JPS6249885B2 - - Google Patents
Info
- Publication number
- JPS6249885B2 JPS6249885B2 JP58067195A JP6719583A JPS6249885B2 JP S6249885 B2 JPS6249885 B2 JP S6249885B2 JP 58067195 A JP58067195 A JP 58067195A JP 6719583 A JP6719583 A JP 6719583A JP S6249885 B2 JPS6249885 B2 JP S6249885B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- wax
- acid
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719583A JPS59191754A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719583A JPS59191754A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59191754A JPS59191754A (ja) | 1984-10-30 |
| JPS6249885B2 true JPS6249885B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-10-21 |
Family
ID=13337876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6719583A Granted JPS59191754A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59191754A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11141887B2 (en) | 2016-05-10 | 2021-10-12 | Fujifilm Corporation | Production method of mold having recessed pattern, and manufacturing method of pattern sheet |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06199996A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JP4788053B2 (ja) * | 2001-03-27 | 2011-10-05 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 |
| TW201840801A (zh) * | 2017-03-28 | 2018-11-16 | 日商日立化成股份有限公司 | 密封用環氧樹脂組成物及電子零件裝置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS5652941A (en) * | 1979-10-08 | 1981-05-12 | Nissan Motor Co Ltd | Receiving device for vehicle |
| JPS5875853A (ja) * | 1981-10-30 | 1983-05-07 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1983
- 1983-04-15 JP JP6719583A patent/JPS59191754A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11141887B2 (en) | 2016-05-10 | 2021-10-12 | Fujifilm Corporation | Production method of mold having recessed pattern, and manufacturing method of pattern sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59191754A (ja) | 1984-10-30 |