JPS6254001A - Production of target for sputtering - Google Patents

Abstract

PURPOSE:To attain >=99% filling rate and <=0.1wt% oxygen content when a target used in a sputtering apparatus is produced, by subjecting a composition for the target to melting, cooling and crushing and by caking the resulting powder by explosive pressure bonding. CONSTITUTION:When a target used in a sputtering apparatus for forming a thin film is produced, a composition for the target is melted, cooled and crushed. The resulting powder 4 such as TbFe alloy powder is put in a metallic mold 1 and a metallic plate 3 for pressure bonding and an explosive 2 are successively placed on the powder 4. The explosive 2 is ignited and exploded. By this explosion, pressure is instantaneously applied to the powder 4 through the metallic plate 3, so the powder 4 is caked.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a target used in a sputtering apparatus.

[Summary of invention O]

The present invention is a method for manufacturing a target O for squirrel battering to create a thin film.
After pulverizing to form powder f', the powder is solidified by explosive compression, which increases the filling rate of the target.
Furthermore, the amount of gas (N2, etc.) in the target is reduced, and the film properties can be improved.

[Conventional technology]

In the conventional manufacturing method of sputtering targets, if the composition can be alloyed and does not create intermetallic compounds, it is sufficient to melt it, put it in a mold, cool it, and polish it, and there is no problem with the filling rate. There was no problem with the gas inside. However, in recent years, there has been a demand from the market for the production of recombinant targets that facilitate the production of intermetallic compounds, but in contrast, the conventional target manufacturing method results in the targets falling apart during the melting, casting, and cooling stages.

This is because it is easy to form intermetallic compounds and is therefore very brittle.

Therefore, the sintering method has been selected so far.

This process involves melting, cooling, and pulverizing the tarcut composition to produce powder.
After applying 'lE[ilZ', the powder is put into a mold and baked while applying pressure.

This method can be applied to create an alloy recombination target 0 that is easy to create intermetallic compounds, brittle, and difficult to oxidize. Not applicable.

The next method considered is that it is basically the same as the sintering method described above, but during the sintering process O, the vacuum is evacuated once, and then Af gas is replaced, and sintering is performed in an Ar gas atmosphere. [7]However, the prior art method of sintering in a DAr gas atmosphere can prevent oxidation to a certain extent, but it is not sufficient. In particular, with rare earth-transition gold PAf gold used for magneto-optical recording, the amount of oxygen in the target becomes a problem, so it is still insufficient.

Furthermore, due to the special condition that the process itself is carried out in an Af gas atmosphere, it is costly and has rough spots.

Therefore, the present invention is intended to solve the above problems, and its purpose is to create an alloy target with a sufficiently low oxygen content and a high filling rate even though the alloy composition is easily oxidized and brittle. , and at the same time aims to reduce costs.

[O means to solve the problem]

The method of manufacturing a sputtering target according to the present invention is to melt, cool, and pulverize target D composition to create a powder, and then solidify the powder by explosive compression bonding in manufacturing a target used in a sputtering device for creating a thin film. It is characterized by

[Effect]

According to the above configuration of the present invention, the target O composition is melted, cooled, and pulverized, the resulting powder is put into a mold, and a metal object is collided with the powder at a speed of IKp/sec or more. It is crimped and can be done at room temperature without applying heat, so it will not oxidize, and the filling rate is 99% due to explosive power.
In addition to the above, since the process of exchanging Ar gas in the prior art can be omitted, costs can be reduced at the same time.

〔Example〕

In this example, a TbF alloy target used for magneto-optical recording was created. Figure 1 is a manufacturing process diagram of a target by explosive crimping in the embodiment of the present invention, where (a) shows the state before exploding, and (b) shows the state after exploding.
1 is a mold, 2 is gunpowder, 3 is a metal plate for crimping, 4 is T6Fl
1 alloy powder, 5 Tb? g alloy.

First, to make Tb-7g0 alloy powder, Tb, ? ,
It is melted in a vacuum melting furnace at a composition ratio of 71 Iwt, and after cooling, it is taken out from the furnace and pulverized in oil. After deoiling the powder, TbF and alloy powder 4 are placed in mold 1. Furthermore, when the crimping metal plate 3 and the gunpowder 2 are placed on the powder Q, and the gunpowder is ignited with an ignition source and exploded, pressure is momentarily applied to the T6F6 alloy powder by the crimping metal plate, and the powders are crimped together. An alloy can be made.

TbF produced in this manner, and TbF' produced using an alloy target and the conventional method (sintering in an Ar gas atmosphere).

Table 1 shows a comparison of alloy targets.

From the results shown in Table 1, the target prepared by the present invention has better filling rate and oxygen content than the conventional method.

Also, the target shown in Table 1? Using this material, a TbF magneto-optical recording medium was fabricated by sputtering. And that ■
FIG. 2 is a Kerr hysteresis diagram obtained by measuring the Kerr rotation angle i% of the film. (α) is F, target is T
(b) is a film sputtered using the chip device in (b), and (b) is a film using a target with P′F=■ by the method of the present invention.
(C) is a film using a target prepared by the conventional method.Of course, the film set FiX is (α),
(b) and (c) are the same, and Tbrich
■The membrane is closed. In addition, the horizontal axis of the Kerr hysteresis of and shows the applied rrli field, and the vertical axis shows the entire Kerr rotation angle. (b) by the method of the present invention shows the same hysteresis as (α), and was created by the method of the present invention. It can be seen that there is no problem with the oxygen content in the target. However, according to the conventional method, (c) has a larger coercive force and a smaller Kerr rotation angle than ←). This is because a portion of the Tb was oxidized because there were many oxygen meters in the target prepared by the conventional method. As shown in the above, the magneto-optical recording medium using the target according to the present invention has superior characteristics compared to the conventional method, and has a 1.e
This is the same as placing a Tb chip on the target.

〔Effect of the invention〕

As described above, according to the present invention, by explosively bonding the powder and solidifying it, the filling rate of the target becomes 99 cm or more, and the oxygen concentration in the target is 0.1 wt%.
It becomes below. Furthermore, the process of sintering in an atmosphere surrounding the Ar gas buds in the conventional method can be omitted, leading to cost reduction.

The alloy composition used in the examples is T for magneto-optical recording.
b-P, but in addition to this, Tb-F'g-co
, Gd-Tb-1,, Gd-Tb-FB-cm.

It goes without saying that combinations of heavy rare earth metals and transition metals such as Gd-c (, Tb-co, etc.), as well as combinations with addition of light rare earth elements such as Nd and Bmm, have a satisfactory Q, and furthermore, for magneto-optical recording. All of these methods are effective for producing not only targets but also alloy targets that are easily oxidized.

[Brief explanation of drawings]

Revision 1 (α) and (b) are the production process diagrams of Targera)D by explosive crimping, and 2nd edition (α) to (c) are Kerr hysteresis diagrams 1... Mold 2... Gunpowder 3... Metal plate for fist compression 4...Tl) 15 alloy powder 5φ...76F, alloy or higher

Claims (1)

[Claims] In the production of a target used in a sputtering device for producing a thin film, the composition of the target is melted, cooled, and pulverized to create a powder, and then the powder is solidified by explosive compression bonding. Production method.