JPS61290728A - Semiconductor manufacture apparatus - Google Patents

Abstract

PURPOSE:To improve the manufacturing efficiency and to automatize the manufacture completely, by transferring carriers on which semiconductor devices are arranged in a plane among various manufacturing process sections so that the semiconductor devices are subjected to manufacturing processes in these sections as they are mounted on the carriers. CONSTITUTION:In a pellet bonder 11, frames 1, bases 2 and semiconductor element pellets 3 are assembled to provide incomplete semiconductor devices 4. These incomplete semiconductor devices 4 are mounted on a carrier 5 by a handling mechanism 17 such that they are arranged on a plane. A plurality of such carriers 5 are received in a rack 18 and the racks 18 are stocked in a stocker 12. The carriers 5 are sequentially taken out of the stocker 12 and transferred onto a belt means 19 to be conveyed toward a wire bonder 13. When a carrier 5 reaches the position B, an X-Y table 22 and a pusher 23 operate to bond wires onto the semiconductor devices 4. The carrier 5 is then returned to the belt means 19 and is conveyed to an unloader 14 where the carrier is received again in the racks 18.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an apparatus for continuously and integrally manufacturing a large number of semiconductor devices, and more particularly to a semiconductor manufacturing apparatus that improves manufacturing efficiency and fully automates manufacturing.

[Background technology]

In the manufacturing process of semiconductor devices, especially in the process of assembling semiconductor element chips onto packages made of ceramic, etc., each semiconductor device is manufactured as an independent component, so it is difficult to completely complete the manufacturing process. is difficult to automate.

In other words, conventional semiconductor manufacturing equipment, such as semiconductor device assembly equipment, is configured to perform the assembly process after placing the semiconductor devices one by one in a predetermined position. When assembling semiconductor devices continuously, multiple semiconductor devices are taken out one by one from a transport jig and transported to a predetermined position in the manufacturing equipment.
Moreover, after assembly is performed here, it is necessary to return the semiconductor device to the jig. Since these jigs are stored in racks or the like in multiple units and moved between each process in units of racks, the transportation of semiconductor devices from one process to the next involves the movement of racks. It will be transported in bulk,
The time lag of transportation between each process is different, making it difficult to process individual semiconductor devices consistently and continuously.

In addition, since conventional semiconductor manufacturing equipment manufactures semiconductor devices individually as described above, there is a loader to take out the semiconductor devices from the jig at each process location, and a loader to take out the semiconductor devices from the jig after the process is completed. An unloader is required to return the semiconductor device to the jig, which increases the complexity and size of the manufacturing equipment, and also increases the cumulative operation time of each of the loader and unloader, resulting in a reduction in semiconductor device manufacturing efficiency.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing apparatus that can continuously and integrally manufacture semiconductor devices that are individually manufactured, and that can perform manufacturing with high efficiency and complete automation.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, in an apparatus that individually manufactures a large number of semiconductor devices through a plurality of consecutive processes, a plurality of manufacturing process parts and a large number of individually manufactured semiconductor devices are arranged on a plane in units of a predetermined number. and a moving means for moving the carrier between the plurality of steps, and each manufacturing step is configured to carry out each manufacturing step with the semiconductor device mounted on the carrier. By doing so, it is possible to at least eliminate the need to load and unload semiconductor devices onto and from carriers, and also eliminate the need for the associated configuration of loaders, unloaders, etc. This makes it possible to carry out continuous integrated manufacturing of semiconductor devices and improve manufacturing efficiency. improvement can be achieved.

〔Example〕

FIG. 1 shows an embodiment in which the present invention is configured as an integrated apparatus of a pellet bonder and a wire bonder for manufacturing a ceramic package type semiconductor device.

In the figure, this device includes a pellet bonder 11, two wire bonders 13 and 13 arranged in series at a downstream position, a force section 12 arranged between them, and an unloader section arranged immediately after the wire bonder 13. It consists of 14.

The pellet bonder 11 is supplied with a frame 1 as a lead that constitutes a package, a ceramic base 2, and semiconductor element pellets 3 made of silicon or the like on which a predetermined circuit is formed, respectively, from a component supply device (not shown). Then, the frame 1 and the base 2 are assembled by the actuator 15, and the semiconductor element pellet 3 is fixed onto the base 2 by the collet means 16. Further, a carrier 5 is supplied to the pellet bonder 11 from a different location not shown, and the semiconductor device 4 assembled as described above is mounted on the carrier 5 by a handling mechanism 17. This carrier 5 is constructed as a frame having a plurality of rows of support grooves 5a as shown in FIG. 2, and a plurality of semiconductor devices 4 are supported in parallel in each groove by support pieces 5b protruding into the support grooves 5a. As a whole, a large number of semiconductor devices can be arranged on the carrier 5 in a plane. Incidentally, when mounting the semiconductor devices 4 on the carrier 5, a predetermined number of semiconductor devices 4 can be hooked onto the hook-shaped tip 17a of the handling mechanism 17, as shown in the figure, and a plurality of semiconductor devices 4 can be mounted at the same time.

A rack 18 is arranged in the stocker section 12, and a rack 18 is arranged in which a plurality of carriers 5 each carrying a semiconductor device 4 are placed in rank 1 for each carrier.
8, and the carrier 5 can be temporarily parked there. Note that the storage mechanism is not shown in the drawings, and details of the stocker section 12 will be described later.

The wire bonders 13, 13 each have a belt means 19 extending from the stocker section 12, and move the carrier 5 of the stocker section 12 toward the unloader section 14. Further, the wire bonders 13, 13 are connected to the bonding arm 20.
．． 20 and a thrust means 21.21 extending between the bonding position B and the belt means 19.
and the carrier 5 on the belt means 19 can be moved to the bonding position B by means of this thrust means 21.21. And at bonding position B,
As shown in FIG. 3, an XY table 22 provided below the wire bonder moves the carrier 5 freely in the plane direction, and a pusher 23 provided directly below position B pushes the semiconductor device 4 that has arrived at position B upward. By raising it, wire bonding can be performed between the semiconductor element pellet 3 and the frame 1 in the same state as when the semiconductor device 4 is mounted on the carrier 5.

A rack 18 is arranged in the unloader section 14 in the same manner as in the stocker section 12, and stores a plurality of carriers 5 that have undergone the wire bonding process. Note that the illustration of the hth storage mechanism is omitted.

According to the above configuration, in the pellet bonder 11, as shown in FIG. As shown in the figure, it is mounted on a carrier 5 in a plane arrangement. In this example, a total of 20 semiconductor devices 4 (5×6) are mounted together. A plurality of carriers 5 are stored in the rack 18 and parked in the stocker section 12.

Next, the carriers 5 in the rack 18 are sequentially pulled out and transferred to the belt means 19, and the wire bonders 13.1
3. During this transportation, the thrust means 21 moves the wires toward the wire bonders 13, 13, respectively. When the carrier 5 reaches the wire bonding position B, the semiconductor device 4 on the carrier 5 is moved by the action of the XY table 22 and the pusher 23 as described above.
are sequentially lifted and wire bonded. When all the wire bonding is completed, the carrier 5 is returned to the belt means 19 and conveyed from there to the unloader section 14. Then, by storing it in the rack 18, the predetermined manufacturing process is completed.

Therefore, according to this manufacturing apparatus, after the semiconductor device 4 has completed the process in the pellet bonder 11, the process from the stocker section 12 to the unloader section 14 is performed while it is mounted on the carrier 4, so that the semiconductor device 4 can be individually separated. Automation of manufacturing can be easily achieved compared to a method in which manufacturing is carried out while conveying the product to a machine. In addition, since the semiconductor devices can be transported in units of 5 carriers and subjected to each process, the semiconductor devices 4 can be transported without time loss by adjusting the time of residence in the stocker section 12, making the manufacturing process more efficient. It is possible to improve the Furthermore,
Eliminates the need for loaders and unloaders at each process location,
The device structure can be simplified.

As shown in FIG. 6, the stocker section 12 has a shelf section 31 that can be moved up and down by a drive section 32 along two guides 30, 30 extending up and down, so that the rack 18 storing the carriers 5 can be moved up and down. It is preferable that the device can be moved up and down integrally while being placed on the shelf portion 31. A plurality of racks 18 can be placed vertically side by side on the shelf section 31,
Depending on the vertical movement height position of the shelf section 31, a desired rack can be supplied to the next stage process. Further, this configuration is effective even when the height positions between the respective process parts of the previous stage and the next stage are different.

Here, various modified configuration examples of the present invention will be explained below.

FIG. 7(A) shows two sets of pellet bonders 11 and two sets of force parts 12 each, and a wire bonder 13 arranged in series with these.
13 are connected. In addition, as shown in the same figure (B), two pellet bonders 11 are provided and these are connected to a common stocker section
It may be configured to connect to 2. Furthermore, pellet bonder 1
It is also possible to provide a plurality of three or more wire bonders 1 and wire bonders 13 and connect them to each other by the transport mechanism 41. At this time, it is preferable that each pellet bonder 11, wire bonder 13, transport mechanism 41, etc. be connected to a computer 40 and centrally managed by this computer 40.

Further, as shown in FIG. 8, the wire bonders 13, 13 may be configured so that the semiconductor devices 4 and carriers 5 can be directly taken in and taken out from the outside, so that the wire bonders 13, 13 can be operated as a single unit.

Furthermore, if an appearance inspection is required after pellet bonding or wire bonding, a stocker section 42 is placed immediately after the wire bonder 13 as shown in FIG. 9(A), and an appearance inspection section 43 is provided after that. Stocker section 44 below
A polyimide resin coating section 45 and the like may be arranged as necessary.

Further, as shown in FIG. 2B, the visual inspection section 46 and the stocker section 47 may be arranged after the pellet bonder 11 and the stocker section 12. In this case, the above-mentioned FIG. 7 (A
), it is also possible to use a configuration in which two pellet bonders 11 and two stocker sections 12 are provided in parallel.

In addition, various arrangements can be easily configured, and furthermore, parts for performing various subsequent manufacturing processes can be integrally assembled at a downstream position to configure a continuous integrated device.

〔effect〕

(1) It has a carrier for arranging a plurality of semiconductor devices to be manufactured on a plane, and a moving means for moving this carrier between each manufacturing process site, and in each manufacturing process site, the semiconductor devices are mounted on the carrier. Since the structure is such that the manufacturing process is performed as is, there is no need to individually move the semiconductor devices and subject them to the manufacturing process, and automation of manufacturing can be achieved.

(2) Since the semiconductor device can be manufactured in each process while being mounted on the carrier, the semiconductor device can be moved between each manufacturing process by simply moving the carrier, and the semiconductor device can be moved individually. Compared to the case where the substrate is moved at a later time, there is a larger allowance in the movement timing, and timing loss between each process can be reduced and manufacturing efficiency can be improved.

(3) Since the semiconductor device can be moved and manufactured while being mounted on the carrier, there is no need to provide a loader or an unloader at each process location, and the device can be simplified.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, various combinations of the number and arrangement of pellet bonders and wire bonders other than those described above may be considered. Furthermore, the number and arrangement position of the stocker section, unloader section, etc. can be changed. Furthermore, the wire bonder may be constructed so that the carrier is directly conveyed to the wire bonder position using belt means without providing a thrust means.

[Application field]

In the above explanation, the invention made by the present inventor is mainly applied to the field of application, which is the field of application, which is the background bonding or wire bonding process of semiconductor devices, but the invention is not limited thereto. , can be applied to various process parts in the manufacturing process of semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is a perspective view of a carrier, FIG. 3 is a sectional view showing a schematic configuration of a wire bonder portion, and FIG. 4 is an unfinished semiconductor device. FIG. 5 is a perspective view of the carrier with semiconductor devices mounted thereon, FIG. 6 is a perspective view of the stocker section, and FIGS. 7 (A), (B), and (C) are plan views of modified configuration examples. Layout diagram, Figure 8 is a plan layout diagram of another modified configuration example, Figure 9 (A),
(B) is a plan layout diagram of yet another modified configuration example. DESCRIPTION OF SYMBOLS 1... Frame, 2... Base, 3... Semiconductor element pellet, 4... Semiconductor device, 5... Carrier,
11... Pellet bonder, 12... Stocker section, 1
3... Wire bonder, 14... Unloader section, 15
...Actuator, 16...Collet, 17...
- Handling mechanism, 18... Rack, 19... Belt means, 20... Bonding arm, 21...
Thrust mechanism, 22...XY table, 23...button, 30...guide, 3rd piece...shelf, 32...
- Drive unit, 40... Computer, 41... Conveyance mechanism, 42... Stocker unit, 43... Visual inspection unit, 4
4... Stocker part, 45... Polytomide resin application part, 46... Visual inspection part, 47... Stocker part, B.
...Bonding position. 2nd figure 7? Figure 3 Figure 4 Figure 5 Figure 6 Figure ♂θ Figure 7 (C)

Claims (1)

[Scope of Claims] 1. An apparatus for individually manufacturing a large number of semiconductor devices through a plurality of consecutive steps, comprising a plurality of manufacturing process parts corresponding to each of the steps, and a device for individually manufacturing the semiconductor devices. It has a carrier that supports a large number of semiconductor devices in a planar arrangement in units of a predetermined number, and a moving means that moves the carrier between the plurality of processes, and at each of the manufacturing process sites, the semiconductor device is moved on the carrier. 1. A semiconductor manufacturing device characterized in that it is configured to perform each manufacturing process while mounted on the semiconductor manufacturing device. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a stocker section is provided between one manufacturing step and the next manufacturing step, and the carriers are temporarily stored in the stocker section. 3. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein at least one of the first manufacturing process and the next manufacturing process is configured into a plurality of lines.