JPS6257651B2 - - Google Patents
Info
- Publication number
- JPS6257651B2 JPS6257651B2 JP58067196A JP6719683A JPS6257651B2 JP S6257651 B2 JPS6257651 B2 JP S6257651B2 JP 58067196 A JP58067196 A JP 58067196A JP 6719683 A JP6719683 A JP 6719683A JP S6257651 B2 JPS6257651 B2 JP S6257651B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- mold release
- release agent
- acid amide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6719683A JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6719683A JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59191755A JPS59191755A (ja) | 1984-10-30 |
JPS6257651B2 true JPS6257651B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-12-02 |
Family
ID=13337905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6719683A Granted JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59191755A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035351U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-05-31 | 1991-01-18 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06199996A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
JPH06200127A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
JP3319992B2 (ja) * | 1997-09-25 | 2002-09-03 | 松下電工株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP2002265571A (ja) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2002275245A (ja) * | 2001-03-19 | 2002-09-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
JPS5652941A (en) * | 1979-10-08 | 1981-05-12 | Nissan Motor Co Ltd | Receiving device for vehicle |
JPS5875853A (ja) * | 1981-10-30 | 1983-05-07 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1983
- 1983-04-15 JP JP6719683A patent/JPS59191755A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035351U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-05-31 | 1991-01-18 |
Also Published As
Publication number | Publication date |
---|---|
JPS59191755A (ja) | 1984-10-30 |