JPH02239231A - Production of liquid crystal display element - Google Patents

Production of liquid crystal display element

Info

Publication number
JPH02239231A
JPH02239231A JP5967089A JP5967089A JPH02239231A JP H02239231 A JPH02239231 A JP H02239231A JP 5967089 A JP5967089 A JP 5967089A JP 5967089 A JP5967089 A JP 5967089A JP H02239231 A JPH02239231 A JP H02239231A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
layer
solder
connector
electrode
surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5967089A
Inventor
Makoto Tomofuji
Tsunemitsu Torigoe
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions ; Methods of application thereof

Abstract

PURPOSE: To assure and stabilize the conduction between an electrode terminal and a connector and to improve reliability by applying solder by dipping on an Ag layer formed on the electrode terminal and further slightly polishing the solder layer to flatten the surface.
CONSTITUTION: Ag paste is printed on the electrode terminal 4 prior to the assembly of a cell and is calcined, for example, for 10 minutes at 500°C to form the Ag layer 5 at the time of producing an LCD 1. One side end of a lower glass substrate 3 is dipped into a solder tank after the assembly of the cell and is pulled up at a prescribed speed to form the solder layer 6 on the Ag layer 5. The solder layer obt. in such a manner is built up by surface tension and, therefor, the surface is polished by 1 to 2μm and is thereby flattened after the dipping. The contact stability of the solder layer 6 and a contact point part 11a of the connector 10 is improved in this way and the insertion of the connector 10 to the LCD 1 is facilitated. The damage of the glass substrate at the time of insertion of the connector is thus averted.
COPYRIGHT: (C)1990,JPO&Japio
JP5967089A 1989-03-14 1989-03-14 Production of liquid crystal display element Pending JPH02239231A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5967089A JPH02239231A (en) 1989-03-14 1989-03-14 Production of liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5967089A JPH02239231A (en) 1989-03-14 1989-03-14 Production of liquid crystal display element

Publications (1)

Publication Number Publication Date
JPH02239231A true true JPH02239231A (en) 1990-09-21

Family

ID=13119857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5967089A Pending JPH02239231A (en) 1989-03-14 1989-03-14 Production of liquid crystal display element

Country Status (1)

Country Link
JP (1) JPH02239231A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943217A (en) * 1994-05-06 1999-08-24 Seiko Epson Corporation Printed circuit board for mounting at least one electronic part
JP2007335430A (en) * 2006-06-12 2007-12-27 Alps Electric Co Ltd Circuit board and its production process
JP2012109315A (en) * 2010-11-15 2012-06-07 Mitsubishi Materials Corp Power module substrate, power module substrate with cooler, and manufacturing methods of the power module and the power module substrate
JP2012109314A (en) * 2010-11-15 2012-06-07 Mitsubishi Materials Corp Power module substrate, power module substrate with cooler, and manufacturing methods of the power module and the power module substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5943217A (en) * 1994-05-06 1999-08-24 Seiko Epson Corporation Printed circuit board for mounting at least one electronic part
US6201193B1 (en) 1994-05-06 2001-03-13 Seiko Epson Corporation Printed circuit board having a positioning marks for mounting at least one electronic part
JP2007335430A (en) * 2006-06-12 2007-12-27 Alps Electric Co Ltd Circuit board and its production process
JP2012109315A (en) * 2010-11-15 2012-06-07 Mitsubishi Materials Corp Power module substrate, power module substrate with cooler, and manufacturing methods of the power module and the power module substrate
JP2012109314A (en) * 2010-11-15 2012-06-07 Mitsubishi Materials Corp Power module substrate, power module substrate with cooler, and manufacturing methods of the power module and the power module substrate

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