JPS6245696B2 - - Google Patents

Info

Publication number
JPS6245696B2
JPS6245696B2 JP55057505A JP5750580A JPS6245696B2 JP S6245696 B2 JPS6245696 B2 JP S6245696B2 JP 55057505 A JP55057505 A JP 55057505A JP 5750580 A JP5750580 A JP 5750580A JP S6245696 B2 JPS6245696 B2 JP S6245696B2
Authority
JP
Japan
Prior art keywords
metal plate
semiconductor wafer
grooves
breathable metal
breathable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55057505A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56153741A (en
Inventor
Hiroshi Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP5750580A priority Critical patent/JPS56153741A/ja
Publication of JPS56153741A publication Critical patent/JPS56153741A/ja
Publication of JPS6245696B2 publication Critical patent/JPS6245696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP5750580A 1980-04-30 1980-04-30 Supporting device for semiconductor wafer Granted JPS56153741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5750580A JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5750580A JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS56153741A JPS56153741A (en) 1981-11-27
JPS6245696B2 true JPS6245696B2 (enrdf_load_stackoverflow) 1987-09-28

Family

ID=13057581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5750580A Granted JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS56153741A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPH11309638A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 真空吸着盤

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756207A (en) * 1980-09-22 1982-04-03 Teikoku Hiyuumukan Kk Manufacture of concrete pipe containing steel fiber

Also Published As

Publication number Publication date
JPS56153741A (en) 1981-11-27

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