JPS6265429A - ダイボンデイング装置 - Google Patents

ダイボンデイング装置

Info

Publication number
JPS6265429A
JPS6265429A JP20432885A JP20432885A JPS6265429A JP S6265429 A JPS6265429 A JP S6265429A JP 20432885 A JP20432885 A JP 20432885A JP 20432885 A JP20432885 A JP 20432885A JP S6265429 A JPS6265429 A JP S6265429A
Authority
JP
Japan
Prior art keywords
die bonding
semiconductor device
stem
die
bonding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20432885A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519980B2 (enrdf_load_stackoverflow
Inventor
Yukio Yamauchi
山内　幸雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20432885A priority Critical patent/JPS6265429A/ja
Publication of JPS6265429A publication Critical patent/JPS6265429A/ja
Publication of JPH0519980B2 publication Critical patent/JPH0519980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)
JP20432885A 1985-09-18 1985-09-18 ダイボンデイング装置 Granted JPS6265429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20432885A JPS6265429A (ja) 1985-09-18 1985-09-18 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20432885A JPS6265429A (ja) 1985-09-18 1985-09-18 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6265429A true JPS6265429A (ja) 1987-03-24
JPH0519980B2 JPH0519980B2 (enrdf_load_stackoverflow) 1993-03-18

Family

ID=16488670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20432885A Granted JPS6265429A (ja) 1985-09-18 1985-09-18 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6265429A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237793A (ja) * 1988-07-27 1990-02-07 Rohm Co Ltd レーザダイオードチツプの搬送装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58192332A (ja) * 1982-05-06 1983-11-09 Nec Kyushu Ltd 半導体装置の組立装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58192332A (ja) * 1982-05-06 1983-11-09 Nec Kyushu Ltd 半導体装置の組立装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237793A (ja) * 1988-07-27 1990-02-07 Rohm Co Ltd レーザダイオードチツプの搬送装置

Also Published As

Publication number Publication date
JPH0519980B2 (enrdf_load_stackoverflow) 1993-03-18

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