JPS6247155U - - Google Patents
Info
- Publication number
- JPS6247155U JPS6247155U JP1985139672U JP13967285U JPS6247155U JP S6247155 U JPS6247155 U JP S6247155U JP 1985139672 U JP1985139672 U JP 1985139672U JP 13967285 U JP13967285 U JP 13967285U JP S6247155 U JPS6247155 U JP S6247155U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- light source
- utility
- light emitting
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Exposure Or Original Feeding In Electrophotography (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (https=) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139672U JPH0412698Y2 (https=) | 1985-09-12 | 1985-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6247155U true JPS6247155U (https=) | 1987-03-23 |
| JPH0412698Y2 JPH0412698Y2 (https=) | 1992-03-26 |
Family
ID=31045795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985139672U Expired JPH0412698Y2 (https=) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412698Y2 (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135508A (ja) * | 2006-11-28 | 2008-06-12 | Seiko Epson Corp | 光源装置、プロジェクタ及びモニタ装置 |
| JP2008270462A (ja) * | 2007-04-19 | 2008-11-06 | Stanley Electric Co Ltd | 光デバイス |
| JP2010226733A (ja) * | 2010-04-21 | 2010-10-07 | Mitsubishi Electric Corp | 画像読取装置 |
| JP2011523180A (ja) * | 2008-06-04 | 2011-08-04 | フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー | Ｌｅｄ電球装置 |
| JP2012527761A (ja) * | 2009-05-20 | 2012-11-08 | ティーピー ビジョン ホールディング ビー ヴィ | 周辺光を提供するプリント回路板 |
-
1985
- 1985-09-12 JP JP1985139672U patent/JPH0412698Y2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135508A (ja) * | 2006-11-28 | 2008-06-12 | Seiko Epson Corp | 光源装置、プロジェクタ及びモニタ装置 |
| JP2008270462A (ja) * | 2007-04-19 | 2008-11-06 | Stanley Electric Co Ltd | 光デバイス |
| JP2011523180A (ja) * | 2008-06-04 | 2011-08-04 | フォーエバー・バルブ・リミテッド・ライアビリティ・カンパニー | Ｌｅｄ電球装置 |
| JP2012527761A (ja) * | 2009-05-20 | 2012-11-08 | ティーピー ビジョン ホールディング ビー ヴィ | 周辺光を提供するプリント回路板 |
| JP2010226733A (ja) * | 2010-04-21 | 2010-10-07 | Mitsubishi Electric Corp | 画像読取装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412698Y2 (https=) | 1992-03-26 |