JPS6248387B2 - - Google Patents

Info

Publication number
JPS6248387B2
JPS6248387B2 JP13156877A JP13156877A JPS6248387B2 JP S6248387 B2 JPS6248387 B2 JP S6248387B2 JP 13156877 A JP13156877 A JP 13156877A JP 13156877 A JP13156877 A JP 13156877A JP S6248387 B2 JPS6248387 B2 JP S6248387B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
header
semiconductor
lead wire
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13156877A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5465476A (en
Inventor
Motoji Nakajima
Tadashi Sakagami
Kazutoyo Narita
Noboru Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP13156877A priority Critical patent/JPS5465476A/ja
Publication of JPS5465476A publication Critical patent/JPS5465476A/ja
Publication of JPS6248387B2 publication Critical patent/JPS6248387B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
JP13156877A 1977-11-04 1977-11-04 Semiconductor rectifying device Granted JPS5465476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13156877A JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13156877A JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Publications (2)

Publication Number Publication Date
JPS5465476A JPS5465476A (en) 1979-05-26
JPS6248387B2 true JPS6248387B2 (enrdf_load_stackoverflow) 1987-10-13

Family

ID=15061094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13156877A Granted JPS5465476A (en) 1977-11-04 1977-11-04 Semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS5465476A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5465476A (en) 1979-05-26

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