JPS6249245U - - Google Patents
Info
- Publication number
- JPS6249245U JPS6249245U JP1985122952U JP12295285U JPS6249245U JP S6249245 U JPS6249245 U JP S6249245U JP 1985122952 U JP1985122952 U JP 1985122952U JP 12295285 U JP12295285 U JP 12295285U JP S6249245 U JPS6249245 U JP S6249245U
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- connecting portion
- view
- package body
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/01—
-
- H10W74/111—
-
- H10W70/429—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H10W74/00—
-
- H10W74/10—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985122952U JPH0325410Y2 (cg-RX-API-DMAC10.html) | 1985-08-10 | 1985-08-10 | |
| KR1019860006353A KR900001987B1 (ko) | 1985-08-10 | 1986-08-01 | 집적회로용 패케이지 |
| US06/894,149 US4724280A (en) | 1985-08-10 | 1986-08-07 | Package for integrated circuit |
| EP86111059A EP0212521B1 (en) | 1985-08-10 | 1986-08-11 | Package for integrated circuit |
| DE8686111059T DE3679473D1 (de) | 1985-08-10 | 1986-08-11 | Packung fuer integrierte schaltung. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985122952U JPH0325410Y2 (cg-RX-API-DMAC10.html) | 1985-08-10 | 1985-08-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6249245U true JPS6249245U (cg-RX-API-DMAC10.html) | 1987-03-26 |
| JPH0325410Y2 JPH0325410Y2 (cg-RX-API-DMAC10.html) | 1991-06-03 |
Family
ID=14848683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985122952U Expired JPH0325410Y2 (cg-RX-API-DMAC10.html) | 1985-08-10 | 1985-08-10 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4724280A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0212521B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPH0325410Y2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR900001987B1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE3679473D1 (cg-RX-API-DMAC10.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005070A (en) * | 1988-12-19 | 1991-04-02 | Hewlett-Packard Company | Soldering interconnect method and apparatus for semiconductor packages |
| US4989069A (en) * | 1990-01-29 | 1991-01-29 | Motorola, Inc. | Semiconductor package having leads that break-away from supports |
| US6376921B1 (en) * | 1995-11-08 | 2002-04-23 | Fujitsu Limited | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| US6072239A (en) * | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
| US6329711B1 (en) | 1995-11-08 | 2001-12-11 | Fujitsu Limited | Semiconductor device and mounting structure |
| US6159770A (en) * | 1995-11-08 | 2000-12-12 | Fujitsu Limited | Method and apparatus for fabricating semiconductor device |
| JP3026426B2 (ja) * | 1996-08-29 | 2000-03-27 | 沖電気工業株式会社 | 樹脂封止型半導体装置とその製造方法及びその金型構造 |
| JP3842444B2 (ja) | 1998-07-24 | 2006-11-08 | 富士通株式会社 | 半導体装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| US4089575A (en) * | 1976-09-27 | 1978-05-16 | Amp Incorporated | Connector for connecting a circuit element to the surface of a substrate |
| US4465898A (en) * | 1981-07-27 | 1984-08-14 | Texas Instruments Incorporated | Carrier for integrated circuit |
| US4495376A (en) * | 1981-07-27 | 1985-01-22 | Texas Instruments Incorporated | Carrier for integrated circuit |
| US4463217A (en) * | 1981-09-14 | 1984-07-31 | Texas Instruments Incorporated | Plastic surface mounted high pinout integrated circuit package |
| JPS58169948A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 樹脂封止型半導体装置 |
-
1985
- 1985-08-10 JP JP1985122952U patent/JPH0325410Y2/ja not_active Expired
-
1986
- 1986-08-01 KR KR1019860006353A patent/KR900001987B1/ko not_active Expired
- 1986-08-07 US US06/894,149 patent/US4724280A/en not_active Expired - Fee Related
- 1986-08-11 DE DE8686111059T patent/DE3679473D1/de not_active Expired - Lifetime
- 1986-08-11 EP EP86111059A patent/EP0212521B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4724280A (en) | 1988-02-09 |
| EP0212521A1 (en) | 1987-03-04 |
| JPH0325410Y2 (cg-RX-API-DMAC10.html) | 1991-06-03 |
| DE3679473D1 (de) | 1991-07-04 |
| KR900001987B1 (ko) | 1990-03-30 |
| KR870002643A (ko) | 1987-04-06 |
| EP0212521B1 (en) | 1991-05-29 |