JPS625648U - - Google Patents
Info
- Publication number
- JPS625648U JPS625648U JP9667185U JP9667185U JPS625648U JP S625648 U JPS625648 U JP S625648U JP 9667185 U JP9667185 U JP 9667185U JP 9667185 U JP9667185 U JP 9667185U JP S625648 U JPS625648 U JP S625648U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- integrated circuit
- circuit board
- printed circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667185U JPS625648U (fr) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9667185U JPS625648U (fr) | 1985-06-27 | 1985-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS625648U true JPS625648U (fr) | 1987-01-14 |
Family
ID=30962661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9667185U Pending JPS625648U (fr) | 1985-06-27 | 1985-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS625648U (fr) |
-
1985
- 1985-06-27 JP JP9667185U patent/JPS625648U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS625648U (fr) | ||
JPH0217854U (fr) | ||
JPS6273549U (fr) | ||
JPS6094861U (ja) | 印刷回路装置 | |
JPS6338368U (fr) | ||
JPS61136576U (fr) | ||
JPS58128589U (ja) | 集積回路部品用ソケツト | |
JPS6052632U (ja) | 電力用半導体素子 | |
JPS62201941U (fr) | ||
JPS59180438U (ja) | 半導体集積回路装置 | |
JPS5958947U (ja) | 半導体素子取付装置 | |
JPH0158955U (fr) | ||
JPH0262769U (fr) | ||
JPH0166763U (fr) | ||
JPS6387884U (fr) | ||
JPS5872845U (ja) | 半導体装置 | |
JPS594646U (ja) | 放熱板の取付装置 | |
JPS6393601U (fr) | ||
JPH02137052U (fr) | ||
JPS62128674U (fr) | ||
JPS5877060U (ja) | 電子部品 | |
JPS6144871U (ja) | トランジスタのプリント基板への取付構造 | |
JPS63170981U (fr) | ||
JPH0367500U (fr) | ||
JPS59103449U (ja) | 半導体パツケ−ジの実装構造 |