JPS61199414A - Mold type connection for cv cable - Google Patents

Mold type connection for cv cable

Info

Publication number
JPS61199414A
JPS61199414A JP4016685A JP4016685A JPS61199414A JP S61199414 A JPS61199414 A JP S61199414A JP 4016685 A JP4016685 A JP 4016685A JP 4016685 A JP4016685 A JP 4016685A JP S61199414 A JPS61199414 A JP S61199414A
Authority
JP
Japan
Prior art keywords
layer
insulating layer
edge cutting
semiconducting layer
connection part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4016685A
Other languages
Japanese (ja)
Inventor
正幸 山口
丹野 史郎
英男 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP4016685A priority Critical patent/JPS61199414A/en
Publication of JPS61199414A publication Critical patent/JPS61199414A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 し産業上の利用分野1      ゛ 本発明は、CVクープル用モールド式接続部、特に外部
半導電層を縁切りする絶縁形接続部に関するものである
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application 1 The present invention relates to a molded connection for a CV couple, in particular to an insulated connection for edging an external semiconducting layer.

[従来の技術」 CVケーブル用モールド式接続部は架橋剤入りポリオレ
フ−Cンデープを巻いて架橋成型する方式と、押出機と
成形用金型を用いて押出成型する方式があり、前者の方
式は154KVで実用され、後者の方式は275にV以
上の線路に対し適用されようとしている。これらは長尺
線路への適用となるため、シースの循環電流の低減のた
め所定長さのところで撚架が行なわれ、これを接続部の
外部半導電層を縁切りした絶縁形接続部で行っている。
[Prior art] There are two types of molded connections for CV cables: one is to wrap polyolef-C tape containing a crosslinking agent and crosslink mold it, and the other is to extrude it using an extruder and a molding die. Practical at 154KV, the latter method is about to be applied to lines above 275V. Since these are applied to long lines, twisting is performed at a predetermined length to reduce the circulating current in the sheath, and this is done with an insulated connection part where the outer semiconductive layer of the connection part is cut off. There is.

[発明か解決しようとする問題点J 接続部の外部半導電層の縁切りは、作業性や電気性能の
すぐれた方式か必要とされる。特に縁切りをあらかじめ
成型されたユニットで行なう場合には、該ユニットと合
体させるため接続部の絶縁体層の寸法形状に対し作業し
高度な配慮が必要とされた。このため、接続部の絶縁体
層の形状の如何にかかわらず容易に布設できる縁切りコ
ニツ1〜か望まれていた。
[Problem to be Solved by the Invention J] A method with excellent workability and electrical performance is required for cutting the edges of the external semiconductive layer at the connection portion. In particular, when edge cutting is performed using a pre-molded unit, a high degree of consideration is required to work on the dimensions and shape of the insulating layer at the connecting portion in order to integrate the unit with the unit. For this reason, there has been a demand for edge trimmers 1 that can be easily installed regardless of the shape of the insulating layer at the connection portion.

1問題点を解決Jるための手段1 本発明の要旨は、外部半導電層を縁切りJる:1ニッ1
〜とlノで、何れも加熱収縮1ノ1機能をもった内側が
絶縁層、外側が崖導?i12層の二層で形成され、かつ
その少なくとも一端か所定の曲率に折り返された414
 iZのものを用いたことにある。
Means for Solving Problems 1 The gist of the present invention is to cut the outer semiconducting layer in 1 nick.
~ and l, both have an insulating layer on the inside and a cliff conductor on the outside, both of which have the 1st function of heat shrinkage? 414 formed of two layers of i12 layers, and at least one end of which is folded back to a predetermined curvature.
The reason is that iZ's was used.

即ち、CVケーブル用モールド式接続部、特に外部半導
電層を縁切りする絶縁形接続に於いて、内側が絶縁層、
外側が半4I電層の二層より成る熱収縮性ヂコーブの少
なくと6一端が所定の曲率を右づるように折り返えされ
た構造を持15、該チコーブの熱収縮機11Lによって
接続部絶縁体の中央部トに布設されて出来てた縁切り」
ニラi〜があり、該縁切り二1ニツ1への折り返えされ
ノこ絶縁層上に接続部の外?31i半導電層のハ側の端
部を、該縁切り一〕−ニッ1〜の反対側の?1′導電層
1■に接続部の外部半導電層の相手側の端部を、それそ
2れ接続した構造をもつことを特徴どするCVケーブル
用モールド式接続部にある。
That is, in molded connections for CV cables, especially insulated connections that cut off the outer semiconducting layer, the inside is an insulating layer,
At least 6 of the heat-shrinkable Jicoves, each of which is made of two semi-electrical layers on the outside, have a structure in which one end is folded back to the right with a predetermined curvature. An edge cut that was placed in the center of the body.
There is a leek I~, and the edge cutter 21 is folded back to the saw insulating layer on the outside of the connection part? 31i semiconductive layer on the side opposite to the edges 1] - 1 ~. This molded connection part for a CV cable is characterized in that it has a structure in which two opposite ends of the external semiconductive layer of the connection part are connected to the conductive layer 1' (1).

]作 用1 本発明に用いられる縁切りユニツ1〜は加熱収線↑t(
であるため接続部絶縁体の形状の如何にかかわらず、該
絶縁体上に密着してイb設される。そして、内側が絶縁
層、外側が半8#電層であるため、所定の曲率に折り返
された端部は外側に絶縁層が露出づ−ることになるので
、この−1に接続される外部半導電層は、相手側の外部
半導電層と縁切りされることになるのである。この作業
は容易であり、従来の様な高度な配慮は必要ない。
] Effect 1 The edge cutting unit 1 to used in the present invention has a heating convergence line ↑t(
Therefore, regardless of the shape of the connecting portion insulator, the connecting portion is provided in close contact with the insulator. Since the inner layer is an insulating layer and the outer layer is a half-8 conductive layer, the insulating layer is exposed on the outside at the end that is folded back to a predetermined curvature. The semiconducting layer is separated from the mating external semiconducting layer. This work is easy and does not require the sophisticated consideration required in the past.

1実施例] 第1図は本発明の一実施例の部分断面図第2図は本発明
の他の実施例を示しIこ部分断面図である1゜第3図は
、第1図に用いたZ層形縁切りユニツ1への一構造例の
部分断面図である。
1 Embodiment] FIG. 1 is a partial cross-sectional view of one embodiment of the present invention. FIG. 2 is a partial cross-sectional view of another embodiment of the present invention. FIG. 2 is a partial cross-sectional view of a structural example of the Z-layer edge cutting unit 1.

CVクープル2a、2bの導体を接続し、導体接続色・
にに内部半導電層1を設【ノる。内部半導電層1は半導
電性ポリオレフィン熱収縮チコーブあるいは半導電性ゴ
ム、ポリオレフィン成形ユニツl−<rとで構成される
。その十に絶縁体層5を設()る。絶縁体層55は化学
架橋剤入りポリニlニチレンテ一ブ又はシー1−を積層
巻きJるか、bb<は押出機を押出成形用金型を用いて
所定温度に溶融しlこ化学架橋剤入りポリオレフィンを
押出成型Jるなど所謂モールド式で形成される。ここで
、内側にポリオレノインの絶縁層7外側にポリオレフィ
ンの半導電層6を有刃る二層形縁切りコニツ1〜/Iを
絶縁体層5トの中央部所定位性に設置りる。そして一層
形縁切り一1ニツ1〜4の両側は第1図の如く所定の曲
率に折り曲げられている。揚台によつCは第2図に示す
如<j)側のみ曲率を有する折り曲げ部、他端はス]〜
し・−1への状態でもよい。この絶縁体層5ど縁切り]
−ニラ1〜4土には外部半導電層3が設りられる。
Connect the conductors of CV couple 2a and 2b, and change the conductor connection color and
Then, an internal semiconducting layer 1 is provided. The internal semiconductive layer 1 is composed of a semiconductive polyolefin heat-shrinkable coating, a semiconductive rubber, and a polyolefin molded unit l-<r. An insulator layer 5 is provided on the top. The insulator layer 55 is made by laminating and winding poly(nylene ethylene) or sheet 1- containing a chemical cross-linking agent, or by melting it to a predetermined temperature using an extrusion mold using an extruder. It is formed by a so-called mold method such as extrusion molding of polyolefin. Here, a two-layer edge cutter 1-/I having an insulating layer of polyolenoin on the inside and a semiconductive layer 6 of polyolefin on the outside is installed in a predetermined position in the center of the insulating layer 5. Both sides of the single-layer edge cutters 1 to 4 are bent to a predetermined curvature as shown in FIG. As shown in Figure 2, C attached to the lifting platform has a bent part with a curvature only on the <j) side, and the other end has a curvature.
It may also be in a state of −1. Cut the edges of this insulator layer 5]
- An external semiconducting layer 3 is provided on the leek 1 to 4 soils.

外部半導電層3は半導電性ポリΔレフイン熱収縮ヂ」−
ブ、あるいは半導電性ポリオレフィンのテープもしくは
成型ユニツl〜などで構成される。
The outer semiconductive layer 3 is made of semiconductive polyΔrefin heat-shrinkable material.
or semiconductive polyolefin tapes or molded units.

接続部の外部半導電層3の−・端を二層形縁切りユニッ
ト4の絶縁層7十に乗せて接続し、さらに接続部外部半
導電層3の他端を二層形縁切りユニツ1〜4の半導電層
6」−に乗lて接続する。これにJ−一  4 − り縁切り構造を確立(ることか出来る。また二層形縁切
りユニツ1〜/lは熱収縮機能を有しており、接続部の
絶縁体層5の形状によらり”固定することができる。場
合によっては、二層形縁切り一7−ニツ1〜4に熱収縮
機能がなくでも、あらかじめ加熱し−Cおき、冷に1時
の収縮力で固定配置することもできる。
The ends of the external semiconductive layer 3 of the connection part are placed on the insulating layer 70 of the two-layer edge cutting unit 4 for connection, and the other end of the external semiconductive layer 3 of the connection part is connected to the two-layer edge cutting units 1 to 4. The semi-conducting layer 6''- is multiplied by 1 and connected. With this, it is possible to establish an edge cutting structure.Also, the two-layer edge cutting units 1~/l have a heat shrink function, and depending on the shape of the insulating layer 5 at the connection part. "Can be fixed. In some cases, even if the two-layer edge cutters 1 to 4 do not have a heat shrink function, they can be heated in advance and then cooled and fixed with a shrinkage force of 1 hour. can.

し発明の効果] 本発明にJ、す、接続部の絶縁体層の形状如何にかかわ
らず、熱収縮機能にJζり縁切りユニットを接続部絶縁
体層上に密着布設することが容易に出来る。所定の曲率
をもった縁切り」−ニットの折返し部の絶縁層により縁
切りが確実に出来る。これらによって本発明は電気性能
の優れたかつ信頼性の高い絶縁形続部が容易に得られる
様になった。
[Effects of the Invention] According to the present invention, regardless of the shape of the insulating layer of the connecting portion, the heat-shrinkable edge cutting unit can be easily installed in close contact with the insulating layer of the connecting portion. Edge cutting with a predetermined curvature - The insulating layer on the folded part of the knit allows for reliable edge cutting. As a result of these features, the present invention makes it possible to easily obtain an insulated connection part with excellent electrical performance and high reliability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例を示す部分断面図。 第2図は本発明の他の一実施例を示す部分断面図である
。 第3図は、第1図に用いた二層形縁切りユニツ1〜の−
・構造例の部分断面図である。 1・・・内部半導電層。 2a、2b・CVケーフル。 3・・・接続部の外部半導電層。 4・・・二層形縁切りュニツ]・。 5・・・絶縁体層。 6・・・半導電層。 7・・・絶縁層。
FIG. 1 is a partial sectional view showing one embodiment of the present invention. FIG. 2 is a partial sectional view showing another embodiment of the present invention. Figure 3 shows the -
- It is a partial sectional view of a structural example. 1...Inner semiconducting layer. 2a, 2b・CV cable. 3...Outer semiconducting layer of the connection part. 4...Double-layer edge cut unit]・. 5...Insulator layer. 6... Semiconductive layer. 7...Insulating layer.

Claims (1)

【特許請求の範囲】[Claims] (1)CVケーブル用モールド式接続部、特に外部半導
電層を縁切りする絶縁形接続に於いて、内側が絶縁層、
外側が半導電層の二層より成る熱収縮正チューブの少な
くとも一端が所定の曲率を有するように折り板えされた
構造を持ち、該チューブの熱収縮機能によつて接続部絶
縁体の中央部上に布設さて出来た縁切りユニットがあり
、該縁切りユニットの折り返えされた絶縁層上に接続部
の外部半導電層の片側の端部を、該縁切りユニットの反
対側の半導電層上に接続部の外部半導電層の相手側の端
部を、それぞれ接続した構造をもつことを特徴とするC
Vケーブル用モールド式接続部。
(1) In molded connections for CV cables, especially insulated connections that cut off the outer semiconducting layer, the inside is an insulating layer,
It has a structure in which at least one end of a heat-shrinkable positive tube consisting of two layers of semi-conductive layers on the outside is folded to have a predetermined curvature, and the heat-shrinkable function of the tube allows the central part of the connection insulator to There is an edge cutting unit formed by laying the edges on the folded insulating layer of the edge cutting unit, and one end of the outer semiconducting layer of the connection part is placed on the semiconducting layer on the opposite side of the edge cutting unit. C, characterized in that it has a structure in which the opposite ends of the external semiconducting layer of the connecting part are connected to each other.
Molded connection part for V cable.
JP4016685A 1985-02-28 1985-02-28 Mold type connection for cv cable Pending JPS61199414A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4016685A JPS61199414A (en) 1985-02-28 1985-02-28 Mold type connection for cv cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4016685A JPS61199414A (en) 1985-02-28 1985-02-28 Mold type connection for cv cable

Publications (1)

Publication Number Publication Date
JPS61199414A true JPS61199414A (en) 1986-09-03

Family

ID=12573177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4016685A Pending JPS61199414A (en) 1985-02-28 1985-02-28 Mold type connection for cv cable

Country Status (1)

Country Link
JP (1) JPS61199414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007187607A (en) * 2006-01-16 2007-07-26 Hitachi Cable Ltd Method of manufacturing impact detection optical fiber sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007187607A (en) * 2006-01-16 2007-07-26 Hitachi Cable Ltd Method of manufacturing impact detection optical fiber sensor

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