JPS6260414A - Manufacturing extruding mold linear connector for cv cable - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing an extrusion molded straight connection for a CV cable.

[Prior Art] Extrusion molded straight joints (hereinafter referred to as extrusion molded joints) are the best for 154KV to 500KVCv cables.

Extrusion mold joints are produced by extrusion and crosslinking separation methods, in which molten polyethylene is injected into an extrusion mold, cooled in an uncrosslinked state, and then an external semiconductive layer is provided and integrally crosslinked, and molten polyethylene is extruded and eroded. There is a simultaneous extrusion and crosslinking method in which crosslinking is performed immediately and then an external semiconductive layer is provided and crosslinked.

Problem 1 to be solved by the invention F In both construction methods, the outer semiconducting layer of the extrusion mold joint is a hanging method in which an insulator is formed.
There was a desire to further simplify the construction method and shorten the working time for extrusion mold joints.

The purpose of the present invention is to solve the problems of the prior art mentioned above, and to provide a method for manufacturing an extrusion mold type straight joint that simplifies the construction method of extrusion mold joints, shortens the work, and has a stable shape and excellent reliability. There is a particular thing.

[Means for Solving the Problems] The gist of the present invention is to fix a pre-molded external semiconductive layer unit having a heat-shrinkable function only in the small diameter portion at a predetermined position on the cable, and then The reason is that extrusion molding was performed.

That is, a polyolefin outer semiconducting layer unit, which is molded into a shape with no space that can contain the extruded molded insulator and has a heat-shrinkable function only in its small diameter portion, is pressed into the cable in advance; After connecting the cable conductors and applying the internal semiconducting layer, set the unit in a predetermined position and fix it to the CV cable by heating and shrinking only the small diameter part, and then attaching an extrusion mold to the unit. C, characterized in that extrusion molding of the insulator is performed using
This is a method of manufacturing an extrusion mold type straight connection part for a V cable.

[Function] The conventional method was to extrude an insulating layer and then form an external semiconductor layer thereon, but the present invention
This method involves attaching a preformed external semiconducting layer and molding an insulating layer therein.

That is, a polyolefin outer semiconducting layer unit, which has been pre-molded into a shape with an extrusion-molded insulating layer and has a bow space, and which has a heat-shrinkable function only in its small diameter portion, is inserted onto the cable. After applying conductor connections and internal semiconducting layers, it is set in a predetermined position, and only the small diameter portion is heat-shrinked to fix it to the Cv cable. In this way, most of the unit does not deform and secures extrusion mold space. By attaching an extrusion mold to the unit and performing extrusion molding, the effects of simplifying the extrusion mold, simplifying the construction method, and shortening the working time are obtained. The molded insulator is molded to provide a stable shape and highly reliable connections.

[Embodiment] FIG. 1 is a partial sectional view of a connecting portion showing an embodiment of the present invention.

FIGS. 2(a) and 2(b) are diagrams illustrating the procedure for attaching the external semiconductive layer unit, which is used in the present invention and has a small diameter portion with a heat shrink function. In the figure, only the features of the present invention will be explained.After the conductor of a Cv cable 2 is connected, an internal semiconducting layer 1 is provided.

For the internal semiconductive layer 1, a semiconductive polyolefin shrink tube, a semiconductive rubber/polyolefin molding unit, or the like is used. The external semiconducting layer unit 3 is inserted before connecting the conductors of the Cv cable 2.
As shown in (a), it has a diameter that can sufficiently pass through the CV cable sheath. After that, the outer semiconducting layer unit 3
is placed at a predetermined position of the cable connection part, and the small diameter part 7, that is, the part that contacts the CV cable, the position indicated by the dotted line in FIG. In this case, the portion corresponding to the large diameter portion of the unit 3 including the overflow hole 6 of the external semiconductor layer unit 3 maintains the previously molded shape.

After fixing the external semiconducting layer unit 3 to the cable 2 in the above-described procedure, an extrusion mold 4 is attached, and a polyolefin melted at a predetermined temperature is extruded and injected by an extrusion device 5 to form a mold insulator 8.

In this embodiment, the external semiconductor current layer unit 3 is divided into two parts and arranged on both sides of the cable 2, but an integrated one may also be used.

[Effect of the invention] The present invention provides the following effects.

(1) Since only the small diameter portion of the external semiconductive layer unit is heated and shrunk, the construction method is simple and workability is good, and since the large diameter portion is not deformed, a stable connection shape can be ensured.

('2J An external semiconductive layer can be attached regardless of the cable diameter.

(3) Since the molded external semiconductive layer unit assists the molding die, the mold can be simplified and the working time can be shortened.

(4) An extrusion molded connection part 17 with good adhesion between the external semiconductive layer and the insulating layer and excellent electrical performance and reliability is obtained.

[Brief explanation of the drawing]

FIG. 1 is a partial cross-sectional view of a connecting portion according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating the procedure for attaching an external semiconductive layer unit having a heat shrink function in a small diameter portion used in the present invention. 1: Internal semi-conductive layer, 2: CV cable, 3: External semi-conductive layer unit, 4: Extrusion mold, 5: Extrusion device, 6: Overflow hole, 7: Heat shrinkable section, 8: Mold insulator . Agent Patent Attorney Fujio Sato No. 1 Figure No. 2

Claims (1)

[Claims] (1) A polyolefin outer semiconducting layer unit molded into a shape with a space that can contain the extruded molded insulator and having a heat-shrinkable function only in its small diameter portion is inserted into the cable in advance. After connecting the cable conductor and applying the internal semiconductive layer, the unit is set in a predetermined position and fixed to the CV cable by heating and shrinking only the small diameter portion, and then an extrusion mold is attached to the unit. A method of manufacturing an extrusion mold type straight connection part for a CV cable, which comprises attaching it and extrusion molding an insulator.