JPS6249276U - - Google Patents
Info
- Publication number
- JPS6249276U JPS6249276U JP14023885U JP14023885U JPS6249276U JP S6249276 U JPS6249276 U JP S6249276U JP 14023885 U JP14023885 U JP 14023885U JP 14023885 U JP14023885 U JP 14023885U JP S6249276 U JPS6249276 U JP S6249276U
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- land
- wiring board
- printed wiring
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023885U JPS6249276U (US20030204162A1-20031030-M00001.png) | 1985-09-13 | 1985-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14023885U JPS6249276U (US20030204162A1-20031030-M00001.png) | 1985-09-13 | 1985-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6249276U true JPS6249276U (US20030204162A1-20031030-M00001.png) | 1987-03-26 |
Family
ID=31046898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14023885U Pending JPS6249276U (US20030204162A1-20031030-M00001.png) | 1985-09-13 | 1985-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6249276U (US20030204162A1-20031030-M00001.png) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121176A (US20030204162A1-20031030-M00001.png) * | 1973-03-28 | 1974-11-19 | ||
| JPS5235484U (US20030204162A1-20031030-M00001.png) * | 1975-09-05 | 1977-03-12 | ||
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5583294A (en) * | 1978-12-20 | 1980-06-23 | Fujitsu Ltd | Method of fabricating multilayer printed board |
| JPS5921096A (ja) * | 1982-07-27 | 1984-02-02 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
| JPS5969997A (ja) * | 1982-10-15 | 1984-04-20 | 松下電工株式会社 | 多層プリント配線板の製造方法 |
| JPS59202690A (ja) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | 多層印刷配線板 |
| JPS60109297A (ja) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | プリント板の製造方法 |
| JPS60130883A (ja) * | 1983-12-19 | 1985-07-12 | 中央銘板工業株式会社 | 多層印刷配線板 |
-
1985
- 1985-09-13 JP JP14023885U patent/JPS6249276U/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121176A (US20030204162A1-20031030-M00001.png) * | 1973-03-28 | 1974-11-19 | ||
| JPS5235484U (US20030204162A1-20031030-M00001.png) * | 1975-09-05 | 1977-03-12 | ||
| JPS52110472A (en) * | 1976-03-11 | 1977-09-16 | Takatsugu Komatsu | Printed circuit substrate |
| JPS5583294A (en) * | 1978-12-20 | 1980-06-23 | Fujitsu Ltd | Method of fabricating multilayer printed board |
| JPS5921096A (ja) * | 1982-07-27 | 1984-02-02 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
| JPS5969997A (ja) * | 1982-10-15 | 1984-04-20 | 松下電工株式会社 | 多層プリント配線板の製造方法 |
| JPS59202690A (ja) * | 1983-05-04 | 1984-11-16 | 松下電工株式会社 | 多層印刷配線板 |
| JPS60109297A (ja) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | プリント板の製造方法 |
| JPS60130883A (ja) * | 1983-12-19 | 1985-07-12 | 中央銘板工業株式会社 | 多層印刷配線板 |
