JPS6247156U - - Google Patents

Info

Publication number
JPS6247156U
JPS6247156U JP1985139996U JP13999685U JPS6247156U JP S6247156 U JPS6247156 U JP S6247156U JP 1985139996 U JP1985139996 U JP 1985139996U JP 13999685 U JP13999685 U JP 13999685U JP S6247156 U JPS6247156 U JP S6247156U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
emitting element
envelope
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985139996U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985139996U priority Critical patent/JPS6247156U/ja
Publication of JPS6247156U publication Critical patent/JPS6247156U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
JP1985139996U 1985-09-12 1985-09-12 Pending JPS6247156U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985139996U JPS6247156U (ko) 1985-09-12 1985-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985139996U JPS6247156U (ko) 1985-09-12 1985-09-12

Publications (1)

Publication Number Publication Date
JPS6247156U true JPS6247156U (ko) 1987-03-23

Family

ID=31046424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985139996U Pending JPS6247156U (ko) 1985-09-12 1985-09-12

Country Status (1)

Country Link
JP (1) JPS6247156U (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
JP2009170625A (ja) * 2008-01-16 2009-07-30 Toyoda Gosei Co Ltd 発光装置
EP1928033A3 (en) * 2006-11-30 2010-09-01 Nichia Corporation Light-emitting apparatus and method of producing the same
JP2011205100A (ja) * 2010-03-25 2011-10-13 Lg Innotek Co Ltd 発光素子パッケージ及びこれを備えた照明システム
JP2012515440A (ja) * 2009-01-14 2012-07-05 クリー ホイチョウ オプト リミテッド 複数配列された発光素子のパッケージ
JP2021027144A (ja) * 2019-08-05 2021-02-22 ローム株式会社 半導体発光装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7432589B2 (en) 2006-04-19 2008-10-07 Nichia Corporation Semiconductor device
EP1928033A3 (en) * 2006-11-30 2010-09-01 Nichia Corporation Light-emitting apparatus and method of producing the same
JP2009170625A (ja) * 2008-01-16 2009-07-30 Toyoda Gosei Co Ltd 発光装置
JP2012515440A (ja) * 2009-01-14 2012-07-05 クリー ホイチョウ オプト リミテッド 複数配列された発光素子のパッケージ
JP2011205100A (ja) * 2010-03-25 2011-10-13 Lg Innotek Co Ltd 発光素子パッケージ及びこれを備えた照明システム
EP2369652A3 (en) * 2010-03-25 2015-05-06 LG Innotek Co., Ltd. Light emitting device package and lighting system having the same
JP2021027144A (ja) * 2019-08-05 2021-02-22 ローム株式会社 半導体発光装置

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