JPS6241320B2 - - Google Patents
Info
- Publication number
- JPS6241320B2 JPS6241320B2 JP9056280A JP9056280A JPS6241320B2 JP S6241320 B2 JPS6241320 B2 JP S6241320B2 JP 9056280 A JP9056280 A JP 9056280A JP 9056280 A JP9056280 A JP 9056280A JP S6241320 B2 JPS6241320 B2 JP S6241320B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- wafer
- space chamber
- anode
- sealed space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 55
- 238000005192 partition Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 18
- 239000000126 substance Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 239000005373 porous glass Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9056280A JPS5716199A (en) | 1980-07-04 | 1980-07-04 | Plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9056280A JPS5716199A (en) | 1980-07-04 | 1980-07-04 | Plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5716199A JPS5716199A (en) | 1982-01-27 |
| JPS6241320B2 true JPS6241320B2 (ko) | 1987-09-02 |
Family
ID=14001857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9056280A Granted JPS5716199A (en) | 1980-07-04 | 1980-07-04 | Plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5716199A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61205129A (ja) * | 1985-03-08 | 1986-09-11 | 日本鋼管株式会社 | 塗装後光沢を有する電気鍍金鋼板 |
| JP2007119926A (ja) * | 2007-02-13 | 2007-05-17 | Ebara Corp | 基板メッキ装置 |
-
1980
- 1980-07-04 JP JP9056280A patent/JPS5716199A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5716199A (en) | 1982-01-27 |
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