JPS6251742U - - Google Patents

Info

Publication number
JPS6251742U
JPS6251742U JP1985142783U JP14278385U JPS6251742U JP S6251742 U JPS6251742 U JP S6251742U JP 1985142783 U JP1985142783 U JP 1985142783U JP 14278385 U JP14278385 U JP 14278385U JP S6251742 U JPS6251742 U JP S6251742U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor chip
chip
bump members
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985142783U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985142783U priority Critical patent/JPS6251742U/ja
Publication of JPS6251742U publication Critical patent/JPS6251742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141—Disposition
    • H01L2224/1412—Layout
    • H01L2224/1414—Circular array, i.e. array with radial symmetry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1985142783U 1985-09-20 1985-09-20 Pending JPS6251742U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985142783U JPS6251742U (ko) 1985-09-20 1985-09-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985142783U JPS6251742U (ko) 1985-09-20 1985-09-20

Publications (1)

Publication Number Publication Date
JPS6251742U true JPS6251742U (ko) 1987-03-31

Family

ID=31051838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985142783U Pending JPS6251742U (ko) 1985-09-20 1985-09-20

Country Status (1)

Country Link
JP (1) JPS6251742U (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119740A (ja) * 1989-10-02 1991-05-22 Hitachi Ltd 液晶ディスプレイ装置用半導体装置
JPH03159144A (ja) * 1989-11-16 1991-07-09 Hitachi Ltd 半導体装置
JPH05175274A (ja) * 1991-12-26 1993-07-13 Matsushita Electric Ind Co Ltd チップ部品
JP2010529673A (ja) * 2007-06-07 2010-08-26 シリコン・ワークス・カンパニー・リミテッド 半導体チップのパッド配置構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119740A (ja) * 1989-10-02 1991-05-22 Hitachi Ltd 液晶ディスプレイ装置用半導体装置
JPH03159144A (ja) * 1989-11-16 1991-07-09 Hitachi Ltd 半導体装置
JPH05175274A (ja) * 1991-12-26 1993-07-13 Matsushita Electric Ind Co Ltd チップ部品
JP2010529673A (ja) * 2007-06-07 2010-08-26 シリコン・ワークス・カンパニー・リミテッド 半導体チップのパッド配置構造

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