JPS6243155A - 集積回路パッケ−ジ - Google Patents

集積回路パッケ−ジ

Info

Publication number
JPS6243155A
JPS6243155A JP60181692A JP18169285A JPS6243155A JP S6243155 A JPS6243155 A JP S6243155A JP 60181692 A JP60181692 A JP 60181692A JP 18169285 A JP18169285 A JP 18169285A JP S6243155 A JPS6243155 A JP S6243155A
Authority
JP
Japan
Prior art keywords
thermal expansion
glass
expansion coefficient
substrate
coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60181692A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337308B2 (enrdf_load_stackoverflow
Inventor
Satoru Ogiwara
荻原　覚
Tomoji Oishi
知司 大石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60181692A priority Critical patent/JPS6243155A/ja
Priority to US06/890,533 priority patent/US4729010A/en
Priority to EP86305894A priority patent/EP0211618B1/en
Priority to DE8686305894T priority patent/DE3672709D1/de
Publication of JPS6243155A publication Critical patent/JPS6243155A/ja
Publication of JPH0337308B2 publication Critical patent/JPH0337308B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0655—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60181692A 1985-08-05 1985-08-21 集積回路パッケ−ジ Granted JPS6243155A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ
US06/890,533 US4729010A (en) 1985-08-05 1986-07-30 Integrated circuit package with low-thermal expansion lead pieces
EP86305894A EP0211618B1 (en) 1985-08-05 1986-07-31 Integrated circuit package
DE8686305894T DE3672709D1 (de) 1985-08-05 1986-07-31 Integrierte schaltungspackung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6243155A true JPS6243155A (ja) 1987-02-25
JPH0337308B2 JPH0337308B2 (enrdf_load_stackoverflow) 1991-06-05

Family

ID=16105199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60181692A Granted JPS6243155A (ja) 1985-08-05 1985-08-21 集積回路パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6243155A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (ja) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd 表面実装用半導体パッケージ
JPH03167850A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167859A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167852A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167858A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173156A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173164A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (ja) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd 表面実装用半導体パッケージ
JPH03167850A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167859A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167852A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03167858A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173156A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH03173164A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPH0337308B2 (enrdf_load_stackoverflow) 1991-06-05

Similar Documents

Publication Publication Date Title
US4764804A (en) Semiconductor device and process for producing the same
US4142203A (en) Method of assembling a hermetically sealed semiconductor unit
JPS6066843A (ja) 集積回路パツケ−ジ
JPH04162756A (ja) 半導体モジュール
JPH0129068B2 (enrdf_load_stackoverflow)
JPS6243155A (ja) 集積回路パッケ−ジ
JPH0117258B2 (enrdf_load_stackoverflow)
JPH05259201A (ja) 半導体装置及びその製造方法
JPH05326625A (ja) Ｌｓｉ実装構造
JP2005285885A (ja) 半導体装置
CN217691140U (zh) 一种提升散热性能的倒装氮化镓功率器件
JP2572092Y2 (ja) 半導体素子パッケージ
JPS61256746A (ja) 半導体装置
KR0168841B1 (ko) 금속전자 패키지 및 그 제조공정
JPH0794623A (ja) 回路基板
JPH02100346A (ja) 半導体装置用基板
JPS638621B2 (enrdf_load_stackoverflow)
JPH0661306A (ja) チップキャリアとその実装構造体
JPH0525182B2 (enrdf_load_stackoverflow)
JPS63215057A (ja) 半導体装置の製造方法
JPH0945804A (ja) 半導体パッケージ
JP3335657B2 (ja) 半導体パッケージ
JPS60202955A (ja) 半導体装置
JPH01220853A (ja) 混成集積回路
JPS6127641A (ja) 集積回路装置の製造方法