JPS6242273U - - Google Patents
Info
- Publication number
- JPS6242273U JPS6242273U JP13306485U JP13306485U JPS6242273U JP S6242273 U JPS6242273 U JP S6242273U JP 13306485 U JP13306485 U JP 13306485U JP 13306485 U JP13306485 U JP 13306485U JP S6242273 U JPS6242273 U JP S6242273U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- view
- heat
- surface mount
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13306485U JPS6242273U (fr) | 1985-09-02 | 1985-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13306485U JPS6242273U (fr) | 1985-09-02 | 1985-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242273U true JPS6242273U (fr) | 1987-03-13 |
Family
ID=31033035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13306485U Pending JPS6242273U (fr) | 1985-09-02 | 1985-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242273U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281463A (ja) * | 1988-09-16 | 1990-03-22 | Hitachi Ltd | 半導体装置の冷却実装構造 |
| JP2011155134A (ja) * | 2010-01-27 | 2011-08-11 | Mitsubishi Electric Corp | 電子回路基板 |
-
1985
- 1985-09-02 JP JP13306485U patent/JPS6242273U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281463A (ja) * | 1988-09-16 | 1990-03-22 | Hitachi Ltd | 半導体装置の冷却実装構造 |
| JP2011155134A (ja) * | 2010-01-27 | 2011-08-11 | Mitsubishi Electric Corp | 電子回路基板 |
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