JPS6274338U - - Google Patents
Info
- Publication number
- JPS6274338U JPS6274338U JP16777685U JP16777685U JPS6274338U JP S6274338 U JPS6274338 U JP S6274338U JP 16777685 U JP16777685 U JP 16777685U JP 16777685 U JP16777685 U JP 16777685U JP S6274338 U JPS6274338 U JP S6274338U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating tank
- semiconductor
- rotating blade
- vortex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16777685U JPS6274338U (de) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16777685U JPS6274338U (de) | 1985-10-29 | 1985-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6274338U true JPS6274338U (de) | 1987-05-13 |
Family
ID=31100025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16777685U Pending JPS6274338U (de) | 1985-10-29 | 1985-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6274338U (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01128548A (ja) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | メッキ装置 |
JP2006028629A (ja) * | 2004-07-21 | 2006-02-02 | Electroplating Eng Of Japan Co | めっき方法及びめっき装置 |
JP2012126966A (ja) * | 2010-12-16 | 2012-07-05 | Mitomo Semicon Engineering Kk | カップ型めっき装置及びめっき方法 |
-
1985
- 1985-10-29 JP JP16777685U patent/JPS6274338U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01128548A (ja) * | 1987-11-13 | 1989-05-22 | Fujitsu Ltd | メッキ装置 |
JP2006028629A (ja) * | 2004-07-21 | 2006-02-02 | Electroplating Eng Of Japan Co | めっき方法及びめっき装置 |
JP2012126966A (ja) * | 2010-12-16 | 2012-07-05 | Mitomo Semicon Engineering Kk | カップ型めっき装置及びめっき方法 |
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