JPS6260426A - Connecting method for rubber, plastic cable - Google Patents
Connecting method for rubber, plastic cableInfo
- Publication number
- JPS6260426A JPS6260426A JP20018585A JP20018585A JPS6260426A JP S6260426 A JPS6260426 A JP S6260426A JP 20018585 A JP20018585 A JP 20018585A JP 20018585 A JP20018585 A JP 20018585A JP S6260426 A JPS6260426 A JP S6260426A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- layer
- plastic
- semiconductive layer
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
ゴム・プラスチック絶縁ケーブルの中間接続部の接続方
法の一つに、押出しモールド法がある。[Detailed Description of the Invention] [Industrial Application Field] One of the methods for connecting intermediate joints of rubber/plastic insulated cables is an extrusion molding method.
それは第２図のように、ケーブル導体１０をスリーブ１
２で接続し、その上に半導電層２０を形成し、それから
金型３０をかぶせ、その中にプラスチックを押出し注入
して補強絶縁体１Ｂを形成し、その後、加熱架橋し、外
部半導電層を設ける。という方法である。As shown in Fig. 2, the cable conductor 10 is connected to the sleeve 1.
2, a semiconductive layer 20 is formed thereon, a mold 30 is placed over it, plastic is extruded and injected into it to form a reinforcing insulator 1B, and then heat crosslinked to form an external semiconductive layer. will be established. This is the method.
この発明は、上記の押出しモールド法によるゴム−プラ
スチックケーブルの接続方法に関するもので、特に内部
半導電層２０とその付近の形成方法に関するものである
。The present invention relates to a method for connecting a rubber-plastic cable using the extrusion molding method described above, and particularly to a method for forming the internal semiconductive layer 20 and its vicinity.
［従来の技術］
半導電層２０の形成方法として、
（１）スリーブ１２上に未架橋の半導電性ゴム・プラス
チックテープを巻き、それを加熱モールドする方法、
（２）スリーブ１２上に半導電性ゴム・プラスチック熱
収縮チューブ２１を施す方法、
が実施されている。[Prior Art] Methods for forming the semiconductive layer 20 include (1) wrapping an uncrosslinked semiconductive rubber/plastic tape on the sleeve 12 and heat molding it; (2) forming a semiconductive layer on the sleeve 12; A method of applying a flexible rubber/plastic heat shrinkable tube 21 has been carried out.
［発明が解決しようとする闇題点］
押出しモールドジヨイントの場合、押出し機より押出さ
れた樹脂は、スリーブ１２上の半導電層２０の樹脂に接
触しながら流動し、金型３０内に充填されるので、上記
（１） （２）の方法では、内部半導電Ｍ２Ｏ中のカー
ボン粒子が、絶縁樹脂に混入するという危険性がある。[Dark problem to be solved by the invention] In the case of an extrusion mold joint, the resin extruded from the extruder flows while contacting the resin of the semiconductive layer 20 on the sleeve 12, and fills the mold 30. Therefore, in the methods (1) and (2) above, there is a risk that the carbon particles in the internal semiconducting M2O may mix into the insulating resin.
また、特に（りの方法では、加熱モールドに長時間を要
するという欠点がある。Moreover, in particular, the method described above has the disadvantage that heating molding requires a long time.
［問題点を解決するための手段］
内部半導電層２０の樹脂と押出された絶縁樹脂とが直接
接触するのを防止することにより、内部半導電層のカー
ボンが絶縁樹脂内へ混入するのを防止し、接続部の耐電
圧性能を向上せしめたもので。[Means for solving the problem] By preventing direct contact between the resin of the internal semiconductive layer 20 and the extruded insulating resin, it is possible to prevent the carbon of the internal semiconductive layer from mixing into the insulating resin. This product has improved the withstand voltage performance of the connection part.
第１図のように、
半導電層２０の上に絶縁性収縮チューブ２２を収縮被覆
させ、その上に補強絶縁体１８を押出しモールドするこ
と、
を特徴とするものである。As shown in FIG. 1, the structure is characterized in that an insulating shrink tube 22 is shrink-covered over the semiconducting layer 20, and a reinforcing insulator 18 is extrusion-molded thereon.
［その説明］
第１図において、半導電層２０は、スリーブ１２および
ケーブル導体１０の露出部を覆うようにして、半導電性
ゴム争プラスチックテープを巻回して形成したものであ
る。[Description] In FIG. 1, the semiconductive layer 20 is formed by winding a semiconductive rubber/plastic tape so as to cover the exposed portions of the sleeve 12 and the cable conductor 10.
２２は絶縁性ゴム・プラスチックよりなる熱酸
−縮チューブで、上記半導電層２０を覆うようにかぶ
せ、加熱収縮させたものである。なお、この熱収縮チュ
ーブ２２は、１１程度の８肉のものでよい。22 is a hot acid made of insulating rubber/plastic
- A shrunken tube is placed over the semiconductive layer 20 and shrunk by heating. Note that this heat-shrinkable tube 22 may be one with about 11 or 8 thicknesses.
その後、従来の場合と同様に、プラスチックの押出しモ
ールドにより補強絶縁体１８を形成する。Thereafter, the reinforcing insulator 18 is formed using a plastic extrusion mold, as in the conventional case.
■発明の効果１
（１）半導電層２０の上を薄肉の絶縁層で覆うので、押
出し絶縁樹脂と半導電層とが直接接触することはない、
したがって内部半導電層のカーボン粒子が絶縁樹脂に混
入するという危険性がなＩ／λ。■Effect of the invention 1 (1) Since the semiconducting layer 20 is covered with a thin insulating layer, there is no direct contact between the extruded insulating resin and the semiconducting layer.
Therefore, there is no risk that carbon particles in the internal semiconducting layer will mix into the insulating resin.
（２）半導電層２０は、押出し絶縁層の架橋時に同時に
加熱され、架橋されるので、予めモールドする必要がな
く、大幅な時間短縮ができる。(2) Since the semiconductive layer 20 is heated and crosslinked at the same time as the extruded insulating layer is crosslinked, there is no need to mold it in advance, which can significantly shorten the time.
（３）半導電層２０の上にかぶせる絶縁性熱収縮チュー
ブ２２は上記のように１關程度の厚さでよく、短時間の
加熱で収縮できるので、収縮チューブの絶縁体を劣化さ
せる心配がない。(3) The insulating heat-shrinkable tube 22 to be placed over the semi-conductive layer 20 only needs to be about one inch thick as described above, and can be shrunk by heating for a short time, so there is no need to worry about deteriorating the insulation of the shrinkable tube. do not have.
第１図は本発明の方法の主要工程の状況を示す説明図。 第２図は、モールド式接続方法の一般的説明図である。 １０：ケーブル導体 １２ニスリーブ １４：ケーブル内部半導電層 １６二ケ一ブル絶縁体 １８：補強絶縁体 ２０：半導電層 ２２：絶縁性収縮チューブ ３０：金型 FIG. 1 is an explanatory diagram showing the state of the main steps of the method of the present invention. FIG. 2 is a general explanatory diagram of the molded connection method. 10: Cable conductor 12 sleeve 14: Cable internal semiconducting layer 16 two cable insulator 18: Reinforced insulator 20: Semiconductive layer 22: Insulating shrink tube 30: Mold
Claims (1)
を形成し、その上に補強絶縁体１８を押出しモールドに
より形成する工程を含む、ゴム・プラスチックケーブル
の接続方法において、前記半導電層２０の上に絶縁性収
縮チューブ２２を収縮被覆させ、その上に補強絶縁体１
８を押出しモールドすることを特徴とする、ゴム・プラ
スチックケーブルの接続方法。A semiconducting layer 20 on the connecting sleeve 12 of the cable conductor 10
In the method for connecting a rubber/plastic cable, the method includes a step of forming a reinforcing insulator 18 on the semiconductive layer 20 by extrusion molding. Reinforced insulation 1
8. A method for connecting rubber/plastic cables, characterized by extrusion molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20018585A JPS6260426A (en) | 1985-09-10 | 1985-09-10 | Connecting method for rubber, plastic cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20018585A JPS6260426A (en) | 1985-09-10 | 1985-09-10 | Connecting method for rubber, plastic cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260426A true JPS6260426A (en) | 1987-03-17 |
Family
ID=16420207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20018585A Pending JPS6260426A (en) | 1985-09-10 | 1985-09-10 | Connecting method for rubber, plastic cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260426A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0394030U (en) * | 1990-01-16 | 1991-09-25 |
-
1985
- 1985-09-10 JP JP20018585A patent/JPS6260426A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0394030U (en) * | 1990-01-16 | 1991-09-25 |
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