JPS60200480A - Method of molding cable connector - Google Patents
Method of molding cable connectorInfo
- Publication number
- JPS60200480A JPS60200480A JP59055902A JP5590284A JPS60200480A JP S60200480 A JPS60200480 A JP S60200480A JP 59055902 A JP59055902 A JP 59055902A JP 5590284 A JP5590284 A JP 5590284A JP S60200480 A JPS60200480 A JP S60200480A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tape
- rubber
- cable
- semiconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 15
- 238000000465 moulding Methods 0.000 title description 4
- 229920003023 plastic Polymers 0.000 claims description 19
- 239000004033 plastic Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 39
- 239000004698 Polyethylene Substances 0.000 description 10
- -1 polyethylene Polymers 0.000 description 10
- 229920000573 polyethylene Polymers 0.000 description 10
- 229920003020 cross-linked polyethylene Polymers 0.000 description 8
- 239000004703 cross-linked polyethylene Substances 0.000 description 8
- 239000003431 cross linking reagent Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明はテープ巻モールド法による絶縁体接続部の形成
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of forming an insulator connection portion by a tape winding molding method.
［発明の技術向背をとその問題点］
従来力目ろ架橋ポリエチレン絶縁ケーブル等の接続部を
形成する方法として、段剥して導体をスリーブ接続した
導体接続部の外周に架橋剤を配合した架橋可能な半導電
性ゴム・プラスチックテープを巻回し、これをモールド
金型等を用いて加熱し半導電性ゴム・プラスチックテー
プを一体に融着させ同時に架橋させて内部半導電層を形
成し、次いでその上に架橋剤を配合した架橋可能な絶縁
性ゴム・プラスチックテープを巻回した後、再びモール
ド金型等により加熱して一体に融着架橋させて絶縁補強
層を形成する方法が行なわれている。[Advances and Problems with the Invention] Conventionally, as a method for forming a connection part of a force-crosslinked polyethylene insulated cable, etc., a crosslinkable method is used in which a crosslinking agent is added to the outer periphery of a conductor connection part in which conductors are connected in sleeves by stripping the conductors. A semiconductive rubber/plastic tape is wound around the tape and heated using a mold or the like to fuse the semiconductive rubber/plastic tape together and crosslink at the same time to form an internal semiconductive layer. A method is used in which a cross-linkable insulating rubber/plastic tape containing a cross-linking agent is wrapped around the tape, and then heated again using a mold etc. to fuse and cross-link the tape to form an insulating reinforcing layer. .
しかしながらこの方法では、テープの融着架橋が２段階
で行なわれるため接続部の形成に長時間を要し、作業性
が著しく低く、さらに形成された半導電層の表面にテー
プのエツジによる突起が形成されるという変１１点があ
った。However, in this method, the tape is fused and crosslinked in two steps, so it takes a long time to form the connection, and the workability is extremely low. Furthermore, the edges of the tape cause protrusions on the surface of the formed semiconductive layer. There were 11 strange points that were formed.
近時、このような問題に対処して、上記半導電性ゴム・
プラスデックテープに代えて半導電性の熱収縮チューブ
を使用する方法（特開昭５７−１２６０８５＞が提案さ
れている。Recently, in order to deal with such problems, the above semiconductive rubber
A method (Japanese Patent Laid-Open No. 126085/1985) has been proposed in which semiconductive heat shrink tube is used in place of the Plus Deck tape.
この方法によれば作業時間が短縮され、かつ内部半導電
層表面の平滑性は得られるが、この方法では絶縁性ゴム
・プラスデックテープの加熱モールド時にさらに熱収縮
が進行して絶縁層どの密着性が不十分となったり、ケー
ブル導体や接続スリーブの形状が表面に段部となって現
われて所期の効果が減殺されるという難点があった。Although this method shortens the working time and provides a smooth surface for the internal semiconductive layer, this method causes further heat shrinkage during heating molding of the insulating rubber/Plus Deck tape, causing the insulating layer to adhere tightly. However, there have been disadvantages in that the properties of the cable conductor and the connecting sleeve are insufficient, and that the shapes of the cable conductor and the connecting sleeve form a stepped portion on the surface, which reduces the intended effect.
［発明の目的］
本発明はかかる従来の事情に対処してなされたもので、
内部半導電層が平滑で電気特性に優れたケーブル接続部
を、短時間にかつ容易に形成することのできるケーブル
接続部の形成方法を提供しＪ：うどするものである。[Object of the invention] The present invention has been made in response to such conventional circumstances,
The present invention provides a method for forming a cable connection part that can easily form a cable connection part with a smooth internal semiconducting layer and excellent electrical properties in a short time.
［発明の概要］
すなわち本発明のケーブル接続部の形成方法は、段剥し
て導体をスリーブ接続したゴム・プラスナック絶縁ケー
ブルの導体接続部の外周に内部半導電＠および絶縁補強
層を形成するにあたり、接続スリーブ上からケーブルの
内部半導電層にか（プて架橋可能な半導電性ゴム・プラ
スチックテープをほぼ円錐状に巻回しその上に耐熱性テ
ープを巻回した後、これを外側より加熱して前記半導電
性ゴム・プラスチックテープの最外層またはその近傍の
みを融着半架橋させ、次いで前記耐熱性テープを除去し
て、前記半導電性ゴム・プラスチックテープ巻回層およ
びケーブルの絶縁層上に絶縁性ゴム・プラスチックテー
プを紡錘状に巻回し、しかる後この絶縁性ゴ１８・プラ
スデックテープ巻回層および前記半導電性ゴム・プラス
チックテープ巻回層を加熱に」：り融着一体化させ完全
架橋することを特徴としている。[Summary of the Invention] That is, the method for forming a cable connection part of the present invention involves forming an internal semiconducting layer and an insulating reinforcing layer on the outer periphery of a conductor connection part of a rubber/plastic insulated cable in which the conductor is sleeve-connected by stripping the conductors. , wrap cross-linkable semiconductive rubber/plastic tape around the internal semiconductive layer of the cable from above the connection sleeve, wrap the heat-resistant tape over it, and then heat it from the outside. The outermost layer of the semi-conductive rubber/plastic tape or its vicinity is fused and semi-crosslinked, and then the heat-resistant tape is removed, and the semi-conductive rubber/plastic tape winding layer and the cable insulation layer are bonded and semi-crosslinked. An insulating rubber/plastic tape is wound on top in a spindle shape, and then the insulating rubber/plastic tape layer and the semiconductive rubber/plastic tape layer are heated and fused together. It is characterized by complete crosslinking.
［発明の実施例］
以下本発明の詳細を図面に示す一実施例について説明す
る。[Embodiment of the Invention] The details of the present invention will be described below with reference to an embodiment shown in the drawings.
第１図は本発明の詳細な説明するための架橋ポ３−
リ：［ヂレン絶縁ケーブル接続部の縦断面図、第２図は
その半導電性架橋ポリエチレンテープ巻回層の部分の拡
大断面図である。Fig. 1 is a longitudinal cross-sectional view of a cross-linked polyethylene cable connection section for explaining the present invention in detail, and Fig. 2 is an enlarged cross-sectional view of the semiconductive cross-linked polyethylene tape wound layer. It is.
この実施例においては、まず段剥してケーブル導体１、
ケーブル内部半導電層２おにびケーブル絶縁体３の露出
された架橋ポリエチレン絶縁ケーブル４．４のケーブル
導体１．１が、接続スリーブ５を用いて接続される３゜
次いでケーブルの内部半導電層２．２間に跨って架橋剤
を配合した架橋可能な半導電性ポリエチレンテープ巻回
層６が形成される。In this embodiment, the cable conductor 1 is first stripped in stages,
The cable conductor 1.1 of the exposed cross-linked polyethylene insulated cable 4.4 of the cable inner semi-conducting layer 2 and the cable insulation 3 is connected by means of a connecting sleeve 5 to the inner semi-conducting layer of the cable. 2. A crosslinkable semiconductive polyethylene tape winding layer 6 containing a crosslinking agent is formed across the gap between the two layers.
本発明においては、その際、接続スリーブ５と内部半導
電層２間の段部を埋めて、架橋剤の配合された架橋可能
な半導電ポリエチレンテープがほぼ円錐状となるように
巻回される。In the present invention, at that time, a crosslinkable semiconductive polyethylene tape containing a crosslinking agent is wound in a substantially conical shape to fill the step between the connection sleeve 5 and the internal semiconductive layer 2. .
次にこの半導電性ポリエチレンテーブ巻回層６上に耐熱
性テープ７、例えばポリイミドテープ等を押え巻きし、
子の外側からドライヤー等を使用して半導電性ポリエチ
レンテープ巻回層６の表面を加熱する。この加熱は、半
導電性ポリエチレン４−
テープ巻回層６の最外層またはその近傍が融着し少なく
とも半架橋状態、ずなわら、架橋度６０％程度が１０ら
れればよく、例えば１０００Ｗのドライψ−を使用した
場合４〜５分間の加熱で４−分である。第２図において
、Ｍは融着半架橋部を示している。Next, a heat-resistant tape 7, such as polyimide tape, is pressed and wound on this semiconductive polyethylene tape winding layer 6,
The surface of the semiconductive polyethylene tape wound layer 6 is heated from the outside of the core using a dryer or the like. This heating may be performed as long as the outermost layer of the semiconductive polyethylene 4-tape wound layer 6 or its vicinity is fused and at least semi-crosslinked, with a degree of crosslinking of about 60%. - When using 4 to 5 minutes of heating, the heating time is 4 minutes. In FIG. 2, M indicates a fused half-bridge.
この加熱処理では、半導電性ポリエチレンテープ巻回層
６の表層部分だけが融着架橋に必要な渇磨にまで加熱さ
れるので、内部からの熱応力はほとんど作用せず、従っ
て凹凸のない平滑な表面が得られるとともに、短時間の
作業で済むという利点がある。In this heat treatment, only the surface layer of the semiconductive polyethylene tape wound layer 6 is heated to the degree of abrasion required for fusion crosslinking, so almost no thermal stress acts from the inside, resulting in a smooth surface with no unevenness. This method has the advantage that a smooth surface can be obtained and the work can be completed in a short time.
またこの加熱処理は、短時間で行なわれるので常温に戻
るのも早く、僅かな時間放冷しただけで、耐熱性テープ
７を除去し絶縁補強Ｂ８の形成を開始することができる
という利点もある。Moreover, since this heat treatment is performed in a short time, the temperature returns to room temperature quickly, and there is an advantage that the heat-resistant tape 7 can be removed and the formation of the insulation reinforcement B8 can be started after only a short time of cooling. .
この接、内部半導電層６上にケーブル絶縁体３．３に跨
って架橋剤の配合された架橋可能な絶縁性ポリエチレン
テープを巻回し、常法により加熱モールドして絶縁補強
層８が形成される。At this point, an insulating reinforcing layer 8 is formed by winding a crosslinkable insulating polyethylene tape containing a crosslinking agent over the inner semiconducting layer 6 over the cable insulator 3.3, and heat-molding it by a conventional method. Ru.
この加熱モールドの工桿では、内部半導電層６側からも
熱応力が生じるが、内部半導電層に比べて絶縁性ポリエ
チレンテープ巻回層の層厚は十分に大きく、しかも内部
半導電層６の表面部分は半架橋または架橋されているの
で、内部半導電層表面の平滑性が損われることはなく、
良好な電気特性を有する架橋ポリエチレン絶縁ケーブル
の接続部が形成される。In this heating mold tool, thermal stress is also generated from the internal semiconductive layer 6 side, but the layer thickness of the insulating polyethylene tape wound layer is sufficiently large compared to the internal semiconductive layer 6. Since the surface portion of is semi-crosslinked or crosslinked, the smoothness of the internal semiconducting layer surface is not impaired.
A crosslinked polyethylene insulated cable connection with good electrical properties is formed.
なお以上の実施例では、本発明を架橋ポリエチレンケー
ブルの接続部の形成に適用した例について説明しｔｃが
、本発明はかかる実施例に限定されるべきものではなく
、他のゴム・プラスチックケーブルの接続部の形成にも
同様に適用可能である。In the above examples, an example in which the present invention is applied to the formation of a connection part of a cross-linked polyethylene cable is described, but the present invention should not be limited to such an example, and can be applied to other rubber/plastic cables. It is similarly applicable to the formation of connections.
［発明の効果］
以上説明したように本発明によれば、導体接続スリーブ
からケーブルの内部半導電層にかけて架橋可能な半導電
性ゴム・プラスチックテープをほぼ円錐状に巻回し、か
つそのの外側表面のみを半架橋が１ｑられる程度の短時
間の加熱で融着させて内部半導電層を形成させたので、
短時間で優れた電気特性を有するケーブル接続部を形成
することができる。[Effects of the Invention] As explained above, according to the present invention, a crosslinkable semiconductive rubber/plastic tape is wound in a substantially conical shape from the conductor connection sleeve to the internal semiconductive layer of the cable, and The internal semiconducting layer was formed by fusing only the semi-crosslinked material by heating for a short period of time, such that 1q of semi-crosslinks were formed.
A cable connection portion with excellent electrical properties can be formed in a short time.
第１図は本発明方法を説明するための架橋ポリエチレン
絶縁ケーブル接続部の縦断面図、第２図はその半導電ポ
リエチレンテープ巻回層の部分の拡大縦断面図である。
１・・・・・・・・・・・・ケーブル導体２・・・・・
・・・・・・・ケーブル内部半導電層３・・・・・・・
・・・・・ケーブル絶縁層４・・・・・・・・・・・・
架橋ポリエチレン絶縁ケーブル５・・・・・・・・・・
・・接続スリーブ６・・・・・・・・・・・・半導電性
ポリエチレンテープ巻回層
７・・・・・・・・・・・・耐熱性テープ８・・・・・
・・・・・・・絶縁補強層Ｍ・・・・・・・・・・・・
融着半架橋部代理人弁理士 須 山 佐 −
（ほか１名）
第１頁の続き
＠発明者 尾鷲 王室 川崎市ノ
社内FIG. 1 is a longitudinal cross-sectional view of a cross-linked polyethylene insulated cable connection section for explaining the method of the present invention, and FIG. 2 is an enlarged longitudinal cross-sectional view of a portion of the semiconductive polyethylene tape wound layer. 1......Cable conductor 2...
・・・・・・Cable internal semiconducting layer 3・・・・・・
・・・・・・Cable insulation layer 4・・・・・・・・・・・・
Cross-linked polyethylene insulated cable 5...
・・Connection sleeve 6 ・・・・・ Semi-conductive polyethylene tape winding layer 7 ・・・ Heat resistant tape 8 ・・・
・・・・・・Insulating reinforcing layer M・・・・・・・・・・・・
Patent attorney representing the fusion semi-crosslinking department Satoshi Suyama - (1 other person) Continued from page 1 @ Inventor Owase Royal Family Kawasaki City In-house
Claims (1)
ック絶縁ケーブルの導体接続部の外周に内部半導電層お
よび絶縁補強層を形成するにあたり、接続スリーブ上か
らケーブルの内部半導電層にかけて架橋可能な半導電性
ゴム・プラスチックテープをほぼ円錐状に巻回しその上
に耐熱性テープを巻回した後、これを外側より加熱して
前記半導電性ゴム・プラスチックテープの最外層または
その近傍のみを融着半架橋させ、次いで前記耐熱性テー
プを除去して、前記半導電性ゴム・プラスチックテープ
巻回層およびケーブルの絶縁層−Ｆに絶縁性ゴム・プラ
スチックテープを紡錘状に巻回し、しかる後この絶縁性
ゴム・プラスチックテープ巻回層および前記半導電性ゴ
ム・プラスチックテープ巻回層を加熱により融着一体化
させ完全架橋することを特徴とするケーブル接続部の形
成方法。(1) When forming an internal semiconducting layer and an insulation reinforcing layer on the outer periphery of the conductor connection part of a rubber/plastic insulated cable whose conductor is connected to a sleeve by stripping the conductors, it is possible to crosslink from the top of the connection sleeve to the internal semiconducting layer of the cable. After winding a semi-conductive rubber/plastic tape into a substantially conical shape and wrapping a heat-resistant tape on top of it, this is heated from the outside to melt only the outermost layer of the semi-conductive rubber/plastic tape or its vicinity. The heat-resistant tape is removed, and the insulating rubber/plastic tape is wound in a spindle shape around the semiconductive rubber/plastic tape winding layer and the cable insulation layer -F. 1. A method for forming a cable connection portion, which comprises completely crosslinking the insulating rubber/plastic tape wound layer and the semiconductive rubber/plastic tape wound layer by fusing and integrating them by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055902A JPS60200480A (en) | 1984-03-23 | 1984-03-23 | Method of molding cable connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055902A JPS60200480A (en) | 1984-03-23 | 1984-03-23 | Method of molding cable connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60200480A true JPS60200480A (en) | 1985-10-09 |
| JPH0568075B2 JPH0568075B2 (en) | 1993-09-28 |
Family
ID=13012041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59055902A Granted JPS60200480A (en) | 1984-03-23 | 1984-03-23 | Method of molding cable connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60200480A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5783109A (en) * | 1980-11-13 | 1982-05-24 | Furukawa Electric Co Ltd | Method of forming polyolefin insulated cable connector |
-
1984
- 1984-03-23 JP JP59055902A patent/JPS60200480A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5783109A (en) * | 1980-11-13 | 1982-05-24 | Furukawa Electric Co Ltd | Method of forming polyolefin insulated cable connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568075B2 (en) | 1993-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |