JPS6239820B2 - - Google Patents

Info

Publication number
JPS6239820B2
JPS6239820B2 JP6431080A JP6431080A JPS6239820B2 JP S6239820 B2 JPS6239820 B2 JP S6239820B2 JP 6431080 A JP6431080 A JP 6431080A JP 6431080 A JP6431080 A JP 6431080A JP S6239820 B2 JPS6239820 B2 JP S6239820B2
Authority
JP
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6431080A
Other versions
JPS56158467A (en )
Inventor
Natsuo Tsubochi
Haruhiko Abe
Hirotsugu Harada
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16135Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
JP6431080A 1980-05-12 1980-05-12 Expired JPS6239820B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6431080A JPS6239820B2 (en) 1980-05-12 1980-05-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6431080A JPS6239820B2 (en) 1980-05-12 1980-05-12

Publications (2)

Publication Number Publication Date
JPS56158467A true JPS56158467A (en) 1981-12-07
JPS6239820B2 true JPS6239820B2 (en) 1987-08-25

Family

ID=13254530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6431080A Expired JPS6239820B2 (en) 1980-05-12 1980-05-12

Country Status (1)

Country Link
JP (1) JPS6239820B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988864A (en) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
US6682954B1 (en) 1996-05-29 2004-01-27 Micron Technology, Inc. Method for employing piggyback multiple die #3
US6208018B1 (en) 1997-05-29 2001-03-27 Micron Technology, Inc. Piggyback multiple dice assembly
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date Type
JPS56158467A (en) 1981-12-07 application

Similar Documents

Publication Publication Date Title
DE3001563C2 (en)
DE3000532C2 (en)
DE3001652C2 (en)
DE3001744C2 (en)
DE3000352C2 (en)
DE3001907C2 (en)
DE3000288C2 (en)
DE3001436C2 (en)
DE3001565C2 (en)
DE3000852C2 (en)
DE3000305C2 (en)
DE3000155C2 (en)
DE3002482C2 (en)
DE3002229C2 (en)
DE3001626C2 (en)
DE3002209C2 (en)
DE3002216C2 (en)
DE3001468C2 (en)
DE3002101C2 (en)