JPS62101250U - - Google Patents

Info

Publication number
JPS62101250U
JPS62101250U JP1985191047U JP19104785U JPS62101250U JP S62101250 U JPS62101250 U JP S62101250U JP 1985191047 U JP1985191047 U JP 1985191047U JP 19104785 U JP19104785 U JP 19104785U JP S62101250 U JPS62101250 U JP S62101250U
Authority
JP
Japan
Prior art keywords
light emitting
substrate
wiring pattern
emitting diode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985191047U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0517894Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985191047U priority Critical patent/JPH0517894Y2/ja
Publication of JPS62101250U publication Critical patent/JPS62101250U/ja
Application granted granted Critical
Publication of JPH0517894Y2 publication Critical patent/JPH0517894Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Surface Treatment Of Optical Elements (AREA)
JP1985191047U 1985-12-13 1985-12-13 Expired - Lifetime JPH0517894Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (https=) 1985-12-13 1985-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985191047U JPH0517894Y2 (https=) 1985-12-13 1985-12-13

Publications (2)

Publication Number Publication Date
JPS62101250U true JPS62101250U (https=) 1987-06-27
JPH0517894Y2 JPH0517894Y2 (https=) 1993-05-13

Family

ID=31144827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985191047U Expired - Lifetime JPH0517894Y2 (https=) 1985-12-13 1985-12-13

Country Status (1)

Country Link
JP (1) JPH0517894Y2 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057446A (ja) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd 混成集積回路装置
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009164210A (ja) * 2007-12-28 2009-07-23 Hitachi Ltd 実装基板、及びこの実装基板を備えるｌｅｄ光源装置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
JP2011091405A (ja) * 2009-10-26 2011-05-06 Gio Optoelectronics Corp 発光装置
JP2016157770A (ja) * 2015-02-24 2016-09-01 東洋紡株式会社 発光ダイオード素子の実装基板用白色反射フィルム、その発光ダイオード素子の実装基板用白色反射フィルム用いてなる発光ダイオード素子の実装基板並びにその発光ダイオード素子の実装基板を用いてなる照明器具

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7003410B2 (en) 1996-07-29 2006-02-21 Midtronics, Inc. Electronic battery tester with relative test output

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103482U (https=) * 1980-12-17 1982-06-25
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57103482U (https=) * 1980-12-17 1982-06-25
JPS5877071U (ja) * 1981-11-17 1983-05-24 三洋電機株式会社 発光ダイオ−ド表示器

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057446A (ja) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd 混成集積回路装置
JP2001230450A (ja) * 2000-02-21 2001-08-24 Hiroshi Ninomiya 面発光体の製造方法
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009164210A (ja) * 2007-12-28 2009-07-23 Hitachi Ltd 実装基板、及びこの実装基板を備えるｌｅｄ光源装置
JP2010103294A (ja) * 2008-10-23 2010-05-06 Citizen Electronics Co Ltd 発光ダイオード
JP2011091405A (ja) * 2009-10-26 2011-05-06 Gio Optoelectronics Corp 発光装置
JP2016157770A (ja) * 2015-02-24 2016-09-01 東洋紡株式会社 発光ダイオード素子の実装基板用白色反射フィルム、その発光ダイオード素子の実装基板用白色反射フィルム用いてなる発光ダイオード素子の実装基板並びにその発光ダイオード素子の実装基板を用いてなる照明器具

Also Published As

Publication number Publication date
JPH0517894Y2 (https=) 1993-05-13

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