JPS6257428B2 - - Google Patents
Info
- Publication number
- JPS6257428B2 JPS6257428B2 JP56025873A JP2587381A JPS6257428B2 JP S6257428 B2 JPS6257428 B2 JP S6257428B2 JP 56025873 A JP56025873 A JP 56025873A JP 2587381 A JP2587381 A JP 2587381A JP S6257428 B2 JPS6257428 B2 JP S6257428B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- nozzle
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 116
- 238000005476 soldering Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 18
- 230000004907 flux Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 230000007547 defect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2587381A JPS57139993A (en) | 1981-02-23 | 1981-02-23 | Method and device for soldering printed board |
| EP81109568A EP0058766B1 (en) | 1981-02-23 | 1981-11-07 | Soldering apparatus |
| DE8181109568T DE3171729D1 (en) | 1981-02-23 | 1981-11-07 | Soldering apparatus |
| CA000389728A CA1190095A (en) | 1981-02-23 | 1981-11-09 | Soldering apparatus |
| US06/920,142 US4824010A (en) | 1980-12-26 | 1986-10-17 | Process and apparatus for soldering printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2587381A JPS57139993A (en) | 1981-02-23 | 1981-02-23 | Method and device for soldering printed board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25408788A Division JPH01132198A (ja) | 1988-10-07 | 1988-10-07 | プリント基板の半田付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57139993A JPS57139993A (en) | 1982-08-30 |
| JPS6257428B2 true JPS6257428B2 (US07943777-20110517-C00090.png) | 1987-12-01 |
Family
ID=12177901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2587381A Granted JPS57139993A (en) | 1980-12-26 | 1981-02-23 | Method and device for soldering printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57139993A (US07943777-20110517-C00090.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271917U (US07943777-20110517-C00090.png) * | 1985-10-23 | 1987-05-08 | ||
| JPH02101626U (US07943777-20110517-C00090.png) * | 1989-01-30 | 1990-08-13 | ||
| JP2010267786A (ja) * | 2009-05-14 | 2010-11-25 | Denso Corp | はんだ付け装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5958566U (ja) * | 1982-10-07 | 1984-04-17 | 株式会社タムラ製作所 | 噴流式はんだ付け装置 |
| JPS6415995A (en) * | 1987-07-10 | 1989-01-19 | Kenji Kondo | Method of soldering printed wiring board |
| JPH01132198A (ja) * | 1988-10-07 | 1989-05-24 | Matsushita Electric Ind Co Ltd | プリント基板の半田付方法 |
| CN105057828A (zh) * | 2013-08-06 | 2015-11-18 | 熊菊莲 | 带有双波峰喷口的波峰焊机 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035046A (US07943777-20110517-C00090.png) * | 1973-08-01 | 1975-04-03 | ||
| JPS5051449A (US07943777-20110517-C00090.png) * | 1973-09-07 | 1975-05-08 | ||
| JPS5612568B2 (US07943777-20110517-C00090.png) * | 1978-02-10 | 1981-03-23 | ||
| JPS56163073A (en) * | 1980-05-19 | 1981-12-15 | Alps Electric Co Ltd | Soldering device |
| JPS5744434A (en) * | 1980-08-28 | 1982-03-12 | Nippon Alum Mfg Co Ltd:The | Aging apparatus of piece coated with sealing agent |
| JPS57115970A (en) * | 1981-01-06 | 1982-07-19 | Matsushita Electric Ind Co Ltd | Soldering method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5612568U (US07943777-20110517-C00090.png) * | 1979-07-05 | 1981-02-03 |
-
1981
- 1981-02-23 JP JP2587381A patent/JPS57139993A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5035046A (US07943777-20110517-C00090.png) * | 1973-08-01 | 1975-04-03 | ||
| JPS5051449A (US07943777-20110517-C00090.png) * | 1973-09-07 | 1975-05-08 | ||
| JPS5612568B2 (US07943777-20110517-C00090.png) * | 1978-02-10 | 1981-03-23 | ||
| JPS56163073A (en) * | 1980-05-19 | 1981-12-15 | Alps Electric Co Ltd | Soldering device |
| JPS5744434A (en) * | 1980-08-28 | 1982-03-12 | Nippon Alum Mfg Co Ltd:The | Aging apparatus of piece coated with sealing agent |
| JPS57115970A (en) * | 1981-01-06 | 1982-07-19 | Matsushita Electric Ind Co Ltd | Soldering method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271917U (US07943777-20110517-C00090.png) * | 1985-10-23 | 1987-05-08 | ||
| JPH02101626U (US07943777-20110517-C00090.png) * | 1989-01-30 | 1990-08-13 | ||
| JP2010267786A (ja) * | 2009-05-14 | 2010-11-25 | Denso Corp | はんだ付け装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57139993A (en) | 1982-08-30 |
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