JPS56153741A - Supporting device for semiconductor wafer - Google Patents

Supporting device for semiconductor wafer

Info

Publication number
JPS56153741A
JPS56153741A JP5750580A JP5750580A JPS56153741A JP S56153741 A JPS56153741 A JP S56153741A JP 5750580 A JP5750580 A JP 5750580A JP 5750580 A JP5750580 A JP 5750580A JP S56153741 A JPS56153741 A JP S56153741A
Authority
JP
Japan
Prior art keywords
metal plate
wafer
air permeable
section
permeable metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5750580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245696B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5750580A priority Critical patent/JPS56153741A/ja
Publication of JPS56153741A publication Critical patent/JPS56153741A/ja
Publication of JPS6245696B2 publication Critical patent/JPS6245696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP5750580A 1980-04-30 1980-04-30 Supporting device for semiconductor wafer Granted JPS56153741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5750580A JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5750580A JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS56153741A true JPS56153741A (en) 1981-11-27
JPS6245696B2 JPS6245696B2 (enrdf_load_stackoverflow) 1987-09-28

Family

ID=13057581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5750580A Granted JPS56153741A (en) 1980-04-30 1980-04-30 Supporting device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS56153741A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPH11309638A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 真空吸着盤

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756207A (en) * 1980-09-22 1982-04-03 Teikoku Hiyuumukan Kk Manufacture of concrete pipe containing steel fiber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756207A (en) * 1980-09-22 1982-04-03 Teikoku Hiyuumukan Kk Manufacture of concrete pipe containing steel fiber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180026A (ja) * 1982-04-15 1983-10-21 Nippon Telegr & Teleph Corp <Ntt> ウエハ研磨用吸着板
JPH11309638A (ja) * 1998-04-28 1999-11-09 Kyocera Corp 真空吸着盤

Also Published As

Publication number Publication date
JPS6245696B2 (enrdf_load_stackoverflow) 1987-09-28

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