JPS6247311B2 - - Google Patents
Info
- Publication number
- JPS6247311B2 JPS6247311B2 JP54156177A JP15617779A JPS6247311B2 JP S6247311 B2 JPS6247311 B2 JP S6247311B2 JP 54156177 A JP54156177 A JP 54156177A JP 15617779 A JP15617779 A JP 15617779A JP S6247311 B2 JPS6247311 B2 JP S6247311B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- circuit board
- display device
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 229920005570 flexible polymer Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006258 conductive agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、少なくとも1枚の基板がフレキシブ
ルな光学的表示装置に於いて、各々の基板から
各々に導通をとる事により、より導通性の信頼性
を高めた光学的表示装置に関わるものである。[Detailed Description of the Invention] [Technical Field] The present invention provides an optical display device in which at least one substrate is flexible, by establishing conduction from each substrate to each other, thereby increasing the reliability of conductivity. It concerns an enhanced optical display device.
従来、光学的表示装置の導通は、(以下、例と
して液晶表示装置について述べる。)より簡易に
又コンパクトにという。実装.工数等の面の考慮
から、表示装置を構成するセル基板の全ての基板
から各々に導通はとらず、より少数の基板から導
通をとつている。従い、直接、セル外部に導通を
とつていない基板は、導通をとつている基板と導
通材で接続されている。ここで用いられる導通材
は、低融点金属(ハンダ類等)が、Ag,Sn等の
粉末を接着剤に混合したものである。低融点金属
を溶融して導通材とする場合、セル単品で処理せ
ねばならず、現在は、印刷法で、多数個(セル
数)処理が採れるAg,Sn等の粉末を接着剤に混
合したものが用いられているが、基板に印刷し、
セル組立後の接着剤の焼成時に、接着剤に均一に
分散していた、Ag,Sn等の粉末が沈降すること
から、導通不良になることが多々あつた。又、前
記両法に於いて、初期の導通性が確保されていて
も、基板と導通材との密着性が経時的に劣化し、
(特に、Ag,Sn等の粉末を接着剤に混合する場合
充分な導通性を得るために、Ag,Sn等の粉末を
80Wt%以上も混合するために、単体であればセ
ル基板と充分な密着性が確保出来る接着剤を用い
ても経時的に、セル基板からハクリ現象を起こ
し、この間隙から入いる水分等により金属粉末が
酸化する。)導通不良となる。
Conventionally, the conduction of optical display devices (hereinafter, a liquid crystal display device will be described as an example) is simpler and more compact. implementation. In consideration of man-hours and the like, conduction is not established from all of the cell substrates constituting the display device, but from a smaller number of substrates. Therefore, a substrate that is not directly conductive to the outside of the cell is connected to a substrate that is conductive through a conductive material. The conductive material used here is a mixture of low melting point metals (solders, etc.) and powders of Ag, Sn, etc., and adhesive. When melting low melting point metals to make conductive materials, it is necessary to process individual cells.Currently, powders such as Ag and Sn are mixed into adhesives, which can be processed in large numbers (number of cells) using printing methods. Printed on the board,
When the adhesive was fired after cell assembly, powders of Ag, Sn, etc. that had been uniformly dispersed in the adhesive settled, often resulting in poor conductivity. In addition, in both of the above methods, even if the initial conductivity is ensured, the adhesion between the substrate and the conductive material deteriorates over time.
(In particular, when mixing powders such as Ag and Sn into adhesives, it is necessary to mix powders such as Ag and Sn in order to obtain sufficient conductivity.
Because the mixture contains more than 80 Wt%, even if an adhesive is used that can secure sufficient adhesion to the cell substrate when used alone, it will peel off from the cell substrate over time, and the moisture that enters through the gap will cause the metal to peel off. Powder oxidizes. ) Poor continuity occurs.
従つて、このような導通不良を防止するために
上下基板各々別々に導通をとらなくてはならな
い。 Therefore, in order to prevent such poor conduction, conduction must be established separately for the upper and lower substrates.
この場合、ガラスを基板として用いた場合は、
基板を変形させる事は不可能であり上基板は下方
向から、下基板は上方向から導通をとらねばなら
ず、セルを回路基板に接続する場合、回路基板を
変形させて、各セル基板から導通をとるか、セル
基板と回路基板を結ぶ、導電性部品(導電ゴム
等)を変形させて用いなければならず、極めて、
導通部が複雑で、回路基板を変形させるとなる
と、従来のものを大幅に変えなければならない欠
点があつた。 In this case, if glass is used as the substrate,
It is impossible to deform the board, and conduction must be established from below for the upper board and from above for the lower board. When connecting cells to a circuit board, the circuit board must be deformed to connect each cell board from the bottom. The conductive parts (conductive rubber, etc.) that connect the cell board and the circuit board must be modified to provide continuity or to connect the cell board and the circuit board.
The conductive parts were complicated, and if the circuit board were to be deformed, it had the disadvantage of requiring significant changes from conventional ones.
本発明は上記問題点を克服したものであり、上
下基板のうち一方をプラスチツク等のフレキシブ
ル基板とし該フレキシブル基板の端部を変形させ
て他方の基板の導電部の方向と同一方向とするこ
とにより、導通を容易にし回路基板との接続を簡
略にした光学的表示装置を提供するものである。
The present invention overcomes the above problems by making one of the upper and lower substrates a flexible substrate such as plastic, and deforming the end of the flexible substrate so that it is aligned in the same direction as the conductive portion of the other substrate. The present invention provides an optical display device that facilitates conduction and simplifies connection to a circuit board.
以下に実施例で本発明をさらに詳細に説明す
る。
The present invention will be explained in more detail with reference to Examples below.
実施例 1
第1図.第2図に沿つて説明する。下基板より
側方に突出された上基板1及び前記上基板1より
側方に突出された下基板2に偏光板を用い、低温
スパツタ法で透明導電膜を形成し、パターニン
グ、配向処理を行ない液晶表示セルを組立てる。
第1図、第2図の如く、組立てられたセルを、表
示装置に実装する場合、下基板2を変形させ、下
基板より突出された面で且つ導電膜パターンと同
一面に形成された接続端子を有する上基板1と同
様に下方向から導通をとる様にした。即ち、上基
板より側方に突出され、且つ突出した下基板の端
部を下方内側へ屈曲させ、導電膜の接続端子を、
上基板の接続端子と同一の下方向にして、全ての
接続端子が下方向から導通をとれるようにしたも
のである。Example 1 Figure 1. This will be explained along with FIG. A transparent conductive film is formed by a low-temperature sputtering method using a polarizing plate on an upper substrate 1 that protrudes laterally from the lower substrate and a lower substrate 2 that protrudes laterally from the upper substrate 1, and is patterned and aligned. Assemble the liquid crystal display cell.
As shown in FIGS. 1 and 2, when the assembled cell is mounted on a display device, the lower substrate 2 is deformed, and the connections are formed on a surface protruding from the lower substrate and on the same surface as the conductive film pattern. Similar to the upper substrate 1 having terminals, conduction is established from below. That is, the ends of the lower substrate that protrude laterally from the upper substrate are bent downward and inward to connect the connection terminals of the conductive film.
The connection terminals are oriented downward in the same direction as the connection terminals on the upper substrate, so that all the connection terminals can be electrically connected from below.
基板の材料はフレキシブルであれば良く又形状
や変形のしかた等も実施例に拘束されるものでは
ない。光学的表示装置は、実施例に述べる液晶表
示装置をはじめ、EC(エレクトロクロミツク)・
EPID(電気泳動表示)・ライトバルブ等やEL
(エレクトロルミネセンス)等の照明装置であ
る。 The material of the substrate may be flexible as long as it is flexible, and the shape and method of deformation are not limited to the embodiments. Optical display devices include the liquid crystal display device described in the example, EC (electrochromic)
EPID (electrophoretic display), light valves, etc. and EL
(electroluminescence), etc.
上述の如く本発明は、上下一対の基板内に液晶
が封入されて表示セルが形成されてなり、各基板
内側上には導電膜パターンが形成されてなる光学
的表示装置において、前記基板は前記下基板より
側方に突出されてなり、該突出された上基板上で
且つ前記導電膜パターンと同一面上には回路基板
と接続のための第1接続端子が形成されてなり、
前記下基板はフレキシブルな高分子樹脂フイルム
からなり、前記上基板より側方に突出され、且つ
突出した下基板の端部は下方内側へ屈曲されてな
り、該屈曲部外側端面上には回路基板と接続のた
めの第2接続端子が形成されてなるために上基板
及び下基板の各々から導電膜パターンと回路基板
との導通を直接とることができ、従来使用してい
た、一方の基板の導電膜パターンを他方の基板に
接続するための導通剤が不要となり経時的劣化に
よる導通不良という問題がなくなり、液晶表示セ
ルとして高い信頼性を可能とする優れた効果を発
揮する。又、上基板及び下基板の接続端子を同一
の下方向からとることができるので導通部の構造
も従来の回路基板をそのまま使うことができ、容
易に実現できるものである。
As described above, the present invention provides an optical display device in which a display cell is formed by sealing a liquid crystal in a pair of upper and lower substrates, and a conductive film pattern is formed on the inside of each substrate. protruding laterally from the lower substrate, and a first connection terminal for connection to the circuit board is formed on the protruded upper substrate and on the same surface as the conductive film pattern;
The lower substrate is made of a flexible polymer resin film, and is protruded laterally from the upper substrate, and the protruding end of the lower substrate is bent downward and inward, and a circuit board is disposed on the outer end surface of the bent portion. Since a second connection terminal for connection is formed, it is possible to directly establish continuity between the conductive film pattern and the circuit board from each of the upper and lower substrates. A conductive agent for connecting the conductive film pattern to the other substrate is not required, eliminating the problem of poor conductivity due to deterioration over time, and exhibits an excellent effect of enabling high reliability as a liquid crystal display cell. Further, since the connection terminals of the upper and lower substrates can be connected from the same downward direction, the structure of the conductive portion can be easily realized by using the conventional circuit board as is.
第1図は、フレキシブルな基板として偏光板を
用いた単層の液晶表示装置セル部を、上から見た
図であり、第2図は、断面図である。
1……上基板、2……下基板、3……シール
材、4……導電性部品(セル基板と回路基板の電
気的接続用)。
FIG. 1 is a top view of a single-layer liquid crystal display cell section using a polarizing plate as a flexible substrate, and FIG. 2 is a cross-sectional view. 1... Upper board, 2... Lower board, 3... Seal material, 4... Conductive parts (for electrical connection between the cell board and the circuit board).
Claims (1)
ルが形成されてなり、各基板内側上には導電膜パ
ターンが形成されてなる光学的表示装置におい
て、前記上基板は前記下基板より側方に突出され
てなり、該突出された上基板上で且つ前記導電膜
パターンと同一面上には回路基板と接続のための
第1接続端子が形成されてなり、前記下基板はフ
レキシブルな高分子樹脂フイルムからなり、前記
上基板より側方に突出され、且つ突出した下基板
の端部は下方内側へ屈曲されてなり、該屈曲部外
側端面上には回路基板と接続のための第2接続端
子が形成されてなることを特徴とする光学的表示
装置。1. In an optical display device in which a liquid crystal is sealed in a pair of upper and lower substrates to form a display cell, and a conductive film pattern is formed on the inside of each substrate, the upper substrate is located laterally than the lower substrate. A first connection terminal for connecting to a circuit board is formed on the protruded upper substrate and on the same surface as the conductive film pattern, and the lower substrate is made of a flexible polymer. The lower board is made of a resin film and projects laterally from the upper board, and the projecting end is bent downward and inward, and a second connection for connection to the circuit board is provided on the outer end surface of the bent part. An optical display device characterized in that a terminal is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15617779A JPS5678873A (en) | 1979-11-30 | 1979-11-30 | Optical display unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15617779A JPS5678873A (en) | 1979-11-30 | 1979-11-30 | Optical display unit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5678873A JPS5678873A (en) | 1981-06-29 |
JPS6247311B2 true JPS6247311B2 (en) | 1987-10-07 |
Family
ID=15622030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15617779A Granted JPS5678873A (en) | 1979-11-30 | 1979-11-30 | Optical display unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5678873A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58126423U (en) * | 1982-02-17 | 1983-08-27 | シャープ株式会社 | liquid crystal display device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5560118U (en) * | 1978-10-18 | 1980-04-24 |
-
1979
- 1979-11-30 JP JP15617779A patent/JPS5678873A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5678873A (en) | 1981-06-29 |
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