JPS6245869U - - Google Patents
Info
- Publication number
- JPS6245869U JPS6245869U JP13766585U JP13766585U JPS6245869U JP S6245869 U JPS6245869 U JP S6245869U JP 13766585 U JP13766585 U JP 13766585U JP 13766585 U JP13766585 U JP 13766585U JP S6245869 U JPS6245869 U JP S6245869U
- Authority
- JP
- Japan
- Prior art keywords
- chip element
- circuit board
- hole
- electrode
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案における素子実装構造の断面
図。第２図は、本考案の素子実装構造に用いる回
路基板の断面図。第３図は、導体パターンの形状
の一例を示す為の、第２図の回路基板の平面図。
第４図は、導体パターンの形状の他の一例を示す
為の、第２図の回路基板の平面図。第５図、第６
図、第７図は、従来の素子実装構造の断面図。
１……チツプ素子、２……半田、３……回路基
板の絶縁性基材、４……回路基板の導体、５……
素子挿入によつて折り曲げられた舌状導体、６…
…折り曲げられる前の、舌状導体（穴７上にオー
バーハングして形成した導体４の一部）、７……
素子挿入の為に基材３に設けた穴。
FIG. 1 is a sectional view of the element mounting structure according to the present invention. FIG. 2 is a sectional view of a circuit board used in the element mounting structure of the present invention. FIG. 3 is a plan view of the circuit board of FIG. 2, showing an example of the shape of the conductor pattern.
FIG. 4 is a plan view of the circuit board of FIG. 2, showing another example of the shape of the conductor pattern. Figures 5 and 6
FIG. 7 is a sectional view of a conventional element mounting structure. 1... Chip element, 2... Solder, 3... Insulating base material of circuit board, 4... Conductor of circuit board, 5...
A tongue-shaped conductor bent by inserting an element, 6...
...Tongue-shaped conductor (part of conductor 4 formed by overhanging above hole 7) before being bent, 7...
A hole made in the base material 3 for inserting the element.
Claims (1)
実装において、該チツプ素子に対応して回路基板
の基材に設けた穴内に該チツプ素子が挿入され、
かつ、該チツプ素子の電極に対応して穴上に張り
出して形成した舌状導体が、チツプ素子によつて
穴内に折り曲げられて、該チツプ素子の電極と電
気的・機械的に接続されることを特徴とする、素
子実装構造。 In mounting a chip element having electrodes at both ends on a circuit board, the chip element is inserted into a hole provided in a base material of the circuit board corresponding to the chip element,
Further, a tongue-shaped conductor formed overhanging the hole corresponding to the electrode of the chip element is bent into the hole by the chip element and electrically and mechanically connected to the electrode of the chip element. An element mounting structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13766585U JPS6245869U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13766585U JPS6245869U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245869U true JPS6245869U (en) | 1987-03-19 |
Family
ID=31041931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13766585U Pending JPS6245869U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245869U (en) |
-
1985
- 1985-09-09 JP JP13766585U patent/JPS6245869U/ja active Pending
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