JPS6244399A - Method of cutting amorphous alloy sheet metal - Google Patents
Method of cutting amorphous alloy sheet metalInfo
- Publication number
- JPS6244399A JPS6244399A JP18023385A JP18023385A JPS6244399A JP S6244399 A JPS6244399 A JP S6244399A JP 18023385 A JP18023385 A JP 18023385A JP 18023385 A JP18023385 A JP 18023385A JP S6244399 A JPS6244399 A JP S6244399A
- Authority
- JP
- Japan
- Prior art keywords
- amorphous alloy
- thin plate
- slitter
- cutting
- alloy thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Cutting Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ■ 発明の背景 技術分野 本発明は、非晶質合金薄板の裁断方法に関する。[Detailed description of the invention] ■ Background of the invention Technical field The present invention relates to a method for cutting an amorphous alloy thin plate.
先行技術とその問題点
非晶質合金の薄帯を、いわゆる高速急冷法で作製したの
ち、これを所望中とすることが多々ある。PRIOR ART AND THEIR PROBLEMS It is often the case that a ribbon of an amorphous alloy is fabricated by a so-called high-speed quenching method and then used as desired.
従来より、非晶質合金薄板を裁断するためのスリンター
には、パーマロイ、けいＸｍ ４ｋｔ、 ’３に用いる
スリッターと同じく、超硬合金のスリッター刃が用いら
れている。Conventionally, slitter blades for cutting amorphous alloy sheets have been made of cemented carbide, similar to the slitter used for Permalloy, Kei Xm 4kt, and '3.
しかし非晶質合金の硬度は、Ｈｖ＝８００〜１１００Ｋ
ｇ／ｌｌ１ｍ ２であり、超硬合金トホホ同等の硬度を
もつ。However, the hardness of amorphous alloy is Hv=800~1100K
g/1m2, and has a hardness equivalent to that of cemented carbide.
このため、スリッター刃のチッピングが生じ易く、また
裁断された非晶質合金薄板に／へりが発生し易い。For this reason, chipping of the slitter blade is likely to occur, and edges are likely to occur in the cut amorphous alloy thin plate.
したがって、スリッターの長時間の連続運転が困難であ
り、スリンターによる裁断工程の生産性はパーマロイ、
ケイ素鋼板の場合に比べ１桁〜２桁悪いものとなってい
る。Therefore, it is difficult to operate the slitter continuously for a long time, and the productivity of the cutting process using the slitter is low.
This is one to two orders of magnitude worse than that of silicon steel sheets.
ＩＩ 発明の目的
本発明は、生産性に優れた非晶質合金の裁断方法を提供
することにある。II. OBJECTS OF THE INVENTION An object of the present invention is to provide a method for cutting an amorphous alloy with excellent productivity.
■ 発明の開示 このような目的は下記の本発明によって達成ごれる。■Disclosure of invention These objects can be achieved by the invention described below.
すなわち、本発明は、非晶質合金の薄板をスリンターに
て裁断するに際し、薄板を結晶化温度量ドに加熱しなが
ら裁断することを特徴とする非晶質合金薄板の裁断方法
である。That is, the present invention is a method for cutting an amorphous alloy thin plate, which is characterized in that when cutting the amorphous alloy thin plate with a slinter, the thin plate is cut while being heated to a crystallization temperature.
■ 発明の具体的構成
以下、本発明の具体的構成について第１図、第２ａ図、
第２ｂ図に示される実施例に従い詳細に説明する。■ Specific structure of the invention The specific structure of the invention will be explained below with reference to FIGS. 1, 2a, and 2a.
This will be explained in detail according to the embodiment shown in FIG. 2b.
第１図は、スリッターヘッド２のスリッター刃２１とス
リッター刃２２間に電源３より通電し、非晶質合金薄板
１の裁断部のみ通電加熱しうるようにして、スリッター
裁断する場合である。FIG. 1 shows a case in which slitter cutting is performed by applying electricity from a power source 3 between the slitter blades 21 and 22 of the slitter head 2 so that only the cut portion of the amorphous alloy thin plate 1 can be heated by electricity.
非晶質合金薄板１の加熱温度は、その非晶質合金の結晶
化温度Ｔｘ以下でかつ、その非晶質合金の軟化点温度１
２以上であり、好ましくは（Ｔｘ−１００℃）〜Ｔｘで
あることが必要である。The heating temperature of the amorphous alloy thin plate 1 is below the crystallization temperature Tx of the amorphous alloy and the softening point temperature 1 of the amorphous alloy.
2 or more, preferably (Tx-100°C) to Tx.
非晶質合金薄板１の加熱温度はＴｘ以下でなければなら
ないが、Ｔｘ−１００℃未満であると、非晶質合金薄板
１の硬度低下が不充分であり、本発明の効果が現われな
い場合もある。The heating temperature of the amorphous alloy thin plate 1 must be below Tx, but if it is less than Tx - 100°C, the hardness of the amorphous alloy thin plate 1 will not be reduced sufficiently, and the effect of the present invention will not be achieved. There is also.
スリッター刃２１．２２としては公知の超硬合金製のス
リッター刃が好ましく用いられる。As the slitter blades 21 and 22, known slitter blades made of cemented carbide are preferably used.
第２図はスリッターヘッド２を通過する非晶質合金薄板
１において、スリッターヘッド２のスリンター刃２１と
スリッター刃２２のかみ合せ部４ないしかみ合せ部４の
前方部を局部的に加熱し、裁断するようにしたスリッタ
ー装置である。FIG. 2 shows an amorphous alloy thin plate 1 passing through a slitter head 2, where the engaging portion 4 of the slitter blade 21 and the slitter blade 22 of the slitter head 2 or the front portion of the engaging portion 4 is locally heated and cut. This is a slitter device designed to
この場合の加熱手段としては、レーザー照射、赤外線照
射等を用いることができる。As the heating means in this case, laser irradiation, infrared irradiation, etc. can be used.
非晶質合金薄板１の加熱温度は上述の範囲であればよい
。The heating temperature of the amorphous alloy thin plate 1 may be within the above-mentioned range.
このように加熱され、硬度の低下した非晶質合金薄板１
は２０〜６０ｍ／分の速度で裁断を行なうことができる
。Amorphous alloy thin plate 1 heated in this way and having reduced hardness
can perform cutting at a speed of 20 to 60 m/min.
本発明では、非晶質合金薄板１の加熱部位は、なるべく
スリ・ンター刃２１．２２のかみ合せ部４の近傍に限定
するのが好ましい。In the present invention, it is preferable that the heated portion of the amorphous alloy thin plate 1 be limited to the vicinity of the engaging portion 4 of the sinter blade 21, 22 as much as possible.
非晶質合金薄板ｌの全体を加熱すると、薄板がもろくな
り、裁断後の加工適性が悪くなってしまう。If the entire amorphous alloy thin plate l is heated, the thin plate becomes brittle and its processing suitability after cutting becomes poor.
本発明では、スリンター刃２１．２２のかみ合せ部４に
スリッター刃２１．２２から直接通電したり、局部加熱
したりしてかみ合せ部４の近傍のみに加熱部位を限定し
ている。 これにより、裁断された薄板は、裁断前と同
等の靭性をもったものとすることができる。In the present invention, the heating portion is limited to only the vicinity of the meshing portion 4 by directly applying electricity from the slitter blade 21.22 to the meshing portion 4 of the slitter blade 21.22, or by heating locally. Thereby, the cut thin plate can have the same toughness as before cutting.
本発明が適用できる非晶質合金としては、非晶質１１Ｖ
板化が可能なおよそすべての材質が可撤である。 例え
ば、Ｆｅ、Ｇｏ、Ｎｉの１種以上を含み、ガラス化元素
としてＳｉ、Ｂ、Ｃ１Ｐ、ＡＭ等の１種以上を含み、さ
らに必要に応して他の添加元素を含有する非晶質磁性合
金組成などである。As the amorphous alloy to which the present invention can be applied, amorphous 11V
Almost all materials that can be made into plates are removable. For example, an amorphous magnetic material containing one or more of Fe, Go, and Ni, one or more of Si, B, C1P, AM, etc. as a vitrifying element, and further containing other additive elements as necessary. alloy composition, etc.
なお、薄板厚は、通常１５〜１００−程度とすればよい
。Note that the thin plate thickness may normally be about 15 to 100 mm.
■ 発明の具体的作用効果
本発明によれば非晶質合金薄板を加熱することにより硬
度を下げて裁断を行なうため、スリッター刃のチッピン
グの発生度合が著しく低下し、また裁断時のパリの発生
も大巾に低下し、総じて生産性が著しく向上する。■Specific effects of the invention According to the present invention, since the amorphous alloy thin plate is heated to reduce its hardness and cut, the degree of chipping of the slitter blade is significantly reduced, and the occurrence of paris during cutting is reduced. This will also significantly reduce productivity, and overall productivity will significantly improve.
また、スリッター刃のかみ合せ部を局部加熱して、スリ
ッター裁断することにより、裁断前と同じ靭性をそなえ
た薄板の状態を保つこともできる。In addition, by locally heating the meshing part of the slitter blades and performing slitter cutting, it is possible to maintain the state of the thin plate with the same toughness as before cutting.
■ 発明の具体的実施例
以下１本発明の具体的実施例を示し、本発明の効果をさ
らに詳細に説明する。① Specific Examples of the Invention One specific example of the present invention will be shown below, and the effects of the present invention will be explained in more detail.
実施例
まずＦ ｅ ７Ｂ Ｓ ｌ ｔ３Ｂ ｓの組成の長尺の
非晶質合金薄板を得た。 この非晶質合金薄板は厚さ２
５−１結晶化部度５５０℃である。EXAMPLE First, a long amorphous alloy thin plate having a composition of Fe7BSlt3Bs was obtained. This amorphous alloy thin plate has a thickness of 2
5-1 Crystallization degree is 550°C.
この非晶質合金薄板を、第１図に示す実施例に従い、通
電加熱により加熱を行ない４０ｍ／分の速度でスリッタ
ー裁断を行なった。This amorphous alloy thin plate was heated by electrical heating and cut with a slitter at a speed of 40 m/min according to the example shown in FIG.
使用したスリッター刃はＷ Ｃ−Ｃｏ ＠砂金金製のも
のである。The slitter blade used was made by WC-Co@Alluvial Gold.
非晶質合金薄板の加熱温度とスリッター処理量の関係を
第３図に示す。FIG. 3 shows the relationship between the heating temperature of the amorphous alloy thin plate and the throughput of the slitter.
なおスリッター処理ら（は、スリッターされた非晶質合
金の／＜りの高さが１賜に達するまでの連わＶ処理ｍ数
で表わす。The slitter treatment is expressed as the number of consecutive V treatments until the height of the slitter reaches 1 mm.
第３図に示される結果より、本発明の効果があきらかで
ある。From the results shown in FIG. 3, the effects of the present invention are clear.
第１図は本発明の実施例を示す図である。
第２ａ図は、本発明の他の実施例を示す図である。
第２ｂ図は、第２ａ図の側面図である。
これらの図において、矢印ａは非晶質合金薄板の進行方
向、矢印すはスリッター刃の回転方向を示す。
第３図は１本発明の１実施例における非晶質合金薄板の
加熱温度とスリンター処理量との関係を示す図である。
符号の説明
■・・・非晶質合金薄板、２・・・スリッターヘッド、
２１．２２・・・スリッター刃、３・・・電源、４・・
・かみ合せ部
ＦＩＧ、１ ２FIG. 1 is a diagram showing an embodiment of the present invention. FIG. 2a shows another embodiment of the invention. Figure 2b is a side view of Figure 2a. In these figures, arrow a indicates the advancing direction of the amorphous alloy thin plate, and arrow s indicates the rotating direction of the slitter blade. FIG. 3 is a diagram showing the relationship between heating temperature of an amorphous alloy thin plate and slinter processing amount in one embodiment of the present invention. Explanation of symbols■...Amorphous alloy thin plate, 2...Slitter head,
21.22...Slitter blade, 3...Power supply, 4...
・Matching part FIG, 1 2
Claims (3)
し、薄板を結晶化温度以下に加熱しながら裁断すること
を特徴とする非晶質合金薄板の裁断方法。(1) A method for cutting an amorphous alloy thin plate, which comprises cutting the amorphous alloy thin plate using a slitter while heating the thin plate to a temperature below the crystallization temperature.
電することにより行なわれる特許請求の範囲第１項に記
載の非晶質合金薄板の裁断方法。(2) The method for cutting an amorphous alloy thin plate according to claim 1, wherein the heating is performed by applying electricity between the slitter blades of the slitter head.
み合せ部および／またはかみ合せ部の前方部の薄板を局
部的に加熱する特許請求の範囲第１項に記載の非晶質合
金薄板の裁断方法。(3) The method for cutting an amorphous alloy thin plate according to claim 1, wherein the thin plate of the slitter head is locally heated at the engaging portion of the slitter blade and/or at the front portion of the engaging portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18023385A JPS6244399A (en) | 1985-08-16 | 1985-08-16 | Method of cutting amorphous alloy sheet metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18023385A JPS6244399A (en) | 1985-08-16 | 1985-08-16 | Method of cutting amorphous alloy sheet metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6244399A true JPS6244399A (en) | 1987-02-26 |
Family
ID=16079700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18023385A Pending JPS6244399A (en) | 1985-08-16 | 1985-08-16 | Method of cutting amorphous alloy sheet metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244399A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009146205A (en) * | 2007-12-14 | 2009-07-02 | Mitsubishi Heavy Ind Ltd | Frame for vehicle detector |
-
1985
- 1985-08-16 JP JP18023385A patent/JPS6244399A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009146205A (en) * | 2007-12-14 | 2009-07-02 | Mitsubishi Heavy Ind Ltd | Frame for vehicle detector |
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