JPS6265393A - Printed circuit board material - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 〔Technical field〕 The present invention relates to printed wiring board materials.

[Background technology]

Printed wiring board materials are used by processing them into printed wiring boards, on which electronic components are mounted. Therefore,
High creeping insulation resistance is required. However, conventional printed wiring board materials made by curing resin impregnated into a base material have low longitudinal insulation resistance and are not of good quality.

Moreover, the beer strength (peel strength) of the metal foil was also low in the case of the metal foil laminated on the surface. [Purpose of the Invention] In view of the above circumstances, the present invention developed a printed wiring board material of high quality. [Disclosure of the Invention] In order to achieve the above object, the inventors have conducted various studies and found that quality is greatly affected by the ratio of water content to resin content. Ta.

Therefore, we thought that if the ratio of water content to resin content was within a certain range, it would be a good quality printed wiring board material, and after conducting various experimental studies, we have here
completed this invention.

That is, the present invention provides a printed wiring board material obtained by curing a resin impregnated into a base material, which has a moisture content of 0.3% or less of the resin content. shall be.

The relationship between the resin content A (wt%) and the water content W (wt%) can be expressed as the following formula (1).

WS 2.003
The hot water layer insulation resistance increases and the quality improves.

It is a necessary condition for good quality that the water content is 0.3% or less of the resin content, but if the resin content is 30% or less,
A preferable condition is 80-t%. 30wt
If it is less than 80wt%, blistering of the base material is likely to occur when curing the resin during manufacturing, and if it is more than 80wt%, when etching is performed when processing this printed wiring board material into a printed wiring board, This is because the warpage is in the direction of 1, when it becomes larger after etching.

The printed wiring board according to the present invention may have a plurality of cured resin-impregnated base materials laminated together, or a metal foil such as copper foil on at least one surface (one or both surfaces) of the hardened resin-impregnated base material. It may be laminated. Instead of the metal foil, a release film may be laminated on at least one surface of the cured resin-impregnated base material. A metal foil may be laminated on one side of the cured resin-impregnated base material and a release film may be laminated on the other side, or a plurality of cured resin-impregnated base materials may be laminated and then a metal foil or a release film may be laminated on one side of the cured resin-impregnated base material. A mold film may be laminated. It may be obtained by a so-called pressureless continuous method in which lamination of a plurality of resin-impregnated base materials and lamination of metal foil or release film are performed at a low pressure of 0 to 50 kg/cm''.

The various printed wiring board materials described above have different forms, but those with a moisture content of 0% of the resin content
．． Since it is 3% or less, the insulation resistance of all hot water layers is high and the quality is good. In particular, when metal foil is laminated on the surface, the beer strength of the metal foil is also increased.

The resin content mentioned above generally represents the weight ratio of the resin to the total weight of the printed wiring board material, but in the case of a board with a metal foil or release film laminated on the surface, the resin content is the weight ratio of the resin to the total weight of the printed wiring board material. It represents the weight ratio of resin to the total weight of something called a substrate.

To obtain a printed wiring board material whose water content is 0.3% or less of the resin content, for example, the absolute humidity is 0.015 kg/
The resin may be impregnated into the base material in an atmosphere of 1 kg or less, and the resin may be cured.

Next, examples of the printed wiring board material according to the present invention will be described together with comparative examples.

(Example 1) In a four-eye flask, 400 parts by weight of polyester resin (YDB-400 manufactured by Tobu Kasei Co., Ltd.) and butadiene-acrylonitrile copolymer liquid rubber (CT manufactured by Ube Industries, Ltd.) were added.
100 parts by weight of BN 1300 After reacting until it becomes .5 or less, 80 parts by weight of methacrylic acid is added, and the
The mixture was reacted at 15° C. for 5 hours to obtain a mixture of rubber-modified vinyl ester and styrene with an acid value of 0.3. 1 wt % of cumene hydroperoxide was added to this mixture, and the resulting resin was applied to seven glass cloth substrates (WE-18-BS manufactured by Nittobo Co., Ltd.) that were continuously supplied with an absolute humidity of 0. It was impregnated continuously in an atmosphere of 0.015 kg/kg, and when it was sufficiently permeated, electrolytic copper foil (TSTO manufactured by Furukawa Circuit Foil Co., Ltd., thickness 18 nm) was laminated on both sides, and it was heated at 100°C for 20 minutes and at 160°C. The material was heated and cured for 20 minutes to obtain a printed wiring board material having a thickness of 1.6 mm.

The moisture content and resin content of this printed wiring board material are:
The values were shown in Table 1.

(Example 2.3 and Comparative Example 1) The absolute humidity in the process of impregnating the base material with resin was set to 0.011k.
g/kg, 0.008kg/kg, 0.02
A printed wiring board material was obtained in the same manner as in Example 1 except that the weight was changed to 3 kg/kg. The water content and resin content of each printed wiring material were the values shown in Table 1, respectively.

Regarding the printed wiring board material obtained above, the presence or absence of IJ4 foil shrinkage wrinkles and voids inside the board was examined, and the hot layer insulation resistance and copper foil beer strength were measured, and the results are shown in Table 1. . The copper foil peel strength was measured in accordance with JIS C6481 5.7, and the hot water layer insulation resistance was measured in accordance with JIS C64.
It was carried out according to 5.11 of 81.

As shown in Table 1, Examples 1 to 3 have higher hot layer insulation resistance and higher copper foil peel strength than Comparative Example 1. Moreover, in Comparative Example 1, there were copper foil shrinkage wrinkles and voids inside the substrate, whereas in Examples 1 to 3, both were absent.

(Example 4) The resin used in Example 1 was continuously supplied to two glass cloth substrates (the same as in Example 1) and a glass paper substrate (EP-40 manufactured by Nippon Vilene Co., Ltd.).
35) Three sheets were impregnated continuously in an atmosphere with an absolute humidity of 0.013 kg/kg, and when it was sufficiently impregnated, electrolytic copper foil (same as in Example 1) was laminated on both sides, and soaked at 20° C.
and heat curing at 160° C. for 20 minutes to obtain a 1.6n thick printed arrangement m+& material of composite construction. The moisture content and resin content of this printed *Fi material were as shown in Table 2.

(Example 5.6 and Comparative Example 2) Absolute humidity in the step of impregnating the base material with resin: 0.01 kg/
kg, 0.007kg/kg, 0.021kg
A printed wiring board material was obtained in exactly the same manner as in Example 4, except that the weight was changed to /kg. The moisture content and resin content of each printed wiring board material were the values shown in Table 2, respectively.

The printed wiring board materials obtained above were subjected to the same measurements as in Examples 1 to 3 and Comparative Example 1, and the results are shown in Table 2.

As shown in Table 2, Examples 4 to 6 of composite configurations
Also, compared to Comparative Example 2, the hot water layer insulation resistance was high and the copper foil beer strength was also high. Moreover, in Comparative Example 2, there were copper foil shrinkage wrinkles and voids inside the substrate, whereas in Examples 4 to 6, both were absent.

(Example 7) Cumene hydroperoxide was added to a mixture of vinyl ester and styrene obtained in the same manner as in Example 1, except that CTBNI 300X8 was not used.
．． 5 wt% and benzoyl peroxide (B, P, 0
．． ) was added at 0.5 wt%.

The resulting resin was impregnated with 12 wt% of melamine resin as a craft base material (HL made by Sanyo Kokusaku Pulp Co., Ltd.).
-10) Five sheets were impregnated continuously in an atmosphere with an absolute humidity of 0.012 kg/kg, and when it was sufficiently penetrated, electrolysis 1
i4F! (Saky Koga/TS made by Tofoil Co., Ltd.
TO, 35-thick) was laminated on one side and a 50-thick polyethylene terephthalate film was laminated on the other side, and heated and cured at 100°C for 20 minutes and 160°C for 20 minutes to form a copper foil on one side. A laminated printed wiring board material having a thickness of 1.6 fl was obtained. The moisture content and resin content of this printed wiring board material were the values shown in Table 3.

(Examples 8 and 9 and Comparative Example 3.4) The absolute humidity in the step of impregnating the base material with resin was 0.01 kg.
/kg, 0.008kg/kg, 0.023
A printed wiring board material was obtained in exactly the same manner as in Example 7 except that the weight was changed to 0.017 kg/kg and 0.017 kg/kg. The moisture content and resin content of each printed wiring board material were the values shown in Table 3, respectively.

As described above, the obtained printed wiring board materials were as described in Examples 1 to 6 and Comparative Example 1 except that craters on the surface of the board were examined instead of examining voids inside the board.
The same measurements as in 2 were carried out and the results are shown in Table 3.

As shown in Table 3, Example 7 in which copper foil was laminated on one side
-9 also had higher logging insulation resistance than Comparative Examples 3 and 4,
Copper foil beer strength is also increasing. Also, Comparative Example 3.
In Example 4, there were copper foil shrinkage wrinkles and craters on the substrate surface, whereas in Examples 7 to 9, both were absent.

As seen above, in Examples 1 to 9, the water content was 0.3% or less of the resin content, and all were of good quality.

The printed wiring board material according to the present invention is not limited to the above embodiments.

〔Effect of the invention〕

As described above, the printed wiring board material according to the present invention is characterized in that the water content is 0.3% or less of the resin content, so the quality is improved.

Claims (5)

[Claims] (1) A printed wiring board material obtained by curing a resin impregnated into a base material, characterized in that the water content is 0.3% or less of the resin content. (2) The printed wiring board material according to claim 1, wherein the resin content is 30 to 80 wt%. (3) The printed wiring board material according to claim 1 or 2, in which a plurality of cured resin-impregnated substrates are laminated. (4) Claims 1 to 3 in which metal foil is laminated on at least one surface of the cured resin-impregnated base material.
Printed wiring board material according to any of paragraphs. (5) The printed wiring board material according to claim 3 or 4, which is obtained by a pressureless continuous construction method.