JPS6239097A - Manufacture of metal based printed wiring board - Google Patents
Manufacture of metal based printed wiring boardInfo
- Publication number
- JPS6239097A JPS6239097A JP17882585A JP17882585A JPS6239097A JP S6239097 A JPS6239097 A JP S6239097A JP 17882585 A JP17882585 A JP 17882585A JP 17882585 A JP17882585 A JP 17882585A JP S6239097 A JPS6239097 A JP S6239097A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- drill
- misalignment
- wiring board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[技術分野]
本発明は、金属基板をベースにしたプリント配線板の製
造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a printed wiring board based on a metal substrate.
[背景技術]
金属をベースにしたプリント配線板は、ベース金属の高
い熱伝導性によって放熱性が優れ、搭載される電子部品
の発熱を良好に放熱することができるため、電子部品の
烏密度搭載に対応して盛んに用いられるようになってき
ている。そしてこの金属ベースプリント配線板を製造す
るにあたって、ベース金属とプリント回路やスルーホー
ル回路との電気絶縁を確保するために、特殊な製造方法
が採用されることになる。[Background technology] Metal-based printed wiring boards have excellent heat dissipation properties due to the high thermal conductivity of the base metal, and can effectively dissipate the heat generated by the electronic components mounted on them. It has come to be widely used in response to the In manufacturing this metal-based printed wiring board, a special manufacturing method is adopted to ensure electrical insulation between the base metal and the printed circuit or through-hole circuit.
すなわち第5図(a)のように金属基板1にスルーホー
ル形成用貫通孔2,2・・・を穿設しておいて、この金
属基板1の表面にプリプレグ4を介して銅箔などの金属
箔5を重ね、加熱加圧成形する。プリプレグ4はガラス
布などを基材としてこれにエポキシ樹脂やフェノール樹
脂など熱硬化性樹脂のフェスを含浸させて加熱乾燥する
ことによって得ることができる。そしてこのように加熱
加圧成形をおこなうことによって、プリプレグ4が硬化
することによって形成される絶縁接着7P!6によって
金属基板1に金属箔5を積層すると共にプリプレグ4か
らにじみ出る樹@1をスルーホール形成用貫通孔2,2
・・・に充填させる。このようにして第5図(b)のよ
うな配a基板8を作成する0次いでこの配線基板8にお
いて、各スルーホール形成用貫通孔2内の樹脂7にドリ
ル加工でスルーホール9を設ける。第5図(c)のよう
にスルーホール9はその内径をスルーホール形成用貫通
孔2の内径よりも小さく設定されるもので、スルーホー
ル形成用貫通孔2の内周面は樹脂7で被覆された状態に
ある。そして常法に従ってプリント配線加工で金iMs
をエツチング処理して回路パターン16を形成させると
共にスルーホールメッキによってスルーホール9の内周
に金属のメッキ層17を第5図(d)のように形成させ
る。このものにおいては回路パターン16は絶縁接着層
6によって金属基板1との間の絶縁が確保されると共に
スルーホール9のメッキ)vll 7は樹脂7によって
金属基板1との間の絶縁が確保されることになる。さら
にツルグーレノストやシンボルマークを印刷したりして
製品としてのプリント配線板を得ることができるのであ
る。That is, as shown in FIG. 5(a), through-holes 2, 2, etc. are formed in the metal substrate 1, and copper foil or the like is formed on the surface of the metal substrate 1 through the prepreg 4. The metal foils 5 are overlapped and heated and press-molded. The prepreg 4 can be obtained by using glass cloth as a base material, impregnating it with a face of thermosetting resin such as epoxy resin or phenol resin, and heating and drying it. By performing heating and pressure molding in this manner, the prepreg 4 is cured to form an insulating adhesive 7P! 6, the metal foil 5 is laminated on the metal substrate 1, and the wood @1 exuding from the prepreg 4 is connected to the through holes 2, 2 for forming through holes.
... to be filled. In this way, a wiring board 8 as shown in FIG. 5(b) is created.Next, in this wiring board 8, through holes 9 are formed by drilling in the resin 7 in each of the through holes 2 for forming through holes. As shown in FIG. 5(c), the inner diameter of the through hole 9 is set smaller than the inner diameter of the through hole 2 for through hole formation, and the inner peripheral surface of the through hole 2 for through hole formation is covered with resin 7. is in a state of being Then, gold iMs are printed wiring according to the usual method.
A circuit pattern 16 is formed by etching, and a metal plating layer 17 is formed on the inner periphery of the through hole 9 by through hole plating as shown in FIG. 5(d). In this case, the insulation between the circuit pattern 16 and the metal substrate 1 is ensured by the insulating adhesive layer 6, and the insulation between the plating of the through hole 9) and the metal substrate 1 is ensured by the resin 7. It turns out. Furthermore, it is possible to obtain a printed wiring board as a product by printing a Tsurugurenost or a symbol mark.
そしてこのようにプリント配線板を製造するにあたって
、上記のようにスルーホール9のメッキ層17と金属基
板1との間の絶縁性はスルーホール形成用貫通孔2の内
周の樹脂7によって確保されるものであるため、スルー
ホール9はスルーホール形成用貫通孔2の中央に設ける
ようにする必要がある。そして樹脂7は金属基板1に比
較して透明性を帝でいるために目視または尤をがざした
状態での目視等によってスルーホール形成用貫通孔2内
におけるスルーホール9の位置を確認することができる
ことになるが、スルーホール9の部分においては表面が
金属?i 5や回路パターン16で覆われていると共に
スルーホール9の内面はメッキ層17で覆われており、
スルーホール形成用貫通孔2内におけるスルーホール9
の位置を確認することはできない。従ってスルーホール
9を加工する際のドリルの位置ずれでスルーホール9の
中心とスルーホール形成用貫通孔2の中心とが大きくず
れて、スルーホール9の内面のメッキ層17とスルーホ
ール形成用貫通孔2内周の間において樹脂7の厚みが非
常に薄い部分が生じ、スルーホール9のメッキ層17と
金属基板1との間の電気絶縁が十分でない場合において
もこれを確認することができず、不良品のまま出荷して
しまうおそれがあるという問題を有するものであった。In manufacturing the printed wiring board in this way, insulation between the plating layer 17 of the through hole 9 and the metal substrate 1 is ensured by the resin 7 on the inner periphery of the through hole 2 for through hole formation as described above. Therefore, the through hole 9 must be provided at the center of the through hole 2 for through hole formation. Since the resin 7 has higher transparency than the metal substrate 1, the position of the through hole 9 in the through hole 2 for forming the through hole can be confirmed by visual inspection or by visual inspection with the head held up. However, is the surface of through hole 9 made of metal? i 5 and the circuit pattern 16, and the inner surface of the through hole 9 is covered with a plating layer 17.
Through hole 9 in through hole 2 for through hole formation
It is not possible to confirm the location of Therefore, due to misalignment of the drill when processing the through hole 9, the center of the through hole 9 and the center of the through hole 2 for forming the through hole are largely deviated, and the plating layer 17 on the inner surface of the through hole 9 and the center of the through hole 2 for forming the through hole are There is a part where the thickness of the resin 7 is very thin between the inner periphery of the hole 2, and this cannot be confirmed even if the electrical insulation between the plating layer 17 of the through hole 9 and the metal substrate 1 is insufficient. However, there was a problem in that there was a risk that the product would be shipped as a defective product.
[発明の目的]
本発明は、上記の点に鑑みて為されたものであす、スル
ーホール形成用貫通孔とスルーホールとの位置ずれの確
認を簡単におこなうことができる金属ベースプリント配
線板の製造方法を提供することを目的とするものである
。[Object of the Invention] The present invention has been made in view of the above points, and provides a metal-based printed wiring board that allows easy confirmation of misalignment between through-holes and through-holes. The purpose is to provide a manufacturing method.
[発明の開示]
しかして本発明に係る金属ベースプリント配線板の製造
方法は、金属基板1にスルーホール形成用貫通孔2とド
リルずれ検出用貫通孔3をそれぐれ設け、この金属基板
1の表面に絶縁接着層6を介して金属?i!F5を積層
すると共にスルーホール形成用貫通孔2とドリルずれ位
置検出用具通孔3に樹脂7を充填させて配線基板8を作
成し、スルーホール形成用貫通孔2の位置とドリルずれ
検出用貫通孔3の位置とにおいて配線基板8にそれぞれ
スルーホール形成用貫通孔2の径やドリルずれ検出用貫
通孔3の径よりも径の小さなスルーホール9とドリルず
れ検出孔10とを各々相対的位置関係を保ってドリル加
工で穿孔し、この配線基板8にプリント配線加工を施す
と共にドリルずれ検出用貫通孔3部分における金属箔5
を除去することを特徴とするものであり、金属箔5を除
去した状態でドリルずれ検出用貫通孔3とドリルずれ検
出孔10との位置関係を確認することで、この位置関係
からスルーホール形成用貫通孔2とスルーホール9との
位置関係を推定することができるようにし、もって上記
目的を達成したものであって、以下本発明を実施例によ
り詳述する。[Disclosure of the Invention] According to the method for manufacturing a metal-based printed wiring board according to the present invention, a through-hole 2 for through-hole formation and a through-hole 3 for detecting drill misalignment are provided in a metal substrate 1, and Metal with insulating adhesive layer 6 on the surface? i! A wiring board 8 is created by laminating F5 and filling resin 7 into the through-hole 2 for through-hole formation and the hole 3 for detecting drill deviation position, and the position of the through-hole 2 for through-hole formation and the penetration for detecting drill deviation are filled. At the position of the hole 3, a through hole 9 and a drill deviation detection hole 10 each having a smaller diameter than the diameter of the through hole 2 for through hole formation and the diameter of the drill deviation detection hole 3 are placed in the wiring board 8 at relative positions. A hole is drilled while maintaining the relationship, and a printed wiring process is performed on this wiring board 8. At the same time, the metal foil 5 is formed in the 3 portion of the through hole for detecting drill misalignment.
By checking the positional relationship between the drill deviation detection through hole 3 and the drill deviation detection hole 10 with the metal foil 5 removed, the through hole can be formed based on this positional relationship. The present invention will now be described in detail with reference to examples.
金属基板1は鋼板、鉄板、銅板、アルミニウム板などで
形成されるもので、第1図に示すようにプリント配線板
製品におけるスルーホール9の位置に対応して金属基板
1にスルーホール形成用貫通孔2.2・・・が穿設して
あり、また金属基板1にはスルーホール形成用貫通孔2
の外側位置においてドリルずれ検出用貫通孔3が穿設し
である。ドリルずれ検出用貫通孔3の内径やスルーホー
ル形成用貫通孔2の内径よりも若モ大きな寸法に設定し
である。そして第2図(、)において説明したと同様に
してこの金属基板1の表裏面にプリプレグ4を介して銅
箔やアルミニウム箔などの−に属箔5を重ね、加熱加圧
成形することによって、プリプレグ4中の樹脂の硬化で
形成される絶縁接着層6によって金属基板1に金属箔5
を積層すると共にプリプレグ4からにじみ出る樹脂7を
スルーホール形成用貫通孔2,2・・・及びドリルずれ
検出用貫通孔3に充填させる。このようにして第1図(
b)に示すような配線基板8を作成する。ここでスルー
ホール形成用貫通孔2やドリルずれ検出用貫通孔3に樹
脂7を充填させるにあたって、これら貫通孔2,3に樹
脂7を完全に充填させる必要はなく、少なくとも貫通孔
2,3の内周が樹脂7で完全に被覆されればよい。The metal substrate 1 is made of a steel plate, an iron plate, a copper plate, an aluminum plate, etc., and as shown in FIG. Holes 2.2... are bored, and the metal substrate 1 has through holes 2 for forming through holes.
A through hole 3 for detecting drill deviation is bored at an outer position of the drill. The dimensions are set to be slightly larger than the inner diameter of the drill misalignment detection through hole 3 and the inner diameter of the through hole forming through hole 2. Then, in the same manner as explained in FIG. 2(,), metallic foil 5 such as copper foil or aluminum foil is placed on the front and back surfaces of this metal substrate 1 via prepreg 4, and heated and press-formed. The metal foil 5 is attached to the metal substrate 1 by the insulating adhesive layer 6 formed by curing the resin in the prepreg 4.
At the same time, the resin 7 exuding from the prepreg 4 is filled into the through-holes 2, 2, . . . and the through-holes 3 for detecting drill deviation. In this way, Figure 1 (
A wiring board 8 as shown in b) is created. Here, when filling the resin 7 into the through-hole forming through-hole 2 and the drill misalignment detection through-hole 3, it is not necessary to completely fill the through-holes 2 and 3 with the resin 7. It is sufficient that the inner periphery is completely covered with the resin 7.
次ぎにドリル加工によって、スルーホール形成用貫通孔
2.2・・・において樹脂7にスルーホール9を貫通形
成すると同時にドリルずれ検出用貫通孔3において樹脂
7にドリルずれ検出孔10を貫通形成する。このドリル
加工は、スルーホール形成用貫通孔2,2・・・の各々
の中心の位置やドリルずれ検出用貫通孔3の中心の位置
のそれぞれの相対的位置関係をx)!A標とY座標とに
とり、このX−Yffl[に適合するようにドリルビッ
トを逐次移動させるよう数値制御(NC制御)などによ
って制御されるドリル装置を用いて、おこなうことがで
きる。すなわち、例えば最初にドリルずれ検出用貫通孔
3にドリルビットでドリルずれ検出孔10を穿孔すると
すると、これを基準にしてスルーホール形成用貫通孔2
,2・・・の各々の中心の位置やドリルずれ検出用貫通
孔3の中心の位置のそれぞれの相対的位置関係に適合さ
せて順次スルーホール形成用貫通孔2にスルーホール9
をドリルビットで穿孔していくようにするものである。Next, by drilling, through-holes 9 are formed through the resin 7 at the through-hole forming through-holes 2, 2, and at the same time, drill-misalignment detection holes 10 are formed through the resin 7 at the through-holes 3 for detecting drill deviation. . This drilling process determines the relative positional relationship between the center positions of the through-hole forming through-holes 2, 2... and the center position of the drill misalignment detection through-hole 3 (x)! This can be done using a drill device controlled by numerical control (NC control) or the like to sequentially move the drill bit to match the A mark and the Y coordinate. That is, for example, if a drill misalignment detection hole 10 is first drilled in the drill misalignment detection through hole 3 with a drill bit, then the through hole forming through hole 2 is drilled with a drill bit as a reference.
, 2... and the center position of the drill misalignment detection through hole 3, the through hole 9 is sequentially inserted into the through hole 2 for through hole formation.
This is done by drilling holes with a drill bit.
従って、最初のドリルずれ検出用貫通孔3に設けたドリ
ルずれ検出孔10の中心がドリルずれ検出用貫通孔3の
中心と一致すれば総てのスルーホール形成用貫通孔2に
設けるスルーホール9はその中心がスルーホール形成用
貫通孔2の中心に一致することになる。そして逆に最初
のドリルずれ検出用貫通孔3に設けたドリルずれ検出孔
10の中心かにリルずれ検出用貫通孔3の中心からずれ
ると総てのスルーホール形成用貫通孔2に設けるスルー
ホール9も第1図(C)や第2図(a)のようにその中
心がスルーホール形成用貫通孔2の中心がらずれること
になる。しかしながらこのようにスルーホール9の中心
がスルーホール検出用jt 通孔3の中心とずれていて
も、配線基板8の表面は金属M1によって覆われている
ので、このままではこの位置ずれを検出することはでき
ない。Therefore, if the center of the drill deviation detection hole 10 provided in the first drill deviation detection through hole 3 coincides with the center of the drill deviation detection through hole 3, the through holes 9 provided in all the through hole forming through holes 2 are aligned. The center thereof coincides with the center of the through hole 2 for through hole formation. Conversely, if the center of the drill deviation detection hole 10 provided in the first drill deviation detection through hole 3 deviates from the center of the drill deviation detection through hole 3, the through holes provided in all through hole forming through holes 2 As shown in FIG. 1(C) and FIG. 2(a), the center of the hole 9 is also shifted from the center of the through hole 2 for forming a through hole. However, even if the center of the through hole 9 is shifted from the center of the through hole 3 for through hole detection, the surface of the wiring board 8 is covered with the metal M1, so this positional shift cannot be detected as it is. I can't.
次ぎにこのようにしてスルーホール9,9・・・を設け
た配線基板8をプリント配線加工し、金属箔5をエツチ
ング処理等することによって回路パターン16を形成す
ると共にスルーホール9に金属メッキ処理することによ
ってメッキ層17を形成し、第1図(d)のようにプリ
ント配線板Aを作成するのである。またこの金属箔5の
エツチングの際にドリルずれ検出用貫通孔3の部分にお
ける少なくとも片面の金属箔5も除去して露出させる9
このように金14箔5を除去することによって、ドリル
ずれ検出用貫通孔3の部分における樹脂7は露出され、
不透明の金属基板1と4を属基板1よりも透明性を帯び
る樹N7との対比によって、第3図に示すようにドリル
ずれ検出用貫通孔3とドリルずれ検出孔10との位置関
係を目視等によって確認することができる。従ってドリ
ルずれ検出用貫通孔3の中心とドリルずれ検出孔10の
中心とが大きくずれておればスルーホール形成用貫通孔
2の中心とスルーホール9の中心も大きくずれているこ
とになり、スルーホール9におけるスルーホール形成用
貫通孔2の内周の樹脂7に薄い部分があってスルーホー
ル9のメッキ7@17と金属基板1との開の絶縁が不十
分なものを不良品としはねることができることになる。Next, the wiring board 8 provided with the through holes 9, 9, . By doing so, a plating layer 17 is formed, and a printed wiring board A is produced as shown in FIG. 1(d). Also, when etching the metal foil 5, at least one side of the metal foil 5 in the area of the drill misalignment detection through hole 3 is also removed and exposed 9.
By removing the gold 14 foil 5 in this way, the resin 7 in the portion of the through hole 3 for detecting drill deviation is exposed,
By comparing the opaque metal substrates 1 and 4 with the tree N7, which is more transparent than the metal substrate 1, the positional relationship between the drill misalignment detection through hole 3 and the drill misalignment detection hole 10 is visually observed as shown in FIG. It can be confirmed by etc. Therefore, if the center of the drill misalignment detection through hole 3 and the center of the drill misalignment detection hole 10 are greatly misaligned, the center of the through hole forming through hole 2 and the center of the through hole 9 are also greatly misaligned. To reject as a defective product if there is a thin part in the resin 7 on the inner periphery of the through hole 2 for through hole formation in the hole 9 and the insulation between the plating 7 @ 17 of the through hole 9 and the metal substrate 1 is insufficient. will be possible.
尚、ドリルずれ検出用貫通孔3の部分における金jK
M 5の除去を第1図(C)のスルーホール9やドリル
ずれ検出孔1oの形成の直後におこなうようにしてもよ
く、このようにすれば配線基板1へのプリント配線加工
をおこなう前にスルーホール9の形成不良を発見するこ
とができ、無駄なプリント配線加工をおこなわずに済む
ことになる。In addition, gold jK in the part of the through hole 3 for detecting drill deviation.
M5 may be removed immediately after forming the through hole 9 and drill misalignment detection hole 1o in FIG. A defective formation of the through hole 9 can be detected, and unnecessary printed wiring processing can be avoided.
また、第4図に示すようにドリルずれ検出用貫通孔3の
直径a、とドリルずれ検出孔の直径す、との差の寸法(
a、−b、)と、スルーホール形成用貫通孔2の直径a
2とスルーホール9の直径b2との差の寸法(a2
b2)とを等しく設定しておくことによって、ドリルず
れ検出用貫通孔3の中心とドリルずれ検出孔10の中心
とのずれによってドリルずれ検出用貫通孔3の内周で肉
厚の薄くなる部分の樹脂7の厚み寸法t1を、スルーホ
ール形成用貫通孔2の中心とスルーホール9の中心との
ずれによってスルーホール形成用貫通孔2の内周での肉
厚の薄くなる部分の樹脂7の寸法t2と等しくすること
ができ、ドリルずれ検出用貫通孔3におけるtlの測定
によってスルーホール形成用貫通孔2におけるt2を知
ることができることになり、スルーホール9のドリル加
工状況を把握すうろことができることになる。例えばド
リルずれ検出用貫通孔3の直径1、=3,775mm、
スルーホール形成用貫通孔2の直径a2= 1 、5
mmとし、ドリルずれ検出孔10の直径す、=3,17
5mar、スルーホール9の直径b2= 0 、9 m
mに設定した場合において、ドリルずれ検出用貫通孔3
の中心とドリルずれ検出孔10の中心とのずれによって
ドリルずれ検出用貫通孔3の内周で肉厚の薄くなる部分
の樹脂7の厚み寸法り、が0.11であると、スルーホ
ール形成用貫通孔2の中心とスルーホール9の中心との
ずれによってスルーホール形成用貫通孔2の内周での肉
厚の薄くなる部分の樹脂7の寸法t2も0 、1 mm
となものである。In addition, as shown in FIG. 4, the difference between the diameter a of the drill misalignment detection through hole 3 and the diameter
a, -b,) and the diameter a of the through hole 2 for through hole formation.
2 and the diameter b2 of the through hole 9 (a2
By setting b2) equally, a portion where the wall thickness becomes thinner on the inner periphery of the drill misalignment detection through hole 3 due to the deviation between the center of the drill misalignment detection through hole 3 and the center of the drill misalignment detection hole 10. The thickness dimension t1 of the resin 7 is determined by determining the thickness dimension t1 of the resin 7 at the part where the wall thickness becomes thinner on the inner periphery of the through-hole forming through-hole 2 due to the deviation between the center of the through-hole forming through-hole 2 and the center of the through-hole 9. The dimension t2 can be made equal to the dimension t2, and by measuring tl in the drill misalignment detection through hole 3, it is possible to know the t2 in the through hole forming through hole 2, and it is possible to understand the drilling status of the through hole 9. will be possible. For example, the diameter of the drill misalignment detection through hole 3 is 1, = 3,775 mm,
Diameter a2 of through hole 2 for forming through hole = 1, 5
mm, and the diameter of the drill deviation detection hole 10 is = 3,17
5mar, diameter b2 of through hole 9 = 0, 9 m
When set to m, drill misalignment detection through hole 3
If the thickness of the resin 7 is 0.11 at the part where the wall thickness becomes thinner on the inner periphery of the drill misalignment detection through hole 3 due to the misalignment between the center of the drill misalignment detection hole 10 and the center of the drill misalignment detection hole 10, the through hole is formed. Due to the misalignment between the center of the through hole 2 and the center of the through hole 9, the thickness t2 of the resin 7 at the inner periphery of the through hole 2 is also 0.1 mm.
That's what it is.
[発明の効果]
上述のように本発明にあっては、金属基板にスルーホー
ル形成用貫通孔とドリルずれ検出用貫通孔をそれぞれ設
け、この金属基板の表面に絶縁接着層を介して−に属箔
を積層すると共にスルーホール形成用貫通孔とドリルず
れ位置検出用貫通孔に樹脂を充填させて配線基板を作成
し、スルーホール形成用貫通孔の位置とドリルずれ検出
用貫通孔の位置とにおいて配線基板にそれぞれスルーホ
ール形成用貫通孔の径やドリルずれ検出用貫通孔の径よ
りも径の小さなスルーホールとドリルずれ検出孔とを各
々相対的位置関係を保ってドリル加工で穿孔し、この配
線基板にプリント配線加工を施すと共にドリルずれ検出
用貫通孔部分における金属箔を除去するようにしたので
、スルーホールの中心がスルーホール形成用貫通孔の中
心に対してずれている場合にはドリルずれ検出孔の中心
もドリルずれ検出用貫通孔の中心がらずれることになり
、このドリルずれ検出孔とドリルずれ検出用貫通孔との
ずれはドリルずれ検出用貫通孔部分の金属基の除去によ
って確認することができるものであって、ドリルずれ検
出孔とドリルずれ検出用貫通孔とのずれの確認によって
スルーホールとスルーホール形成用貫通孔とのずれを検
知して不良品を出荷してしまうようなことを防止するこ
とができるものである。[Effects of the Invention] As described above, in the present invention, a through hole for forming a through hole and a through hole for detecting drill deviation are provided in a metal substrate, and a - A wiring board is created by laminating metal foils and filling the through holes for forming through holes and the through holes for detecting drill misalignment position with resin, and the positions of the through holes for forming through holes and the positions of the through holes for detecting drill misalignment are determined. In the wiring board, a through hole and a drill deviation detection hole each having a diameter smaller than the diameter of the through hole for through hole formation and the diameter of the drill deviation detection through hole are drilled while maintaining the relative positional relationship, We printed wiring on this wiring board and removed the metal foil in the through hole for detecting drill misalignment, so if the center of the through hole is shifted from the center of the through hole for through hole formation, The center of the drill misalignment detection hole also shifts from the center of the drill misalignment detection through hole, and the misalignment between the drill misalignment detection hole and the drill misalignment detection through hole is caused by the removal of the metal base in the drill misalignment detection through hole. By checking the misalignment between the drill misalignment detection hole and the through hole for detecting drill misalignment, the misalignment between the through hole and the through hole for through hole formation is detected and a defective product is shipped. This can prevent such things.
第1図(、)乃至(d)は本発明の一実施例における各
工程の断面図、第2図は第1図(c)における一部の平
面図、第3図は第1図(d)における一部の拡大平面図
、第4図(a)(b)は本発明の他の実施例の一部の拡
大断面図と拡大平断面図、第5図(a)乃至(d)は金
属ベースプリント配線板の製造を示す各工程の一部の断
面図である。
1は金属基板、2はスルーホール形成用貫通孔、3はド
リルずれ検出用貫通孔、4はプリプレグ、5は金属箔、
6は絶縁接着層、7は樹脂、8は配線基板、9はスルー
ホール、10はドリルずれ検出孔である。Figures 1 (, ) to (d) are cross-sectional views of each step in an embodiment of the present invention, Figure 2 is a plan view of a portion of Figure 1 (c), and Figure 3 is Figure 1 (d). ), FIGS. 4(a) and 4(b) are an enlarged sectional view and an enlarged plane sectional view of a part of another embodiment of the present invention, and FIGS. 5(a) to (d) are FIG. 3 is a cross-sectional view of a part of each process showing manufacturing of a metal-based printed wiring board. 1 is a metal substrate, 2 is a through hole for forming a through hole, 3 is a through hole for detecting drill misalignment, 4 is a prepreg, 5 is a metal foil,
6 is an insulating adhesive layer, 7 is a resin, 8 is a wiring board, 9 is a through hole, and 10 is a drill displacement detection hole.
Claims (1)
れ検出用貫通孔をそれぞれ設け、この金属基板の表面に
絶縁接着層を介して金属箔を積層すると共にスルーホー
ル形成用貫通孔とドリルずれ位置検出用貫通孔に樹脂を
充填させて配線基板を作成し、スルーホール形成用貫通
孔の位置とドリルずれ検出用貫通孔の位置とにおいて配
線基板にそれぞれスルーホール形成用貫通孔の径やドリ
ルずれ検出用貫通孔の径よりも径の小さなスルーホール
とドリルずれ検出孔とを各々相対的位置関係を保ってド
リル加工で穿孔し、この配線基板にプリント配線加工を
施すと共にドリルずれ検出用貫通孔部分における金属箔
を除去することを特徴とする金属ベースプリント配線板
の製造方法。(1) A through-hole for through-hole formation and a through-hole for detecting drill misalignment are provided on a metal substrate, and metal foil is laminated on the surface of this metal substrate via an insulating adhesive layer, and the through-hole for through-hole formation and drill misalignment are laminated on the surface of the metal substrate. A wiring board is created by filling the through holes for position detection with resin, and the diameter of the through hole for through hole formation and the drill are set on the wiring board at the position of the through hole for through hole formation and the position of the through hole for detecting drill deviation. A through-hole with a diameter smaller than that of the through-hole for misalignment detection and a drill misalignment detection hole are drilled while maintaining their relative positional relationship, and printed wiring processing is performed on this wiring board, and the drill misalignment detection through-hole is drilled. A method for manufacturing a metal-based printed wiring board, comprising removing metal foil in hole portions.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17882585A JPS6239097A (en) | 1985-08-14 | 1985-08-14 | Manufacture of metal based printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17882585A JPS6239097A (en) | 1985-08-14 | 1985-08-14 | Manufacture of metal based printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6239097A true JPS6239097A (en) | 1987-02-20 |
Family
ID=16055321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17882585A Pending JPS6239097A (en) | 1985-08-14 | 1985-08-14 | Manufacture of metal based printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6239097A (en) |
-
1985
- 1985-08-14 JP JP17882585A patent/JPS6239097A/en active Pending
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