JPS6249885B2 - - Google Patents

Info

Publication number
JPS6249885B2
JPS6249885B2 JP58067195A JP6719583A JPS6249885B2 JP S6249885 B2 JPS6249885 B2 JP S6249885B2 JP 58067195 A JP58067195 A JP 58067195A JP 6719583 A JP6719583 A JP 6719583A JP S6249885 B2 JPS6249885 B2 JP S6249885B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
wax
acid
mold release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58067195A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59191754A (ja
Inventor
Munetomo Torii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6719583A priority Critical patent/JPS59191754A/ja
Publication of JPS59191754A publication Critical patent/JPS59191754A/ja
Publication of JPS6249885B2 publication Critical patent/JPS6249885B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6719583A 1983-04-15 1983-04-15 エポキシ樹脂組成物 Granted JPS59191754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6719583A JPS59191754A (ja) 1983-04-15 1983-04-15 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6719583A JPS59191754A (ja) 1983-04-15 1983-04-15 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59191754A JPS59191754A (ja) 1984-10-30
JPS6249885B2 true JPS6249885B2 (enrdf_load_stackoverflow) 1987-10-21

Family

ID=13337876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6719583A Granted JPS59191754A (ja) 1983-04-15 1983-04-15 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59191754A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11141887B2 (en) 2016-05-10 2021-10-12 Fujifilm Corporation Production method of mold having recessed pattern, and manufacturing method of pattern sheet

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06199996A (ja) * 1993-01-07 1994-07-19 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JP4788053B2 (ja) * 2001-03-27 2011-10-05 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
TW201840801A (zh) * 2017-03-28 2018-11-16 日商日立化成股份有限公司 密封用環氧樹脂組成物及電子零件裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5652941A (en) * 1979-10-08 1981-05-12 Nissan Motor Co Ltd Receiving device for vehicle
JPS5875853A (ja) * 1981-10-30 1983-05-07 Toshiba Corp 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11141887B2 (en) 2016-05-10 2021-10-12 Fujifilm Corporation Production method of mold having recessed pattern, and manufacturing method of pattern sheet

Also Published As

Publication number Publication date
JPS59191754A (ja) 1984-10-30

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