JPS6270542A - 半導体装置用Ｃｕ合金リ−ド素材 - Google Patents

半導体装置用Ｃｕ合金リ−ド素材

Info

Publication number
JPS6270542A
JPS6270542A JP20809785A JP20809785A JPS6270542A JP S6270542 A JPS6270542 A JP S6270542A JP 20809785 A JP20809785 A JP 20809785A JP 20809785 A JP20809785 A JP 20809785A JP S6270542 A JPS6270542 A JP S6270542A
Authority
JP
Japan
Prior art keywords
less
particle size
average particle
following
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20809785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6338414B2 (enrdf_load_stackoverflow
Inventor
Hidetoshi Akutsu
阿久津　英俊
Takuro Iwamura
岩村　卓郎
Masao Kobayashi
正男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP20809785A priority Critical patent/JPS6270542A/ja
Priority to US06/903,514 priority patent/US4749548A/en
Priority to GB8621958A priority patent/GB2181742B/en
Priority to DE19863631119 priority patent/DE3631119A1/de
Publication of JPS6270542A publication Critical patent/JPS6270542A/ja
Priority to US07/166,217 priority patent/US4872048A/en
Publication of JPS6338414B2 publication Critical patent/JPS6338414B2/ja
Priority to GB8907058A priority patent/GB2219473B/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP20809785A 1985-09-13 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS6270542A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP20809785A JPS6270542A (ja) 1985-09-20 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材
US06/903,514 US4749548A (en) 1985-09-13 1986-09-03 Copper alloy lead material for use in semiconductor device
GB8621958A GB2181742B (en) 1985-09-13 1986-09-11 Copper alloy lead material for use in semiconductor device
DE19863631119 DE3631119A1 (de) 1985-09-13 1986-09-12 Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen
US07/166,217 US4872048A (en) 1985-09-13 1988-03-10 Semiconductor device having copper alloy leads
GB8907058A GB2219473B (en) 1985-09-13 1989-03-29 Copper alloy lead material for use in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20809785A JPS6270542A (ja) 1985-09-20 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPS6270542A true JPS6270542A (ja) 1987-04-01
JPS6338414B2 JPS6338414B2 (enrdf_load_stackoverflow) 1988-07-29

Family

ID=16550584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20809785A Granted JPS6270542A (ja) 1985-09-13 1985-09-20 半導体装置用Ｃｕ合金リ−ド素材

Country Status (1)

Country Link
JP (1) JPS6270542A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63247327A (ja) * 1987-04-03 1988-10-14 Kobe Steel Ltd 熱間加工性に優れた電気・電子部品用銅合金
JPH0285330A (ja) * 1988-09-20 1990-03-26 Mitsui Mining & Smelting Co Ltd プレス折り曲げ性の良い銅合金およびその製造方法
WO1999066087A1 (fr) * 1998-06-16 1999-12-23 Mitsubishi Materials Corporation Tube en alliage de cuivre sans joint pour echangeur thermique presentant une limite elastique et une resistance a la fatigue excellentes a 0,2 %

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63247327A (ja) * 1987-04-03 1988-10-14 Kobe Steel Ltd 熱間加工性に優れた電気・電子部品用銅合金
JPH0285330A (ja) * 1988-09-20 1990-03-26 Mitsui Mining & Smelting Co Ltd プレス折り曲げ性の良い銅合金およびその製造方法
WO1999066087A1 (fr) * 1998-06-16 1999-12-23 Mitsubishi Materials Corporation Tube en alliage de cuivre sans joint pour echangeur thermique presentant une limite elastique et une resistance a la fatigue excellentes a 0,2 %

Also Published As

Publication number Publication date
JPS6338414B2 (enrdf_load_stackoverflow) 1988-07-29

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