JPS6240847B2 - - Google Patents

Info

Publication number
JPS6240847B2
JPS6240847B2 JP58229911A JP22991183A JPS6240847B2 JP S6240847 B2 JPS6240847 B2 JP S6240847B2 JP 58229911 A JP58229911 A JP 58229911A JP 22991183 A JP22991183 A JP 22991183A JP S6240847 B2 JPS6240847 B2 JP S6240847B2
Authority
JP
Japan
Prior art keywords
wafer
stage
rollers
orientation flat
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58229911A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59139626A (ja
Inventor
Atsushi Fujisawa
Kyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58229911A priority Critical patent/JPS59139626A/ja
Publication of JPS59139626A publication Critical patent/JPS59139626A/ja
Publication of JPS6240847B2 publication Critical patent/JPS6240847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58229911A 1983-12-07 1983-12-07 ウエ−ハの自動アライメント方法 Granted JPS59139626A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58229911A JPS59139626A (ja) 1983-12-07 1983-12-07 ウエ−ハの自動アライメント方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58229911A JPS59139626A (ja) 1983-12-07 1983-12-07 ウエ−ハの自動アライメント方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3613977A Division JPS53122369A (en) 1977-04-01 1977-04-01 Automatic alignment unit for wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63098112A Division JPS63296237A (ja) 1988-04-22 1988-04-22 ウエーハの自動アライメント方法

Publications (2)

Publication Number Publication Date
JPS59139626A JPS59139626A (ja) 1984-08-10
JPS6240847B2 true JPS6240847B2 (en:Method) 1987-08-31

Family

ID=16899665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58229911A Granted JPS59139626A (ja) 1983-12-07 1983-12-07 ウエ−ハの自動アライメント方法

Country Status (1)

Country Link
JP (1) JPS59139626A (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69832738T2 (de) 1997-09-12 2006-06-29 Honda Giken Kogyo K.K. Antriebsvorrichtung für Hybridfahrzeug

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1399371A (en) * 1972-03-15 1975-07-02 Int Computers Ltd Image display apparatus
JPS5081070A (en:Method) * 1973-11-15 1975-07-01

Also Published As

Publication number Publication date
JPS59139626A (ja) 1984-08-10

Similar Documents

Publication Publication Date Title
JP3245833B2 (ja) 半導体基板アライナー装置および方法
JPH06177229A (ja) 半導体ウェハの一致したジャムのない位置整合を行う方法および装置
CA2331079A1 (en) Method and device for changing a semiconductor wafer position
US7004716B2 (en) Device and method for aligning disk-shaped substrates
JP2571477B2 (ja) ウエーハのノッチ部面取り装置
JPH0225254B2 (en:Method)
JPH07114233B2 (ja) 基板の位置決め装置
JPH0334216B2 (en:Method)
JPS6240847B2 (en:Method)
JP3072484B2 (ja) ウエハ位置決め装置
JPS63296237A (ja) ウエーハの自動アライメント方法
CN216980525U (zh) 一种晶圆对准装置
JP2001124543A (ja) 薄板材の平坦度測定方法および装置
JP5115363B2 (ja) ウェハのアライメント装置、それを備えた搬送装置、半導体製造装置、および半導体ウェハのアライメント方法
JPH0249720Y2 (en:Method)
JP2020088071A (ja) ウエハ受け渡し装置
JP3137730B2 (ja) ウエハー側周面の鏡面面取り装置
JPH0817897A (ja) ウエハの位置合わせ及び半導体装置の製造方法
JP2607923B2 (ja) ウェハ・ハンドリングチャック構造
JP2002093857A (ja) 実装装置
JP2522252B2 (ja) 薄板基板の搬送装置
JP2629274B2 (ja) 半導体ウェーハのオリエンテーション・フラット合せ機
JPH079925B2 (ja) 基板の位置決め装置
JP3173153B2 (ja) リードのボンディング装置
GB2146557A (en) Centering device