JPS6257670A - リードレス型電子部品の塗布装置 - Google Patents
リードレス型電子部品の塗布装置Info
- Publication number
- JPS6257670A JPS6257670A JP60198280A JP19828085A JPS6257670A JP S6257670 A JPS6257670 A JP S6257670A JP 60198280 A JP60198280 A JP 60198280A JP 19828085 A JP19828085 A JP 19828085A JP S6257670 A JPS6257670 A JP S6257670A
- Authority
- JP
- Japan
- Prior art keywords
- work
- workpiece
- plate
- rubber plate
- paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 239000003973 paint Substances 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 7
- 238000010422 painting Methods 0.000 abstract description 2
- 239000013013 elastic material Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 description 10
- 239000011253 protective coating Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000006128 skin development Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Coating Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60198280A JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60198280A JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6257670A true JPS6257670A (ja) | 1987-03-13 |
JPH0578393B2 JPH0578393B2 (enrdf_load_stackoverflow) | 1993-10-28 |
Family
ID=16388498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60198280A Granted JPS6257670A (ja) | 1985-09-06 | 1985-09-06 | リードレス型電子部品の塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6257670A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01110869U (enrdf_load_stackoverflow) * | 1988-01-13 | 1989-07-26 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4838517U (enrdf_load_stackoverflow) * | 1971-09-09 | 1973-05-12 | ||
JPS5110257A (ja) * | 1974-07-15 | 1976-01-27 | Hitachi Ltd | Juseihagurumasochino kuratsuchikirikaekiko |
JPS5445356U (enrdf_load_stackoverflow) * | 1977-09-06 | 1979-03-29 |
-
1985
- 1985-09-06 JP JP60198280A patent/JPS6257670A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4838517U (enrdf_load_stackoverflow) * | 1971-09-09 | 1973-05-12 | ||
JPS5110257A (ja) * | 1974-07-15 | 1976-01-27 | Hitachi Ltd | Juseihagurumasochino kuratsuchikirikaekiko |
JPS5445356U (enrdf_load_stackoverflow) * | 1977-09-06 | 1979-03-29 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01110869U (enrdf_load_stackoverflow) * | 1988-01-13 | 1989-07-26 |
Also Published As
Publication number | Publication date |
---|---|
JPH0578393B2 (enrdf_load_stackoverflow) | 1993-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |