JPS6249292U - - Google Patents
Info
- Publication number
- JPS6249292U JPS6249292U JP13058185U JP13058185U JPS6249292U JP S6249292 U JPS6249292 U JP S6249292U JP 13058185 U JP13058185 U JP 13058185U JP 13058185 U JP13058185 U JP 13058185U JP S6249292 U JPS6249292 U JP S6249292U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- electronic component
- cooling plate
- tips
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案の従来例を示す断面図であり、図中、
１はプリント基板、２は冷却板、４，４′は冷却
片、５は電子部品である。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example of the present invention, and in the figure,
1 is a printed circuit board, 2 is a cooling plate, 4 and 4' are cooling pieces, and 5 is an electronic component.
Claims (1)
却するための構造であつて、 ・上記プリント基板１の部品実装面に対向して平
行に設置されその内部に冷媒を循環して冷却され
る冷却板２と、 ・該冷却板２の表面から上記電子部品対応の位置
に突出して、Ｕ字状に弾性をもつて形成される熱
伝導体より成る冷却片４，４′を備え、 ・該冷却片４，４′の先端部が上記電子部品５の
上面に接触するとともに、該先端部は電子部品側
に凸に湾曲した曲面を有するよう成形されている
こと を特徴とする電子部品の冷却構造。[Claims for Utility Model Registration] A structure for cooling electronic components 5 mounted on a printed circuit board 1, which is installed parallel to the component mounting surface of the printed circuit board 1 and has a refrigerant inside. A cooling plate 2 that is cooled by circulating the cooling plate 2; - A cooling piece 4 made of a heat conductor and formed elastically in a U-shape, protruding from the surface of the cooling plate 2 at a position corresponding to the electronic component; 4'; - The tips of the cooling pieces 4, 4' are in contact with the upper surface of the electronic component 5, and the tips are formed to have a curved surface convex toward the electronic component. Features a cooling structure for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13058185U JPH0310703Y2 (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13058185U JPH0310703Y2 (en) | 1985-08-27 | 1985-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6249292U true JPS6249292U (en) | 1987-03-26 |
| JPH0310703Y2 JPH0310703Y2 (en) | 1991-03-15 |
Family
ID=31028215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13058185U Expired JPH0310703Y2 (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310703Y2 (en) |
-
1985
- 1985-08-27 JP JP13058185U patent/JPH0310703Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310703Y2 (en) | 1991-03-15 |
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