JPS6248387B2 - - Google Patents
Info
- Publication number
- JPS6248387B2 JPS6248387B2 JP52131568A JP13156877A JPS6248387B2 JP S6248387 B2 JPS6248387 B2 JP S6248387B2 JP 52131568 A JP52131568 A JP 52131568A JP 13156877 A JP13156877 A JP 13156877A JP S6248387 B2 JPS6248387 B2 JP S6248387B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- header
- semiconductor
- lead wire
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156877A JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5465476A JPS5465476A (en) | 1979-05-26 |
| JPS6248387B2 true JPS6248387B2 (oth) | 1987-10-13 |
Family
ID=15061094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13156877A Granted JPS5465476A (en) | 1977-11-04 | 1977-11-04 | Semiconductor rectifying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5465476A (oth) |
-
1977
- 1977-11-04 JP JP13156877A patent/JPS5465476A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5465476A (en) | 1979-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3226466A (en) | Semiconductor devices with cooling plates | |
| JP2002110893A (ja) | 半導体装置 | |
| JPH0455339B2 (oth) | ||
| JP3836010B2 (ja) | 半導体装置 | |
| JP2001274177A (ja) | 半導体装置及びその製造方法 | |
| US4057825A (en) | Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered | |
| US4498096A (en) | Button rectifier package for non-planar die | |
| US3209218A (en) | Silicon semiconductor device | |
| JPS6248387B2 (oth) | ||
| US3950142A (en) | Lead assembly for semiconductive device | |
| US4068368A (en) | Closure for semiconductor device and method of construction | |
| JPH0252425B2 (oth) | ||
| US3457474A (en) | Semiconductor rectifier structure having semiconductor element assembly screwed into place on support base | |
| US3562605A (en) | Void-free pressure electrical contact for semiconductor devices and method of making the same | |
| US4692788A (en) | Semiconductor device with solder overflow prevention geometry | |
| JPS637029B2 (oth) | ||
| JPS5838694A (ja) | 半導体ダイボンデイング用はんだ | |
| JPS6218048Y2 (oth) | ||
| JPH02130864A (ja) | リードフレームのダイパッド構造 | |
| JPS5832423A (ja) | 半導体装置 | |
| JP2546178B2 (ja) | リードレスダイオード | |
| US3116442A (en) | Silicon rectifier assembly comprising a heat conductive mounting base | |
| JP3671771B2 (ja) | 平型半導体装置のパッケージ | |
| JPH0215320Y2 (oth) | ||
| JPH01181450A (ja) | 樹脂封止型半導体装置 |