JPS6267832A - Autoloader for ion-implanting device - Google Patents
Autoloader for ion-implanting deviceInfo
- Publication number
- JPS6267832A JPS6267832A JP20640285A JP20640285A JPS6267832A JP S6267832 A JPS6267832 A JP S6267832A JP 20640285 A JP20640285 A JP 20640285A JP 20640285 A JP20640285 A JP 20640285A JP S6267832 A JPS6267832 A JP S6267832A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- autoloader
- wafers
- ion
- implanting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はウェハカセットからウェハをイオン打込み装置
に装着かつその逆の回収も行うオートローダに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an autoloader for loading wafers from a wafer cassette into an ion implanter and vice versa.
従来のオートローダは、第2図に示すようにモ〜り3に
よりボールねじ4の上下動作とベルト5の動きでウェハ
カセット1からウェハ2を順次取り出し、その後モータ
3及びボールねじ4によってウェハ2がイオン打込み装
fit6に装着されるというものである。また以上の逆
のウェハをウェハカセットに回収する動作も行う。In the conventional autoloader, as shown in FIG. 2, the wafers 2 are sequentially taken out from the wafer cassette 1 by the motor 3 by the vertical movement of the ball screw 4 and the movement of the belt 5, and then the wafers 2 are loaded by the motor 3 and the ball screw 4. It is attached to the ion implantation device FIT6. In addition, the reverse operation of collecting wafers into a wafer cassette is also performed.
本オートローダでは、ウェハ搬送上にカバーはしである
がボールねじ4があり、ウェハ上に異物落下の可能性が
あるという欠点があった。This autoloader has a ball screw 4, which is a cover, over the wafer transport, and has the disadvantage that there is a possibility that foreign matter may fall onto the wafer.
また、本オートローダは非常に大型でオートローダが故
障した場合、オートローダが障害となり、作業者の手動
での作業も困難となる。In addition, this autoloader is very large, and if the autoloader breaks down, the autoloader will become an obstacle, making manual work difficult for the operator.
なお、イオン打込み装置及びウェハのオートローダは電
子材料別冊1984年版「超LSI製造・試験装置」昭
和58年11月15日工業調査会発行頁81〜86に紹
介されている。Incidentally, the ion implantation device and the wafer autoloader are introduced in the 1984 edition of Electronic Materials Special Edition, "Very LSI Manufacturing and Testing Equipment," published by Kogyo Kenkyukai, November 15, 1980, pages 81-86.
本発明の一つの目的は、ウェハ上への異物付着を低減す
る事である。One object of the present invention is to reduce the adhesion of foreign matter onto wafers.
本発明の他の目的はオートローダをコンパクト化し、オ
ートローダが故障しても1作業者の手動での作業の障害
とならずにイオン打込み装置を稼動する事ができるよう
にすることにある。Another object of the present invention is to make the autoloader compact so that even if the autoloader breaks down, the ion implantation apparatus can be operated without interfering with the manual work of one operator.
本発明の一実施例によればウェハ2を最上位置とするウ
ェハを搬送する駆動系が提供されウェハ上への異物落下
が低減された。According to one embodiment of the present invention, a drive system for transporting a wafer with wafer 2 at the uppermost position is provided, thereby reducing foreign matter falling onto the wafer.
(発明の実施例〕 第1図に本発明によるオートローダ7の側面図を示す。(Embodiments of the invention) FIG. 1 shows a side view of an autoloader 7 according to the present invention.
まず、オートローダ7にウェハ2の入ったウェハカセッ
ト1を載せる。その後、ウェハカセット1から順次ウェ
ハ2がウェハリフター9のところに運ばれ、上昇し、こ
の位置で、ウェハ搬送部8にウェハ2の受は渡しが行わ
れる。First, the wafer cassette 1 containing the wafers 2 is placed on the autoloader 7. Thereafter, the wafers 2 are sequentially transported from the wafer cassette 1 to the wafer lifter 9 and raised, and at this position, the wafers 2 are received and transferred to the wafer transport section 8.
この後、ウェハ搬送部8によってウェハ2がイオン打込
み装置6に装着される。Thereafter, the wafer 2 is mounted on the ion implantation device 6 by the wafer transfer section 8.
ウェハ2の回収は上記と逆の動作を行う。To recover the wafer 2, the operation is reverse to that described above.
1、ウェハ上部に駆動部がないため、ウェハ表面上への
異物落下の低減がはかれ1歩留が向上する。1. Since there is no drive unit above the wafer, the amount of foreign matter falling onto the wafer surface is reduced and the yield is improved.
2、コンパクト化が図られ、オートローダが故障した場
合にも作業者が、イオン打込み装置を停止する事なく、
作業ができる。2. It is more compact, and even if the autoloader breaks down, the operator does not have to stop the ion implantation equipment.
I can work.
第1図は本発明によるイオン打込み装置用オートローダ
、第2図は従来のイオン打込み装置用オートローダを示
す側面図である。
1・・・ウェハカセット、2・・・ウェハ、3・・・モ
ータ、4・・・ボールねじ、5・・・ベルト、6・・・
イオン打込み装置、7・・・オートローダ、8・・・ウ
ェハ搬送部、9・・・ウェハリフター。FIG. 1 is a side view showing an autoloader for an ion implantation device according to the present invention, and FIG. 2 is a side view showing a conventional autoloader for an ion implantation device. 1... Wafer cassette, 2... Wafer, 3... Motor, 4... Ball screw, 5... Belt, 6...
Ion implantation device, 7... autoloader, 8... wafer transfer section, 9... wafer lifter.
Claims (1)
ェハ搬送部とを組合せたことを特徴とするイオン打込み
装置用オートローダ。An autoloader for ion implantation equipment characterized by a combination of a wafer cassette raising and lowering function and a wafer transport section that places the wafer in the uppermost position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60206402A JPH0834232B2 (en) | 1985-09-20 | 1985-09-20 | Substrate transfer method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60206402A JPH0834232B2 (en) | 1985-09-20 | 1985-09-20 | Substrate transfer method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6267832A true JPS6267832A (en) | 1987-03-27 |
JPH0834232B2 JPH0834232B2 (en) | 1996-03-29 |
Family
ID=16522762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60206402A Expired - Lifetime JPH0834232B2 (en) | 1985-09-20 | 1985-09-20 | Substrate transfer method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0834232B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0642645U (en) * | 1992-11-17 | 1994-06-07 | 有限会社コンペックス | Partition board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS564244A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Continuous vacuum treatment device for wafer |
JPS5847704A (en) * | 1981-09-11 | 1983-03-19 | Hitachi Ltd | Detaching and conveying device for wafer |
-
1985
- 1985-09-20 JP JP60206402A patent/JPH0834232B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS564244A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Continuous vacuum treatment device for wafer |
JPS5847704A (en) * | 1981-09-11 | 1983-03-19 | Hitachi Ltd | Detaching and conveying device for wafer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0642645U (en) * | 1992-11-17 | 1994-06-07 | 有限会社コンペックス | Partition board |
Also Published As
Publication number | Publication date |
---|---|
JPH0834232B2 (en) | 1996-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |