JPS6267671U

JPS6267671U -

Info

Publication number: JPS6267671U
Application number: JP15973985U
Authority: JP
Priority date: 1985-10-18
Filing date: 1985-10-18
Publication date: 1987-04-27

Description

[Brief explanation of the drawing]

第１図は本考案に係る半田槽装置の概略断面図
、第２Ａ図乃至第２Ｄ図を各々同ワイパーの動き
と、それに伴なう半田の動き及び排出状態を示す
概略断面図、第３図は同ワークの端子に半田付し
ている状態の要部概略正面図、第４図は一般的な
半田付作業を示す概略正面図、第５図は同側面図
、第６図は従来の半田槽装置を示す概略断面図、
第７図は同ワークの端子に半田付している状態の
要部概略正面図、第８図は同側面図である。１０……半田槽、１１……蓋体、１２ａ……小
径の窓孔、１２ｂ……大径の窓孔、１３……半田
、１４……ワイパー。 FIG. 1 is a schematic sectional view of a solder bath device according to the present invention, FIGS. 2A to 2D are schematic sectional views showing the movement of the same wiper, the accompanying movement of solder, and the state of discharge, and FIG. is a schematic front view of the main part soldered to the terminal of the same workpiece, Fig. 4 is a schematic front view showing general soldering work, Fig. 5 is a side view of the same, and Fig. 6 is a conventional soldering process. A schematic sectional view showing a tank device,
FIG. 7 is a schematic front view of the main part in a state where it is soldered to the terminal of the work, and FIG. 8 is a side view of the same. 10...Solder tank, 11...Lid, 12a...Small diameter window hole, 12b...Large diameter window hole, 13...Solder, 14...Wiper.

Claims

[Scope of utility model registration request]

The top opening of the stationary solder tank is closed with a lid body, at least large and small window holes are bored at predetermined intervals in the lid body, and the solder liquid level is raised through the large and small window holes by surface tension. A solder bath device further comprising a wiper that is movable vertically and longitudinally above the lid.