JPS6271244A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To reduce a plane space as an entire equipment by arranging a conveying-in line and a conveying-out line elevationally in the same plane position. CONSTITUTION:A carrier jig 5 is moved by a conveying-in line 19 toward wire bonders 13A, 13B, and transferred selectively to an Y-direction conveyor 21A by the elevational operations of the Y-direction conveyor 21A of the bonder 13A. The jig 5 is set to the prescribed wire bonding position by an X-direction chute 22A, the prescribed wire bonding is executed by a wire bonding mechanism 24, and the jig is transferred by a Y-direction conveyor 23A to a conveying-out line 20. The jig which is not transferred by the conveyor 21A is transferred by the Y-direction conveyor 21B of the bonder 13B in the downstream side of a conveying-in line 19, a wire bonding is executed n the bonder 13B, and transferred to the line 20. Thus, an exclusive plane space is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an apparatus for manufacturing semiconductor devices, and more particularly to an apparatus for manufacturing semiconductor devices by arranging a plurality of manufacturing apparatuses in parallel.

[Background technology]

Semiconductor device manufacturing equipment, particularly equipment for assembling semiconductor elements into buff cages, includes pellet bonders and wire bonders, but in recent years there has been a demand for higher efficiency in the assembly process of these equipment, and this type of assembly There is a trend towards serialization and automation as well as parallel processing in processes. For example, in the case of a wire bonder, a plurality of wire bonders having substantially the same functions are arranged in parallel, and a semiconductor device to be assembled is transferred to one of these wire bonders by a conveying means, and We aim to improve manufacturing efficiency by performing wire bonding processes in parallel.

By the way, when configuring a manufacturing apparatus with such a parallel processing structure, conventionally a semiconductor element loading line 33 is arranged on the front side of a plurality of (two) wire bonders 31 and 32 as shown in FIG. On the other hand, an unloading line 34 is arranged on the rear side, and the semiconductor device 35 is transferred to each wire bonder 31 or 32 by the loading line 33, and after undergoing a predetermined process there, is discharged to an unloader (not shown) by the unloading line 34. A configuration has been adopted.

Therefore, when considering the exclusive space in the plane direction of the manufacturing equipment, the wire bonders 31, 3 as processing equipment
The installation space of 2 requires space to install both the carry-in line 33 and the carry-out line 34, which is disadvantageous in terms of the layout of manufacturing equipment in a factory or the like. Furthermore, since the carry-out line 34 is disposed on the rear side of the wire bonder, the maintainability of the carry-out line becomes poor, and this leads to a problem in that the reliability of the semiconductor device as a product decreases.

[Purpose of the invention]

An object of the present invention is to provide semiconductor manufacturing equipment that can manufacture semiconductor devices with high reliability by reducing the installation space and improving the maintainability of the manufacturing equipment, especially in manufacturing equipment that has loading and unloading lines. There is a particular thing.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, in a manufacturing equipment configuration in which a plurality of semiconductor manufacturing equipment are installed in parallel and respective loading and unloading lines are arranged therein, the loading line and the unloading line are arranged in the vertical direction in the same plane position. By doing so, it is possible to reduce the plane space of the entire manufacturing equipment and improve the maintainability of each line, thereby increasing the degree of freedom in factory layout and improving the reliability of semiconductor devices. .

〔Example〕

FIG. 1 shows an embodiment of the present invention in which a pellet bonder and a wire bonder are integrated into an integrated apparatus for manufacturing a ceramic package type semiconductor device, and FIG. 2 shows a schematic front view of the structure.

In the figure, this device includes a pellet bonder 11 and two wire bonders 13A and 13 arranged in series downstream of it.
B, a stocker section 12 disposed between the pellet bonder 11 and the wire bonder, and an unloader section 14 disposed immediately after the wire bonder 13B.

The pellet bonder 11 is supplied with a frame 1 as a lead that constitutes a package, a ceramic base 2, and semiconductor element pellets 3 made of silicon or the like on which a predetermined circuit is formed, respectively, from a component supply device (not shown). is,
The frame 1 and the base 2 are assembled by the actuator 15, and the semiconductor element pellet 3 is fixed onto the base 2 by the corent means 16. Further, a carrier jig 5 is supplied to the pellet bonder 11 from a different location not shown, and the semiconductor device 4 assembled as described above is mounted on the carrier jig 5 by a handling mechanism 17. This carrier jig 5 can support a plurality of semiconductor devices 4 in an array in the plane X and Y directions.

A rack 18 is disposed in the stocker section 12, and a plurality of carrier jigs 5 each carrying a semiconductor device 4 can be stored in the rack 18, and the carrier jigs 5 can be temporarily parked therein. can.

The wire bonders 13A and 13B each have a stocker section 12.
A common inlet line 1 consisting of belt means extending from
9, the carrier jig 5 of the stocker section 12 can be transferred to both wire bonders 13A and 13B. Further, a common carry-out line 2o consisting of a belt means extending from both wire bonders 13A, 13B toward the unloader section 14 is provided directly above the carry-in line 19, and each wire bonder 13A, 13B carries out predetermined processing. The carrier jig 5 that has been finished can be transferred to the unloader section 14.

The wire bonders 13A, 13B are connected to Y-direction conveyors 21A, 21B that move the carrier jig 5 on the carry-in line 19 to the bonding station position, and the Y-direction conveyors 21A, 21B.
It has X-direction chutes 22A, 22B that move the carrier jigs of the directional conveyors 21A, 21B in the X direction, and Y-direction conveyors 23A, 23B that return the carrier jigs of the X-direction chutes 22A, 22B to the carry-out line 20. ing. Then, the carrier jig 5 that has been moved to the center position of the X-direction sheet 22, that is, the bonding station position, is now moved to the X-direction sheet 22A, 2
2B, the mounted semiconductor devices 4 are sequentially set at bonding positions, and predetermined wire bonding is performed by a wire bonding mechanism 24 represented by a bonding arm or a bonding tool.

In this case, at least the Y direction conveyor 21A.

21B is configured to be movable in the vertical direction, and the conveyor 21
A and 21B move along the carry-in line 1 as they move up and down.
9 is moved (the carrier jig 5 is selectively transferred onto the conveyors 21A, 21B themselves, and the conveyor 23A
, 23B can transfer all the carrier jigs 5 on itself to the carry-out line 20.

A rack 18 is disposed in the unloader section 14 in the same manner as in the stowage section 12, and the carrier jigs 5 that have undergone the wire bonding process and are transferred through the carry-out line 20 are stored in units of multiple sheets.

According to the above configuration, the frame 1, the base 2, and the semiconductor element pellet 3 are assembled in the pellet bonder 11 to form the unfinished semiconductor device 4, and these are arranged on the carrier jig 5 in the XY direction by the handling mechanism 17. It will be installed. A plurality of carrier jigs 5 are stored in the rack 18 and stopped in the striker 7 force section 12 as necessary.

Next, the carrier jig 5 in the rack 18 is transferred to the carry-in line 1
9 toward the wire bonders 13A and 13B, and during the movement, the carrier jig 5 is selectively transferred to the Y-direction conveyor 21A by the vertical movement of the Y-direction conveyor 21A of the wire bonder 13A. This carrier jig 5 is set at a predetermined wire bonding position by the X direction chute 22A, predetermined wire bonding is performed by the wire bonding mechanism 24, and the Y
It is transferred to the carry-out line 20 by the directional conveyor 23A. Further, the carrier jig that was not transferred by the Y-direction conveyor 21A is transferred by the Y-direction conveyor 21B of the wire bonder 13B downstream of the carry-in line 19, wire bonding is performed at this wire bonder 13B, and the carrier jig is transferred to the carry-out line 20. be done.

The carrier jig 5 moved on the carry-out line 20 is stored in a rack 18 in the unloader section 14, and is subjected to the next process in units of racks.

Therefore, according to this configuration, especially the wire bonder 13
In A and 13B, the carry-in line 19 and the carry-out line 2
0 are arranged above and below at the same plane position, the plane space for arranging each line 19 and 20 is the same as for each line alone, and wire bonders are used for both loading and unloading. Since it is located on the front of the machine, maintenance can be easily performed. This allows for greater flexibility in the installation layout of the entire manufacturing equipment, including wire bonders, within the factory, and also improves the reliability of the semiconductor devices being manufactured by improving the maintainability of each loading and unloading line. can do.

〔effect〕

(1) Since the common carry-in line and carry-out line of the two wire bonders arranged in parallel are arranged vertically at the same plane position, the plane of the equipment is lower than when each line is arranged individually. It is possible to reduce the amount of dedicated space, thereby increasing the freedom of equipment layout in factories and the like.

(2) Since the carry-in line and the carry-out line are arranged vertically in front of the wire bonder, it is possible to improve the maintainability of each line and improve the axial stability of the semiconductor devices being manufactured. .

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in devices other than wire bonders, similar effects can be obtained by arranging a plurality of manufacturing devices in parallel and arranging a common carry-in line and a carry-out line in the vertical direction.

[Application field]

In the above explanation, the invention made by the present inventor has been mainly applied to a field of application, such as a ceramic package type semiconductor device, such as a mohalet bonder, a wire bonder, etc., but the invention is not limited to that company. Rather, the present invention can be applied to semiconductor device manufacturing apparatuses having various configurations and performing various processes.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a schematic front view thereof, and FIG. 3 is a plan configuration diagram of a conventional device. 1...Frame, 2...Base, 3...Semiconductor x
Child pellet, 4... Semiconductor device, 5... Carrier jig, 11... Pellet ponder, 12... Stocker part, 13A. 13B... Wire bonder, 14... Unloader section,
15... actuator, 16... collet means,
17... Handling mechanism, 18... Rack, 19
... Carrying in line, 20... Carrying out line, 2LA, 2
1B...Y direction conveyor, 22A, 22B...X direction chute, 23A, 23B...Y direction conveyor, 2
4...Bonding mechanism. Heh~-no

Claims (1)

[Claims] 1. Semiconductor manufacturing in which a plurality of manufacturing devices are arranged in parallel, and semiconductor devices are carried into and out of the manufacturing devices using a carry-in line and a carry-out line provided in common to these manufacturing devices. 1. A semiconductor manufacturing apparatus, wherein the carry-in line and the carry-out line are arranged in a vertical direction. 2. A semiconductor manufacturing apparatus according to claim 1, wherein the carry-in line and the carry-out line are arranged at the same planar position on the front side of the manufacturing apparatus. 3. Claim 1 in which the manufacturing device is a wire bonder
3. The semiconductor manufacturing apparatus according to item 1 or 2.