JPS6258872B2 - - Google Patents
Info
- Publication number
- JPS6258872B2 JPS6258872B2 JP18062983A JP18062983A JPS6258872B2 JP S6258872 B2 JPS6258872 B2 JP S6258872B2 JP 18062983 A JP18062983 A JP 18062983A JP 18062983 A JP18062983 A JP 18062983A JP S6258872 B2 JPS6258872 B2 JP S6258872B2
- Authority
- JP
- Japan
- Prior art keywords
- resin sheet
- resin
- pattern
- abrasive
- abrasive grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 104
- 229920005989 resin Polymers 0.000 claims description 104
- 239000006061 abrasive grain Substances 0.000 claims description 82
- 238000000034 method Methods 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 238000009826 distribution Methods 0.000 description 48
- 238000000227 grinding Methods 0.000 description 42
- 238000005520 cutting process Methods 0.000 description 21
- 238000007747 plating Methods 0.000 description 21
- 238000007639 printing Methods 0.000 description 13
- 238000003475 lamination Methods 0.000 description 11
- 239000000123 paper Substances 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 238000004070 electrodeposition Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000873 masking effect Effects 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011162 core material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18062983A JPS6076965A (ja) | 1983-09-30 | 1983-09-30 | 砥石の製造法 |
| DE19843435595 DE3435595A1 (de) | 1983-09-30 | 1984-09-28 | Verfahren zur herstellung von schleifsteinen |
| GB08424693A GB2149417B (en) | 1983-09-30 | 1984-10-01 | Method of making grinding stones |
| US06/656,372 US4536195A (en) | 1983-09-30 | 1984-10-01 | Method of making grinding stones |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18062983A JPS6076965A (ja) | 1983-09-30 | 1983-09-30 | 砥石の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6076965A JPS6076965A (ja) | 1985-05-01 |
| JPS6258872B2 true JPS6258872B2 (ko) | 1987-12-08 |
Family
ID=16086536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18062983A Granted JPS6076965A (ja) | 1983-09-30 | 1983-09-30 | 砥石の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6076965A (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5151109A (en) * | 1986-04-28 | 1992-09-29 | Kabushiki Kaisha Komatsu Seisakusho | Grinder and method of manufacturing the same |
| JPS62255068A (ja) * | 1986-04-28 | 1987-11-06 | Komatsu Ltd | 砥石の製造法 |
| JPS63288666A (ja) * | 1987-05-19 | 1988-11-25 | Komatsu Ltd | 砥石の製造方法 |
| EP1346797B1 (en) * | 2000-12-21 | 2006-11-08 | Nippon Steel Corporation | Cmp conditioner and method for arranging hard abrasive grains used for cmp conditioner |
| US6811579B1 (en) * | 2002-06-14 | 2004-11-02 | Diamond Innovations, Inc. | Abrasive tools with precisely controlled abrasive array and method of fabrication |
-
1983
- 1983-09-30 JP JP18062983A patent/JPS6076965A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6076965A (ja) | 1985-05-01 |
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