JPS6273541U - - Google Patents

Info

Publication number
JPS6273541U
JPS6273541U JP1985164215U JP16421585U JPS6273541U JP S6273541 U JPS6273541 U JP S6273541U JP 1985164215 U JP1985164215 U JP 1985164215U JP 16421585 U JP16421585 U JP 16421585U JP S6273541 U JPS6273541 U JP S6273541U
Authority
JP
Japan
Prior art keywords
substrate
removing organic
ozone
utility
organic matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985164215U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985164215U priority Critical patent/JPH0533006Y2/ja
Priority to US06/919,226 priority patent/US4756047A/en
Publication of JPS6273541U publication Critical patent/JPS6273541U/ja
Application granted granted Critical
Publication of JPH0533006Y2 publication Critical patent/JPH0533006Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1985164215U 1985-10-28 1985-10-28 Expired - Lifetime JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985164215U JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-10-28 1985-10-28
US06/919,226 US4756047A (en) 1985-10-28 1986-10-15 Apparatus for removing organic substance from substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985164215U JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-10-28 1985-10-28

Publications (2)

Publication Number Publication Date
JPS6273541U true JPS6273541U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-05-11
JPH0533006Y2 JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-08-23

Family

ID=15788852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985164215U Expired - Lifetime JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1985-10-28 1985-10-28

Country Status (2)

Country Link
US (1) US4756047A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287926A (ja) * 1988-05-13 1989-11-20 Teru Kyushu Kk アッシング装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109674A (ja) * 1991-10-18 1993-04-30 Ushio Inc レジスト膜の灰化方法と灰化装置
US6017397A (en) * 1993-03-05 2000-01-25 Hyundai Eletronics America Automated washing method
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
WO1995007152A1 (en) * 1993-09-08 1995-03-16 Uvtech Systems, Inc. Surface processing
TW260806B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1993-11-26 1995-10-21 Ushio Electric Inc
US6015503A (en) * 1994-06-14 2000-01-18 Fsi International, Inc. Method and apparatus for surface conditioning
US5580421A (en) * 1994-06-14 1996-12-03 Fsi International Apparatus for surface conditioning
US5931721A (en) 1994-11-07 1999-08-03 Sumitomo Heavy Industries, Ltd. Aerosol surface processing
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface
US7025831B1 (en) 1995-12-21 2006-04-11 Fsi International, Inc. Apparatus for surface conditioning
US6165273A (en) * 1997-10-21 2000-12-26 Fsi International Inc. Equipment for UV wafer heating and photochemistry
US6465374B1 (en) 1997-10-21 2002-10-15 Fsi International, Inc. Method of surface preparation
US6589353B1 (en) 1999-05-26 2003-07-08 Seagate Technology Llc Treatment of air-bearing surface of a disc drive slider with light and oxidizing gas
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof
JPS59161828A (ja) * 1983-03-07 1984-09-12 Hitachi Micro Comput Eng Ltd 反応装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4407406A (en) * 1981-10-26 1983-10-04 Western Electric Company, Incorporated Walking beam mechanism
US4485519A (en) * 1982-05-24 1984-12-04 Carpet Clinic Ltd. Ozone cleaning system
US4483040A (en) * 1982-12-22 1984-11-20 International Business Machines Corporation In-line mask cleaning system
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5220766A (en) * 1975-08-04 1977-02-16 Texas Instruments Inc Method of removing phtoresist layer and processing apparatus thereof
JPS59161828A (ja) * 1983-03-07 1984-09-12 Hitachi Micro Comput Eng Ltd 反応装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287926A (ja) * 1988-05-13 1989-11-20 Teru Kyushu Kk アッシング装置

Also Published As

Publication number Publication date
JPH0533006Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-08-23
US4756047A (en) 1988-07-12

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