package equipped with an input/output pin with the fitting portion fitted into the through hole, the input/output pin, the through hole and/or its land portion are bonded together with a thermosetting adhesive that can be cured at 200° C. or below. A plug-in package characterized by being fixed with adhesive.
と電気的に接続された導体パターンを有するプラスチッ
ク製基板に対し、スルーホール穴径よりも太い嵌入部を
有する入出力ピンを２００℃以下で硬化可能な熱硬化性
接着剤によって該スルーホールに嵌装する工程と、該基
板を２００℃以下で加熱して前記接着剤を硬化させ、前
記入出力ピンを前記スルーホールおよび／またはそのラ
ンド部に固定する工程と、 を具備したプラグインパッケージの製造方法。(2) For a plastic board with multiple conductive through-holes and a conductor pattern electrically connected to the through-holes, input/output pins with insertion parts that are thicker than the diameter of the through-holes must be heated at temperatures below 200°C. a step of fitting the input/output pin into the through hole with a thermosetting adhesive that can be cured at 200° C., heating the substrate at 200° C. or less to harden the adhesive, and attaching the input/output pin to the through hole and/or its land. A method of manufacturing a plug-in package, which includes a process of fixing it to a part, and a method of manufacturing a plug-in package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21566885A JPS6276542A (en) | 1985-09-27 | 1985-09-27 | Plug-in package and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21566885A JPS6276542A (en) | 1985-09-27 | 1985-09-27 | Plug-in package and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6276542A true JPS6276542A (en) | 1987-04-08 |
Family
ID=16676190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21566885A Pending JPS6276542A (en) | 1985-09-27 | 1985-09-27 | Plug-in package and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6276542A (en) |
-
1985
- 1985-09-27 JP JP21566885A patent/JPS6276542A/en active Pending
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