JPS6242241U - - Google Patents
Info
- Publication number
- JPS6242241U JPS6242241U JP12186086U JP12186086U JPS6242241U JP S6242241 U JPS6242241 U JP S6242241U JP 12186086 U JP12186086 U JP 12186086U JP 12186086 U JP12186086 U JP 12186086U JP S6242241 U JPS6242241 U JP S6242241U
- Authority
- JP
- Japan
- Prior art keywords
- alignment pattern
- wiring layer
- semiconductor device
- pattern
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12186086U JPS6242241U (hu) | 1986-08-08 | 1986-08-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12186086U JPS6242241U (hu) | 1986-08-08 | 1986-08-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6242241U true JPS6242241U (hu) | 1987-03-13 |
Family
ID=31011517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12186086U Pending JPS6242241U (hu) | 1986-08-08 | 1986-08-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6242241U (hu) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006140535A (ja) * | 1999-01-08 | 2006-06-01 | Aisin Aw Co Ltd | 電子部品 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5237768A (en) * | 1975-09-19 | 1977-03-23 | Seiko Instr & Electronics Ltd | Substrate having positioning marks |
-
1986
- 1986-08-08 JP JP12186086U patent/JPS6242241U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5237768A (en) * | 1975-09-19 | 1977-03-23 | Seiko Instr & Electronics Ltd | Substrate having positioning marks |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006140535A (ja) * | 1999-01-08 | 2006-06-01 | Aisin Aw Co Ltd | 電子部品 |
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