JPH0568075B2 - - Google Patents

Info

Publication number
JPH0568075B2
JPH0568075B2 JP59055902A JP5590284A JPH0568075B2 JP H0568075 B2 JPH0568075 B2 JP H0568075B2 JP 59055902 A JP59055902 A JP 59055902A JP 5590284 A JP5590284 A JP 5590284A JP H0568075 B2 JPH0568075 B2 JP H0568075B2
Authority
JP
Japan
Prior art keywords
layer
tape
semiconductive
wound
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59055902A
Other languages
Japanese (ja)
Other versions
JPS60200480A (en
Inventor
Tomio Inomata
Kazuo Kimura
Hiroshi Myajima
Tetsuo Kobayashi
Masayuki Owashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SWCC Corp
Original Assignee
Showa Electric Wire and Cable Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Electric Wire and Cable Co filed Critical Showa Electric Wire and Cable Co
Priority to JP59055902A priority Critical patent/JPS60200480A/en
Publication of JPS60200480A publication Critical patent/JPS60200480A/en
Publication of JPH0568075B2 publication Critical patent/JPH0568075B2/ja
Granted legal-status Critical Current

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  • Processing Of Terminals (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Description

【発明の詳細な説明】 [発明の技術分野] 本発明はテープ巻モールド法による絶縁体接続
部の形成方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of forming an insulator connection portion by a tape winding molding method.

[発明の技術的背景とその問題点] 従来から架橋ポリエチレン絶縁ケーブル等の接
続部を形成する方法として、段剥して導体をスリ
ーブ接続した導体接続部の外周に架橋剤を配合し
た架橋可能な半導電性ゴム・プラスチツクテープ
を巻回し、これをモールド金型等を用いて加熱し
半導電性ゴム・プラスチツクテープを一体に融着
させ同時に架橋させて内部半導電層を形成し、次
いでその上に架橋剤を配合した架橋可能な絶縁性
ゴム・プラスチツクテープを巻回した後、再びモ
ールド金型等により加熱して一体に融着架橋させ
て絶縁補強層を形成する方法が行なわれている。
[Technical background of the invention and its problems] Conventionally, as a method for forming a connection part of a crosslinked polyethylene insulated cable, etc., a crosslinkable semi-conductor is used in which a crosslinking agent is added to the outer periphery of a conductor connection part in which the conductor is sleeve-connected by stripping the conductor. A conductive rubber/plastic tape is wound around it and heated using a mold or the like to fuse the semiconductive rubber/plastic tape together and crosslink at the same time to form an internal semiconductive layer. A method is used in which a crosslinkable insulating rubber/plastic tape containing a crosslinking agent is wound and then heated again using a mold or the like to fuse and crosslink the tape to form an insulating reinforcing layer.

しかしながらこの方法では、テープの融着架橋
が2段階で行なわれるため接続部の形成に長時間
を要し、作業性が著しく低く、さらに形成された
半導電層の表面にテープのエツジによる突起が形
成されるという難点があつた。
However, in this method, the tape is fused and crosslinked in two steps, so it takes a long time to form the connection, and the workability is extremely low. Furthermore, the edges of the tape cause protrusions on the surface of the formed semiconductive layer. The problem was that it was formed.

近時、このような問題に対処して、上記半導電
性ゴム・プラスチツクテープに代えて半導電性の
熱収縮チユーブを使用する方法(特開沼57−
126085)が提案されている。
Recently, in order to deal with this problem, a method of using a semiconductive heat shrink tube instead of the semiconductive rubber/plastic tape described above (Japanese Patent Application Laid-Open No. 57-11991) has been proposed.
126085) has been proposed.

この方法によれば作業時間が短縮され、かつ内
部半導電層表面の平滑性は得られるが、この方法
では絶縁性ゴム・プラスチツクテープの加熱モー
ルド時にさらに熱収縮が進行して絶縁層との密着
性が部十分となつたり、ケーブル導体や接続スリ
ーブの形状が表面に段部となつて現われて所期の
効果が減殺されるという難点があつた。
This method shortens the working time and provides a smooth surface for the internal semiconducting layer, but this method causes further heat shrinkage during heating molding of the insulating rubber/plastic tape, resulting in poor adhesion to the insulating layer. However, there were disadvantages in that the cable conductor and connection sleeve's shape became uneven, and the shape of the cable conductor and connection sleeve appeared as steps on the surface, reducing the intended effect.

[発明の目的] 本発明はかかる従来の事情に対処してなされた
もので、内部半導電層が平滑で電気特性に優れた
ケーブル接続部を、短時間にかつ容易に形成する
ことのできるケーブル接続部の形成方法を提供し
ようとするものである。
[Object of the Invention] The present invention has been made in response to such conventional circumstances, and provides a cable in which a cable connection portion with a smooth internal semiconducting layer and excellent electrical properties can be easily formed in a short time. The present invention attempts to provide a method for forming a connection part.

[発明の概要] すなわち本発明のケーブル接続部の形成方法
は、段剥して導体をスリーブ接続したゴム・プラ
スチツク絶縁ケーブルの導体接続部の外周に内部
半導電層および絶縁補強層を形成するにあたり、
接続スリーブ上からケーブルの内部半導電層にか
けて架橋可能な半導電性ゴム・プラスチツクテー
プをほぼ紡錘状に巻回しその上に耐熱性テープを
巻回した後、これを外側より加熱して前記半導電
性ゴム・プラスチツクテープの最外層およびその
近傍のみを融着半架橋させ、次いで前記耐熱性テ
ープを除去して、前記半導電性ゴム・プラスチツ
クテープ巻回層およびケープルの絶縁層上に架橋
可能な絶縁上ゴム・プラスチツクテープを紡錘状
に巻回し、しかる後この絶縁性ゴム・プラスチツ
クテープ巻回層および前記半導電性ゴム・プラス
チツクテープ巻回層を加熱により融着一体化させ
完全架橋することを特徴としている。
[Summary of the Invention] That is, the method for forming a cable connection portion of the present invention includes forming an internal semiconductive layer and an insulating reinforcing layer on the outer periphery of a conductor connection portion of a rubber/plastic insulated cable in which the conductor is sleeve-connected by stripping the conductors.
A cross-linkable semiconductive rubber/plastic tape is wound in an almost spindle shape from the top of the connection sleeve to the internal semiconductive layer of the cable, and then a heat-resistant tape is wound on top of the tape, which is then heated from the outside to form the semiconductive layer. Only the outermost layer of the semiconductive rubber/plastic tape and its vicinity are fused and semi-crosslinked, and then the heat resistant tape is removed to form a crosslinkable layer on the semiconductive rubber/plastic tape wound layer and the insulating layer of the cable. The insulating rubber/plastic tape is wound into a spindle shape, and then the insulating rubber/plastic tape wound layer and the semiconductive rubber/plastic tape wound layer are fused and integrated by heating to completely crosslink. It is a feature.

[発明の実施例] 以下本発明の詳細を図面に示す一実施例につい
て説明する。
[Embodiment of the Invention] The details of the present invention will be described below with reference to an embodiment shown in the drawings.

第1図は本発明の方法を説明するための架橋ポ
リエチレン絶縁ケーブル接続部の縦断面図、第2
図はその半導電性架橋ポリエチレンテープ巻回層
の部分の拡大断面図である。
Fig. 1 is a longitudinal sectional view of a cross-linked polyethylene insulated cable connection section for explaining the method of the present invention;
The figure is an enlarged sectional view of a part of the semiconductive crosslinked polyethylene tape wound layer.

この実施例においては、まず段剥してケーブル
導体1、ケーブル内部半導電層2およびケーブル
絶縁体3の露出された架橋ポリエチレン絶縁ケー
ブル4,4のケーブル導体1,1が、接続スリー
ブ5を用いて接続される。
In this embodiment, first, the cable conductors 1, 1 of the crosslinked polyethylene insulated cables 4, 4, which are stripped in stages to expose the cable conductor 1, the cable internal semiconducting layer 2, and the cable insulator 3, are removed using the connecting sleeve 5. Connected.

次いでケーブルの内部半導電層2,2間に跨つ
て架橋剤を配合した架橋可能な半導電性ポリエチ
レンテープを巻回層6が形成される。
Next, a wound layer 6 is formed of a crosslinkable semiconductive polyethylene tape containing a crosslinking agent between the inner semiconductive layers 2 of the cable.

本発明においては、その際、接続スリーブ5と
内部半導電層2間の段部を埋めて、架橋剤の配合
された架橋可能な半導電ポリエチレンテープがほ
ぼ紡錘状となるように巻回される。
In the present invention, at that time, a crosslinkable semiconductive polyethylene tape containing a crosslinking agent is wound in a substantially spindle shape to fill the step between the connection sleeve 5 and the internal semiconductive layer 2. .

次にこの半導電性ポリエチレンテープ巻回層6
上に耐熱性テープ7、例えばポリイミドテープ等
を押え巻きし、その外側からドライヤー等を使用
して半導電性ポリエチレンテープ巻回層6の表面
を加熱する。この加熱は、半導電性ポリエチレン
テープ巻回層6の最外層またはその近傍が融着し
少なくとも半架橋状態、すなわち、架橋度60%程
度が得られればよく、例えば1000Wのドライヤー
を使用した場合4〜5分間の加熱で十分である。
第2図において、Mは融着半架橋部を示してい
る。
Next, this semiconductive polyethylene tape winding layer 6
A heat-resistant tape 7, such as a polyimide tape, is pressed and wound on top, and the surface of the semiconductive polyethylene tape wound layer 6 is heated from the outside using a dryer or the like. This heating only needs to fuse the outermost layer of the semiconductive polyethylene tape wound layer 6 or its vicinity to obtain at least a semi-crosslinked state, that is, a degree of crosslinking of about 60%. For example, if a 1000W dryer is used, 4 ~5 minutes of heating is sufficient.
In FIG. 2, M indicates a fused half-bridge.

この加熱処理では、半導電性ポリエチレンテー
プ巻回層6の表層部分だけが融着架橋に必要な温
度にまで加熱されるので、内部からの熱応力はほ
とんど作用せず、従つて凹凸のない平滑な表面が
得られるとともに、短時間の作業で済むという利
点がある。
In this heat treatment, only the surface layer of the semiconductive polyethylene tape wound layer 6 is heated to the temperature necessary for fusion crosslinking, so almost no thermal stress acts from inside, and the surface layer 6 is smooth and smooth. This method has the advantage that a smooth surface can be obtained and the work can be completed in a short time.

またこの加熱処理は、短時間で行なわれるので
常温に戻るのも早く、僅かな時間放冷しただけ
で、耐熱性テープ7を除去し絶縁補強層8の形成
を開始することができるという利点もある。
Moreover, since this heat treatment is carried out in a short time, the temperature returns to room temperature quickly, and the heat-resistant tape 7 can be removed and the formation of the insulating reinforcing layer 8 can be started after only a short time of cooling. be.

この後、内部半導電層6上にケーブル絶縁体
3,3に跨つて架橋剤の配合された架橋可能な絶
縁性ポリエチレンテープを巻回し、常法により加
熱モールドして絶縁補強層8が形成される。
Thereafter, a cross-linkable insulating polyethylene tape containing a cross-linking agent is wound over the inner semi-conductive layer 6 across the cable insulators 3, 3, and heat-molded using a conventional method to form an insulation reinforcing layer 8. Ru.

この加熱モールドの工程では、内部半導電層6
側からも熱応力が生じるが、内部半導電層に比べ
て絶縁性ポリエチレンテープ巻回層の層厚は十分
に大きく、しかも内部半導電層6の表面部分は半
架橋または架橋されているので、内部半導電層表
面の平滑性が損われることなく、良好な電気特性
を有する架橋ポリエチレン絶縁ケーブルの接続部
が形成される。
In this heat molding process, the internal semiconducting layer 6
Although thermal stress is also generated from the side, the layer thickness of the insulating polyethylene tape wound layer is sufficiently larger than that of the internal semiconductive layer, and the surface portion of the internal semiconductive layer 6 is semi-crosslinked or crosslinked. A connection portion of a crosslinked polyethylene insulated cable having good electrical properties is formed without impairing the smoothness of the surface of the internal semiconducting layer.

なお以上の実施例では、本発明を架橋ポリエチ
レンケーブルの接続部の形成に適用した例につい
て説明したが、本発明はかかる実施例に限定され
るべきものではなく、他のゴム・プラスチツクケ
ーブルの接続部の形成にも同様に適用可能であ
る。
In the above embodiments, an example in which the present invention is applied to the formation of a connection part of a cross-linked polyethylene cable has been described, but the present invention should not be limited to such an embodiment, and can be applied to the connection of other rubber/plastic cables. It is similarly applicable to the formation of parts.

[発明の効果] 以上説明したように本発明によれば、導体接続
スリーブからケーブルの内部半導電層にかけて架
橋可能な半導電性ゴム・プラスチツクテープをほ
ぼ紡錘状に巻回し、かつそのの外側表面のみを半
架橋が得られる程度の短時間の加熱で融着させて
内部半導電層を形成させたので、短時間で優れた
電気特性を有するケーブル接続部を形成すること
ができる。
[Effects of the Invention] As explained above, according to the present invention, crosslinkable semiconductive rubber/plastic tape is wound approximately in a spindle shape from the conductor connection sleeve to the internal semiconductive layer of the cable, and the outer surface of Since the internal semiconducting layer was formed by fusing the two layers by heating for a short period of time to obtain half-crosslinking, a cable connection portion having excellent electrical properties can be formed in a short period of time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明方法を説明するための架橋ポリ
エチレン絶縁ケーブル接続部の縦断面図、第2図
はその半導電ポリエチレンテープ巻回層の部分の
拡大縦断面図である。 1……ケーブル導体、2……ケーブル内部半導
電層、3……ケーブル絶縁層、4……架橋ポリエ
チレン絶縁ケーブル、5……接続スリーブ、6…
…半導電性ポリエチレンテープ巻回層、7……耐
熱性テープ、8……絶縁補強層、M……融着半架
橋部。
FIG. 1 is a longitudinal cross-sectional view of a cross-linked polyethylene insulated cable connection section for explaining the method of the present invention, and FIG. 2 is an enlarged longitudinal cross-sectional view of a portion of the semiconductive polyethylene tape wound layer. DESCRIPTION OF SYMBOLS 1... Cable conductor, 2... Cable internal semiconducting layer, 3... Cable insulation layer, 4... Crosslinked polyethylene insulated cable, 5... Connection sleeve, 6...
... Semi-conductive polyethylene tape winding layer, 7 ... Heat-resistant tape, 8 ... Insulating reinforcing layer, M ... Fusion half-crosslinked part.

Claims (1)

【特許請求の範囲】[Claims] 1 段剥して導体をスリーブ接続したゴム・プラ
スチツク絶縁ケーブルの導体接続部の外周に内部
半導電層および絶縁補強層を形成するにあたり、
接続スリーブ上からケーブルの内部半導電層にか
けて架橋可能な半導電性ゴム・プラスチツクテー
プをほぼ紡錘状に巻回しその上に耐熱性テープを
巻回した後、これを外側より加熱して前記半導電
性ゴム・プラスチツクテープの最外層およびその
近傍のみを融着半架橋させ、次いで前記耐熱性テ
ープを除去して、前記半導電性ゴム・プラスチツ
クテープ巻回層およびケーブルの絶縁層上に架橋
可能な絶縁性ゴム・プラスチツクテープを紡錘状
に巻回し、しかる後この絶縁性ゴム・プラスチツ
クテープ巻回層および前記半導電性ゴム・プラス
チツクテープ巻回層を加熱により融着一体化させ
完全架橋することを特徴とするケーブル接続部の
形成方法。
1. When forming an internal semiconducting layer and an insulating reinforcing layer around the outer periphery of the conductor connection part of a rubber/plastic insulated cable whose conductors are sleeve-connected after being stripped in one step,
A cross-linkable semiconductive rubber/plastic tape is wound in an almost spindle shape from the top of the connection sleeve to the internal semiconductive layer of the cable, and then a heat-resistant tape is wound on top of the tape, which is then heated from the outside to form the semiconductive layer. Only the outermost layer of the semiconductive rubber/plastic tape and its vicinity are fused and semi-crosslinked, and then the heat resistant tape is removed to form a crosslinkable layer on the semiconductive rubber/plastic tape winding layer and the insulating layer of the cable. The insulating rubber/plastic tape is wound into a spindle shape, and then the insulating rubber/plastic tape wound layer and the semiconductive rubber/plastic tape wound layer are fused and integrated by heating to completely crosslink. Characteristic method for forming cable connections.
JP59055902A 1984-03-23 1984-03-23 Method of molding cable connector Granted JPS60200480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59055902A JPS60200480A (en) 1984-03-23 1984-03-23 Method of molding cable connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59055902A JPS60200480A (en) 1984-03-23 1984-03-23 Method of molding cable connector

Publications (2)

Publication Number Publication Date
JPS60200480A JPS60200480A (en) 1985-10-09
JPH0568075B2 true JPH0568075B2 (en) 1993-09-28

Family

ID=13012041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59055902A Granted JPS60200480A (en) 1984-03-23 1984-03-23 Method of molding cable connector

Country Status (1)

Country Link
JP (1) JPS60200480A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783109A (en) * 1980-11-13 1982-05-24 Furukawa Electric Co Ltd Method of forming polyolefin insulated cable connector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783109A (en) * 1980-11-13 1982-05-24 Furukawa Electric Co Ltd Method of forming polyolefin insulated cable connector

Also Published As

Publication number Publication date
JPS60200480A (en) 1985-10-09

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