JPS6255143U - - Google Patents
Info
- Publication number
- JPS6255143U JPS6255143U JP14726885U JP14726885U JPS6255143U JP S6255143 U JPS6255143 U JP S6255143U JP 14726885 U JP14726885 U JP 14726885U JP 14726885 U JP14726885 U JP 14726885U JP S6255143 U JPS6255143 U JP S6255143U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- lead wire
- diaphragm
- wall surface
- electrode part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図、第２図は本考案に係るダイアフラム型
半導体圧力センサの断面を示す平面図と斜視図、
第３図はダイアフラムの平面図、第４図ａ，ｂは
台座の断面図と上面図、第５図に台座の裏面に形
成されているリードパターンの様子を示す図、第
６図は台座とダイアフラムの接着面の一部断面図
、第７図はダイアフラム型半導体圧力センサの斜
視図、第８図は従来のダイアフラム型半導体圧力
センサを示す図である。
１……ダイアフラム型半導体圧力センサ、２…
…台座、２ｂ……ザグリ部、３……ダイアフラム
、５……第２の筒体、６……第１の筒体、７……
蓋部材、８ａ，８ｂ……溝、９……リードパター
ン、９ａ……ワイヤボンド部、９ｂ……半田付け
部、９ｃ……連絡部、１４……リード線。
1 and 2 are a plan view and a perspective view showing a cross section of a diaphragm type semiconductor pressure sensor according to the present invention,
Figure 3 is a plan view of the diaphragm, Figures 4a and b are a cross-sectional view and top view of the pedestal, Figure 5 is a diagram showing the lead pattern formed on the back of the pedestal, and Figure 6 is a diagram showing the pedestal and the top view. FIG. 7 is a perspective view of a diaphragm type semiconductor pressure sensor, and FIG. 8 is a diagram showing a conventional diaphragm type semiconductor pressure sensor. 1...Diaphragm type semiconductor pressure sensor, 2...
...Pedestal, 2b...Counterbore, 3...Diaphragm, 5...Second cylindrical body, 6...First cylindrical body, 7...
Lid member, 8a, 8b...Groove, 9...Lead pattern, 9a...Wire bond part, 9b...Soldering part, 9c...Connection part, 14...Lead wire.
Claims (1)
れ、ケーシング内に位置決め固定されるダイアフ
ラムと、 一端が上記ダイアフラムの電極部に通ずるとと
もに、他端がケーシング外に引き出されるリード
線と、 ケーシングに位置決め固定されることによつて
、ケーシング壁面と対抗してリード線の屈曲した
通路を形成する壁面を有する部材とを備え、 該部材とケーシングによつて形成される上記通
路にリード線をはさみ込んだ状態でリード線をケ
ーシングにより引き出すことを特徴とするダイア
フラム型半導体圧力センサ。[Claims for Utility Model Registration] A diaphragm patterned with a strain gauge part and an electrode part, positioned and fixed inside a casing, and a lead wire with one end leading to the electrode part of the diaphragm and the other end leading out of the casing. and a member having a wall surface that forms a bent passage for the lead wire in opposition to the casing wall surface by being positioned and fixed to the casing, and the lead wire is inserted into the passage formed by the member and the casing. A diaphragm type semiconductor pressure sensor characterized by a lead wire that is pulled out through a casing while the wire is sandwiched between the wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726885U JPS6255143U (en) | 1985-09-26 | 1985-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14726885U JPS6255143U (en) | 1985-09-26 | 1985-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255143U true JPS6255143U (en) | 1987-04-06 |
Family
ID=31060479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14726885U Pending JPS6255143U (en) | 1985-09-26 | 1985-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014016332A (en) * | 2012-06-11 | 2014-01-30 | Saginomiya Seisakusho Inc | Pressure sensor and method for manufacturing the pressure sensor |
-
1985
- 1985-09-26 JP JP14726885U patent/JPS6255143U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014016332A (en) * | 2012-06-11 | 2014-01-30 | Saginomiya Seisakusho Inc | Pressure sensor and method for manufacturing the pressure sensor |