JPS6252963U - - Google Patents

Info

Publication number
JPS6252963U
JPS6252963U JP14531485U JP14531485U JPS6252963U JP S6252963 U JPS6252963 U JP S6252963U JP 14531485 U JP14531485 U JP 14531485U JP 14531485 U JP14531485 U JP 14531485U JP S6252963 U JPS6252963 U JP S6252963U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor laser
connecting body
element connecting
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14531485U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14531485U priority Critical patent/JPS6252963U/ja
Publication of JPS6252963U publication Critical patent/JPS6252963U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案半導体レーザ用ヒー
トシンクの実施に一例を示すもので、第1図は分
解斜視図、第2図Aは平面図、同図Bは同図Aの
B―B線に沿う断面図、同図Cは同図AのC―C
線に沿う断面図、第3図A,Bは本考案半導体レ
ーザ用ヒートシンクの他の各別の実施例を示す斜
視図、第4図及び第5図は従来例の一を示すもの
で、第4図は斜視図、第5図は縦断面図である。 符号の説明、1,1a,1b……ヒートシンク
、4,4a,4b……素子接続体。
1 and 2 show an example of the implementation of the heat sink for a semiconductor laser according to the present invention. FIG. 1 is an exploded perspective view, FIG. 2 A is a plan view, and FIG. A cross-sectional view along the line, C is C-C in A of the same figure.
3A and 3B are perspective views showing other embodiments of the semiconductor laser heat sink of the present invention, and FIGS. 4 and 5 show one of the conventional examples. 4 is a perspective view, and FIG. 5 is a longitudinal sectional view. Explanation of symbols: 1, 1a, 1b... heat sink, 4, 4a, 4b... element connection body.

Claims (1)

【実用新案登録請求の範囲】 レーザダイオード素子がボンデイングされる素
子接続体が一方の表面に一体に形成された半導体
レーザ用ヒートシンクにおいて、 上記素子接続体はその両外側面の間が基部から
先端側へ行くに従つて狭くなるように形成されて
なる ことを特徴とする半導体レーザ用ヒートシンク。
[Claims for Utility Model Registration] In a heat sink for a semiconductor laser in which an element connecting body to which a laser diode element is bonded is integrally formed on one surface, the element connecting body has a portion between both outer surfaces thereof from the base to the tip side. A heat sink for a semiconductor laser, characterized in that the heat sink is formed so as to become narrower toward the end.
JP14531485U 1985-09-24 1985-09-24 Pending JPS6252963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14531485U JPS6252963U (en) 1985-09-24 1985-09-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14531485U JPS6252963U (en) 1985-09-24 1985-09-24

Publications (1)

Publication Number Publication Date
JPS6252963U true JPS6252963U (en) 1987-04-02

Family

ID=31056738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14531485U Pending JPS6252963U (en) 1985-09-24 1985-09-24

Country Status (1)

Country Link
JP (1) JPS6252963U (en)

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