JP3163875U - Wafer chip sorter - Google Patents

Abstract

The present invention provides a wafer chip sorting apparatus that improves the working efficiency by reducing the arrangement of a wafer pedestal that supports a wafer, a mounting seat that receives sorted chips, and a chip sorting and moving unit. A loading module includes a wafer pedestal on which a wafer is mounted and a first slider that moves in a horizontal direction, and a moving unit that sorts and transfers wafer chips moves an arm and an arm. The carry-out module 3 is provided with a mounting seat 31 provided with a thin film 321 for receiving a chip selected by the arm 22 and moves horizontally by a slider 33. The selected chips are transferred onto the thin film of the mounting table by moving the wafer pedestal and the mounting table and operating the arm, but the lower side of the thin film is supported by a fixed support. [Selection] Figure 1

Description

  The present invention relates to a wafer chip sorting apparatus, and more particularly to a wafer chip sorting apparatus in which a supporter supports all positions of a thin film and increases a chip arrangement range.

  The electronics industry has been remarkably developed with the advancement of science and technology, but various electronic products are overflowing around due to the mass production of electronic products. In electronic products, various electronic devices or ICs are precisely wired to achieve a predetermined effect. Various electronic devices or ICs are molded by subsequent processing after the wafer is manufactured. In the wafer manufacturing technology, an electronic device or IC is formed on the surface or inside of a wafer, respectively, and the portion occupied by the electronic device or IC is called a chip. Wafers usually have 200 to 300 or thousands of chips, so they are often different in size. After the completion of the wafer, all chips on the wafer are inspected to eliminate defective chips, and the subsequent packaging process is performed only for non-defective chips.

  Refer to FIGS. FIG. 7 is a plan view showing a conventional chip sorting apparatus. FIG. 8 is a side view showing a conventional chip sorting apparatus. As shown in FIGS. 7 and 8, a chip sorting work table A, which is a conventional chip sorting device, includes an entry area A1, a work area A2, and a sorting arm A3. When the completed wafer B is placed in the entry zone A1 and moved to the sorting arm A3 side by the first slider A11, the sorting arm A3 takes out the chip B1 of the wafer B and moves it to the work zone A2. The chip B1 is disposed on the thin film A21 supported by the movable supporter in the work area A2. Thereafter, the work area A2 moves the chip B1 to the outside by the second slider A22.

In the above prior art, since the height of the approach area A1 and the work area A2 is the same, the space that can move relatively is limited, the distance to the sorting arm A3 is fixed, and cannot be adjusted. There were two drawbacks. First, in the entry section A1 of the chip sorting work table A, the wafer B mounted by the first slider A11 is moved to the sorting arm A3 side, and the sorting arm A3 sorts the chip B1. The selected chip B1 is moved onto the thin film A21 in the work area A2. Since the bottom of the thin film A21 is supported by a support device fixed to the second slider A22, when the second slider A22 moves the work area A2, the support device also moves the thin film A21 in conjunction with it. Therefore, the moving range of the thin film A21 is limited, and the place where the chip B1 is disposed is also reduced.

Since the approach area A1 and the work area A2 of the chip sorting work table A have the same height, when the entry area A1 and the work area A2 are moved by the first slider A11 and the second slider A22, respectively, the approach The section A1 and the work section A2 may come into contact with each other, and when the sorting arm A3 sorts the chip B1, the sorting range becomes narrow.

  As described above, in the chip sorting operation, it is a big problem to solve the problem caused by the movable support provided in the work area.

JP 2008-172203 A

A first object of the present invention is to provide a chip sorting apparatus for a wafer in which a supporter supports all positions of a thin film and increases a chip arrangement range.
A second object of the present invention is to provide a chip sorting apparatus for a wafer which has a drop between a wafer pedestal and a mounting seat and does not interfere with the transfer and operation of each other.

To achieve the above object, the present invention provides a wafer chip sorting apparatus. The wafer chip sorting apparatus according to the present invention includes a carry-in module, a moving unit, and a carry-out module. The carry-in module is provided with a wafer pedestal on which a material is previously arranged and a first slider for moving the wafer pedestal. The moving unit is arranged outside the loading module, and is provided with an arm for sorting the material from the wafer pedestal and carrying it to another place and a column for moving the arm. The carry-out module is arranged outside the carry-in module and the moving unit, and is provided with a mounting seat on which the material selected by the arm is arranged. The mounting seat is provided with a mounting base having a thin film on which the material is disposed. The mounting seat is provided with a slider for sliding the mounting base and the thin film on one side. A supporter fixed to the work table is provided at the bottom of the mounting table. Since the supporter does not move with the mounting seat and the mounting base, it supports all positions of the thin film.

In the wafer chip sorting apparatus of the present invention, the wafer base of the loading module, the mounting base of the mounting base, and the thin film are driven by the first first slider and the second slider, respectively, to slide horizontally. Since the support device arranged below the thin film is fixed to the work table and the second slider does not move even if the mounting seat is moved, the thin film can be moved all over the support device. . In addition, since the support fixed to the work table is provided below the mounting table and the thin film of the mounting table, the movement between the mounting table and the wafer table is not hindered, and more arms are provided on the wafer table. It is possible to increase the chip arrangement range on the thin film.

1 is a perspective view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention; 1 is an exploded perspective view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention; 1 is a side view showing a wafer chip sorting apparatus according to an embodiment of the present invention; It is the side view to which the local part of FIG. 3 was expanded. 1 is a plan view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention; FIG. 5 is another plan view showing a wafer chip sorting apparatus according to an embodiment of the present invention; It is a top view which shows the conventional chip sorter. It is a side view which shows the conventional chip sorter.

Embodiments of the present invention will be described below with reference to the drawings.

  Reference is made to FIGS. FIG. 1 is a perspective view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention. FIG. 2 is an exploded perspective view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention. FIG. 3 is a side view showing a wafer chip sorting apparatus according to an embodiment of the present invention. 4 is an enlarged side view of the local portion of FIG. As shown in FIGS. 1 to 4, the wafer chip sorting apparatus according to the present invention includes a carry-in module 1, a moving unit 2, and a carry-out module 3.

  The carry-in module 1 includes a wafer pedestal 11 having a first first slider 12 on the side bottom. The wafer pedestal 11 is slid in the horizontal direction by the vertical rail 121 and the horizontal rail 122 of the first slider 12.

  The moving unit 2 is provided with a movable arm 22 on an inverted L-shaped top side surface. A vacuum sucker 221 is provided on the bottom surface of the end of the arm 22 away from the support column 21.

  The carry-out module 3 is provided with a mounting seat 31 having a mounting base 32. The mounting table 32 is provided with a thin film 321 whose bottom is supported by a supporter 322 on the surface. The mounting seat 31 is provided with a second slider 33 having a vertical rail 331 and a horizontal rail 332 on the side bottom, and slides in the horizontal direction.

  In the chip sorting apparatus of the present invention, the moving unit 2 is arranged on the side of the wafer pedestal 11 of the loading module 1 and the unloading module 3 is arranged on the other side of the loading module 1 and the moving unit 2. There is a support device 322 fixed to the work table at the bottom of the thin film 321 of the mounting table 32 of the carry-out module 3, but the support device 322 does not move with the mounting table 32. The wafer pedestal 11 of the carry-in module 1 and the mounting base 31 of the carry-out module 3 are within the range in which the arm 22 is swung. A wafer 4 (semiconductor wafer 4, LED wafer 4, etc.) is arranged on the wafer pedestal 11, and a plurality of chips are selected from the wafer 4 by the arm 22 and transferred onto the mounting table 32 of the mounting table 31.

  The first slider 12 of the carry-in module 1, the arm 22 of the moving unit 2, and the second slider 33 of the carry-out module 3 are each driven by a control unit (gas or liquid pressure) 5, and the vertical rail of the first slider 12 121, the horizontal rail 122, and the vertical rail 331 and the horizontal rail 332 of the second slider 33 are horizontally moved vertically and horizontally. The wafer pedestal 11 on the first slider 12 and the mounting seat 31 on the second slider 33 are respectively moved to predetermined positions within the swing operation range of the arm 22. A predetermined space is provided between the wafer base 11 of the carry-in module 1 and the mounting base 31 of the carry-out module 3, and the wafer base 11 is disposed below the mounting base 31. The movement space of the wafer pedestal 11 can be further increased by adjusting the movement range (for example, 80 × 80 mm to 120 × 120 mm).

  Reference is made to FIGS. FIG. 5 is a plan view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention. FIG. 6 is another plan view illustrating a wafer chip sorting apparatus according to an embodiment of the present invention. As shown in FIGS. 1, 5, and 6, in the loading module 1 of the present invention, wafers 4 of different sizes are arranged on a wafer base 11. The wafer 4 has a size of 156 to 240 mm. The vertical rail 121 and the horizontal rail 122 of the first slider 12 slide in the horizontal direction, thereby moving the wafer base 11 within the swing range of the arm 22. The chips of the wafer 4 on the wafer pedestal 11 are sucked by the vacuum sucker 221 of the arm 22, moved to the mounting base 32 of the carry-out module 3, and placed on the thin film 321 of the mounting base 32. The mounting base 32 and the thin film 321 slide along with the vertical rail 331 and the horizontal rail 332 of the second slider 33, but the fixed support 322 below the thin film 321 does not move with them. The thin film 321 supported by the fixed supporter 322 is not deformed or damaged even if the arm 22 arranges the chip of the wafer 4. The position of the supporter 322 fixed on the work table does not hinder the movement of the wafer base 11. Depending on the size of the wafer 4 on the wafer pedestal 11, the movement range between the wafer pedestal 11 and the mounting pedestal 31 is appropriately adjusted, and the arm 22 smoothly selects chips from the wafer pedestal 11 and mounts the mounting pedestal 32 on the mounting pedestal 31. Can be moved up.

  Although the present invention discloses preferred embodiments as described above, these are not intended to limit the present invention in any way, and anyone skilled in the art is within the spirit and scope of the present invention. Various changes and modifications can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims of the utility model.

DESCRIPTION OF SYMBOLS 1 Loading module 2 Moving unit 3 Unloading module 4 Wafer 5 Control unit 11 Wafer base 12 Slider 21 Post 22 Arm 31 Mounting base 32 Mounting base 33 Slider 121 Vertical rail 122 Horizontal rail 221 Vacuum sucker 321 Thin film 322 Support device 331 Vertical rail 332 Horizontal rail

Claims (3)

A carry-in module provided with a wafer pedestal on which a wafer in which chips are processed is arranged and a first slider for moving the wafer pedestal;
A moving unit provided outside the carry-in module, and provided with a column having an arm for sorting and transferring chips from the wafer pedestal;
A mounting seat having a thin film that is disposed outside the loading module and the moving unit and has a thin film for transferring and mounting a chip selected by the arm is provided, and the mounting seat is provided with a slider that slides the mounting base on one side. A wafer chip sorter comprising: a carry-out module in which a supporter fixed to a workbench is disposed at the bottom of the mounting table to support the thin film of the mounting seat.   2. The wafer chip sorting apparatus according to claim 1, wherein the wafer disposed on the wafer pedestal of the carry-in module is a semiconductor wafer or an LED wafer.   2. The wafer chip sorting apparatus according to claim 1, wherein a predetermined distance is formed between the wafer base of the carry-in module and the mounting seat of the carry-out module to form a drop.

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